Claims:1. A thermal management device (100) comprising:
a housing (101) enclosing a fan assembly (102), the housing (101) comprising one or more inlet ducts (114) and one or more outlet ducts (308, 309, 310),
a distribution means (103, 104, 105) fluidly engaged with each of the one or more outlet ducts of the housing (101) at a first end (103a) for air distribution;
a receptacle (106, 107, 108) removably attached to a second end (103b) of the distribution means (103, 104, 105), engaged with the each of the one or more outlet ducts (308, 309, 310), for disposing air towards an electronic component (201, 202, 203) engaged with the receptacle (106, 107, 108).
2. The thermal management device (100) of claim 1, wherein the fan assembly (102) comprises a cooling fan (305) and a motor drive (304) to enable the cooling fan (305) to force air for cooling the electronic component (201, 202, 203) engaged with the receptacle (106, 107, 108).
3. The thermal management device (100) of claim 1, wherein the housing (101) comprises:
a bottom cover (311) with a receiving region (312) defined by peripheral walls (306) to accommodate the fan assembly (102), and
a top cover (302) configured to be removably attached to the peripheral walls (306) of the bottom cover (311) to encapsulate the fan assembly (102) in a space between the top cover (302) and the bottom cover (311).
4. The thermal management device (100) of claim 3, wherein the housing (101) further comprises a clamping member (301) removably attached to the top cover (302) to arrest the movement of the fan assembly (102) within the space between the top cover (302) and the bottom cover (311).
5. The thermal management device (100) of claim 1, wherein the peripheral walls (306) of the bottom cover (311) comprise one or more openings that form the one or more outlet ducts (308, 309, 310) of the housing (101).
6. The thermal management device (100) of claim 1, wherein the thermal management device (100) further comprises one or more throttle valves (111, 112, 113) positioned at a predefined location along length of the distribution means (103, 104, 105).
7. The thermal management device (100) of claim 6, wherein each of the one or more throttle valves (111, 112,113) is actuated by a controller based on a temperature of the electronic component (201, 202, 203).
8. The thermal management device (100) of claim 1, where the receptacle (106, 107, 108) comprises a plurality of air splitters (402) for directing the air towards the electronic component (201, 202, 203).
9. The thermal management device (100) of claim 1, wherein the distribution means (103, 104, 105) engaged with the each of the one or more outlet ducts (308, 309, 310) discharges equal amount of air towards the electronic component (201, 202, 203) engaged with the receptacle (106, 107, 108).
10. The thermal management device (100) of claim 9, wherein one or more throttle valves (111, 112, 113) in the distribution means (103, 104, 105) engaged with the each of the one or more outlet ducts (308, 309, 310) is regulated to discharge the required amount of air towards the electronic component (201, 202, 203) engaged with the receptacle (106, 107, 108).
11. The thermal management device (100) of claim 1, wherein the one or more outlet ducts (308, 309, 310) are on one of same side of the housing (101) and different sides of the housing (101).
12. The thermal management device (100) of claim 1, wherein the distribution means (103, 104, 105) is one of rigid and flexible.
13. The thermal management device (100) of claim 1, wherein the receptacle (106, 107, 108) engages to a mounting provision on an external surface of the electronic component (201, 202, 203) to reduce the temperature of the electronic component (201, 202, 203).
14. The thermal management device (100) of claim 1, wherein the fan assembly (102) is operated by a controller based on a temperature of the electronic component (201, 202, 203) engaged with the receptacle (106, 107, 108). , Description:TECHNICAL FIELD
[0001] The present subject matter relates to a thermal management device. More particularly and not exclusively, it pertains to heat dissipation in electronic components using the thermal management device.

BACKGROUND
[0002] In recent years, processor based systems and computer systems have found widespread application in any engineering domain. The processor based systems are temperature sensitive and perform their intended function only when the temperature of the system is within the optimal operating range. To maintain acceptable operating temperatures, the processor based systems utilize a variety of thermal management devices.
[0003] In the case of automotive industry, electric power train in electric vehicles and hybrid electric vehicles also requires thermal management for its efficient functioning. The components of the electric drive train, such as, the energy storage device, the on-board charger, the motor, the controller, etc., during the normal operation and/or prolonged operation tend to get heated up and may fail to function after a certain number of use cycles causing discomfort to the rider of the vehicle. Sometimes, the continuous heating up may also lead to fire propagation in the electric drive train, leading to a catastrophic failure of the electric drive train and the vehicle.
[0004] Thus, there is a need to effectively dissipate the generated heat in the components and efficiently cool the components for good performance and longevity as well as to arrest propagation of fire, if any, for the safety of a product employing the components, such as, the vehicle.

BRIEF DESCRIPTION OF DRAWINGS
[0005] The detailed description is described with reference to the accompanying figures. The same numbers are used throughout the drawings to reference like features and components.
[0006] Fig. 1 exemplarily illustrates a perspective view of a thermal management device in an application, as per an embodiment of the present invention;
[0007] Fig. 2 exemplarily illustrates a perspective view of the thermal management device engaged with multiple electronic components;
[0008] Fig. 3 exemplarily illustrates an exploded view of the housing of the thermal management device;
[0009] Fig. 4 exemplarily illustrates a bottom perspective view of the distribution means with the receptacle at the second end; and
[00010] Fig. 5 exemplarily illustrates a perspective view of an attachment clip.

DETAILED DESCRIPTION OF THE INVENTION
[00011] In the energy storage device, such as, the Lithium ion battery, the electrochemical reactions to generate the voltage and the current are highly exothermic and the lithium ion battery tends to heat up during the course of normal operation. The increased temperature of the lithium ion battery degrades the electrical performance and may lead to catastrophic failure of the energy storage device.
[00012] The energy storage device requires cooling for continuous performance and durability with good health. Also, the range of the vehicle reduces due to temperature rise of the energy storage device. There is also a probability of thermal runaway in the energy storage device, which may result in propagation of blasting of cells of the energy storage device. Further, charging immediately after riding/driving the vehicle may not be possible due to temperature rise in the battery module even by using fast charging chargers.
[00013] In case of on-board charger, the controllers and the electronic components within an enclosure dissipate heat during operation thereby increasing the body temperature. Beyond the predefined operating temperatures, these electronic components fail to function and misbehave. The erratic functioning of these critical components of the drive train leaves the vehicle unsafe to drive and ultimately, can lead to a catastrophe.
[00014] Each of the components of the drive train employs a variety of cooling systems to maintain the components at acceptable operating temperatures. For example, in one implementation for cooling of the energy storage device, a heat exchange member in thermal contact with the casing of the energy storage device is used and forced convection is employed. Another existing implementation employs liquid cooling for thermal management in the energy storage device. The energy storage device as a whole may be immersed into a liquid coolant. However, the liquid coolant is stagnant and efficiency of cooling of the energy storage device is substantially less. Another implementation of the energy storage device involves employing coolant tubes for a liquid coolant designed around individual battery cells or a cluster of battery cells in the energy storage device. However, insertion of modular coolant tubes within the casing of the energy storage devices makes the energy storage device bulky and no longer compact for space-constrained varied applications. Further, such an insert with coolant channels requires to be sealed efficiently, so as to prevent leakage of the liquid coolant into and outside the energy storage device. In the case of electronic components, such as, the chargers, the controllers, heat exchangers, pumps, controllers are provided that regulate the flow of a liquid coolant through the internal parts, making the electronic components bulky and difficult to service and maintain.
[00015] Another cooling system implementation common to all components in different applications, such as, a vehicle is using one or more cooling fans or heat sinks in each component for circulating air to extract the generated heat. However, sealing of air and channelizing the air through each component is a tough task. The coolant air inlet may mix with the heated air, increasing the temperature of the inlet coolant air. As the temperature increases, the coolant air may not effectively extract heat and does not serve the purpose. Also, in the individual components, the means to regulate the flow of air, the means to pump inlet air, etc. makes each component and the application also bulky. In applications with space constraints, such as, a vehicle, specifically, a two-wheeled vehicle, with cooling system in each component, the vehicle is bulky, difficult to maneuver, cumbersome to be assembled, manufactured, serviced, and maintained, thereby increasing the associated costs.
[00016] Therefore, there exists a need for a thermal management system in an application that efficiently and effectively transfers heat from involved electronic components, additionally being light in weight, compact, easy to manufacture, assemble, service, and maintain, and safe, provides ease and safety during assembly, use, maintenance, and servicing of the electronic components and the application and overcoming all problems disclosed above as well as other problems of known art.
[00017] In an embodiment, a thermal management device for cooling multiple components simultaneously is disclosed. The thermal management device comprises a housing, one or more distribution means, and one or more receptacles. The housing encloses a fan assembly and comprises one or more inlet ducts and one or more outlet ducts. A distribution means fluidly engages with each of the one or more outlet ducts of the housing at a first end for air distribution. A receptacle removably attaches to a second end of the distribution means for disposing air towards an electronic component engaged with the receptacle.
[00018] In an embodiment, the fan assembly comprises a cooling fan and a motor drive for the cooling fan for forcing air to cool the electronic component engaged with the receptacle. In an embodiment, the housing comprises a bottom cover with a receiving region defined by peripheral walls to accommodate the fan assembly and a top cover configured to be removably attached to the peripheral walls of the bottom cover to encapsulate the fan assembly in a space between the top cover and the bottom cover. The housing further comprises a clamping member removably attached to the top cover to arrest the movement of the fan assembly within the space between the top cover and the bottom cover. In an embodiment, the fan assembly is operated by a controller based on a temperature of the electronic component engaged with the receptacle. In an embodiment, the peripheral walls of the bottom cover comprise one or more openings that form the one or more outlet ducts of the housing. The one or more outlet ducts are on one of same side of the housing and different sides of the housing.
[00019] In an embodiment, the thermal management device further comprises one or more throttle valves positioned at a predefined location along length of the distribution means. Each of the throttle valves may be actuated by a controller based on a temperature of the electronic component. The distribution means engaged with the each of the one or more outlet ducts discharges equal amount of air towards the electronic component engaged with the receptacle. The throttle valve in the distribution means engaged with the each of the one or more outlet ducts is regulated to discharge the required amount of air towards the electronic component engaged with the receptacle. The distribution means is one of rigid and flexible member.
[00020] In an embodiment, the receptacle comprises a plurality of air splitters for directing the air towards the electronic component. The receptacle engages with a mounting provision on an external surface of the electronic component to reduce the temperature of the electronic component.
[00021] The present subject matter is further described with reference to accompanying figures. It should be noted that the description and figures merely illustrate principles of the present subject matter. Various arrangements may be devised that, although not explicitly described or shown herein, encompass the principles of the present subject matter. Moreover, all statements herein reciting principles, aspects, and examples of the present subject matter, as well as specific examples thereof, are intended to encompass equivalents thereof.
[00022] Fig.1 exemplarily illustrates a perspective view of a thermal management device 100 in an application, as per an embodiment of the present invention. As used herein, the “application” is referred to a product employing the thermal management device 100. The product may comprise multiple electronic components that need to be cooled simultaneously. The product may be a vehicle, a computer system, any processor based electronic product, such as, any consumer goods, etc. The thermal management device 100 is installed in contact with the electronic components and cools the electronic components simultaneously. The thermal management device 100 employs air as a cooling medium and channelizes air towards the electronic components.
[00023] The thermal management device 100 comprises a housing 101, one or more distribution means 103, 104, 105 and one or more receptacles 106, 107, 108 to engage with the electronic components. As exemplarily illustrated, the thermal management device 100 comprises three distribution means 103, 104, 105 that originate from a side of the housing 101 and three receptacles 106, 107, 108 at the ends of the distribution means 103, 104, and 105 to engage with the electronic components. The number of distribution means 103, 104, 105 may or may not be equal to the number of electronic components to be cooled. The housing 101 comprises one or more inlet ducts (not shown) and one or more outlet ducts (not shown). The housing 101 encloses a fan assembly 102. The surrounding cool air enters the housing 101 through the inlet duct and is channelized towards the electronic components. The air in contact with the electronic components extracts the heat and the warm air may be exhausted by the electronic components. In an embodiment, the housing 101 may expel the warm air from the electronic components.
[00024] The fan assembly 102 comprises a cooling fan (not shown) that creates turbulence in the incoming cool air and pushes the air towards the outlet ducts. The distribution means 103, 104, 105 are removably attached to the outlet ducts. The distribution means 103, 104, 105 are pipe-like structures that are flexible and can bend in smaller spaces. One end of the distribution means 103, 104, 105 engages with the outlet duct in the housing and the other end of the distribution means 103, 104, 105 engages with the receptacle 106, 107, 108. The receptacle 106, 107, 108 is a discharge end of the distribution means 103, 104, 105 , respectively that expels the cool air towards the electronic components with the air stream channelized by air splitters (not shown) in the receptacle 106, 107, 108. The distribution means 103, 104, 105 are attached to the housing 101 and the receptacle 106, 107, 108 using attachment clips 109 and 110 respectively.
[00025] Fig. 2 exemplarily illustrates a perspective view of the thermal management device 100 engaged with multiple electronic components 201, 202, 203. For the sake of explanation, the product is chosen, but is not limited to, to be a vehicle with electronic components 201, 202, 203 forming the electric drive train of the vehicle. The vehicle may be a two-wheeled, vehicle, a three-wheeled vehicle or any multi-wheeled vehicle, like a passenger bus, truck, car, etc. The vehicle may also be a saddle type vehicle, a step through vehicle, an electric vehicle, an IC engine vehicle, a hybrid vehicle, an autonomous vehicle, etc. The electronic components are also chosen, but not limited, to be one of the energy storage devices 201, one of the controllers 203, and an on-board charger 202 of the vehicle. Each of these components 201, 202, 203 generates heat during normal functioning which needs to be dissipated for effective and prolonged functioning. As exemplarily illustrated, the thermal management device 100 cools the battery 201, the controller 203, and the on-board charger 202 simultaneously.
[00026] The fan assembly 102 of the thermal management device 100 comprises a cooling fan (not shown) with wings and a motor drive (not shown) for the cooling fan for forcing the incoming air entering through the inlet duct 114 to cool the battery 201, the controller 203, and the on-board charger 202 engaged with the receptacles 106, 107, 108. The thermal management device 100 uses forced convection as the means to cool the heated electronic components 201, 202, 203. The fan assembly 102 moves the heated air away from the surface of the electronic components 201, 202, 203 and flushes cool air towards the electronic components 201, 202, 203. The power supply to the motor drive of the fan assembly 102 is AC power sourced from a wall socket or DC supply from a battery. The speed of the cooling fan can be altered by varying the supply voltage or the by means of a control switch.
[00027] The housing 101 has openings on its sides that form the outlet ducts of the housing 101. The distribution means 103, 104, 105 are fluidly engaged in the outlet ducts at a first end, such as, 103a for air distribution to the electronic components 201, 202, 203. The flow of air through the air passage of the distribution means 103, 104, 105 may be uncontrolled. In another embodiment, the flow of air through the distribution means 103, 104, 105 may be varied based on the requirements of the electronic components 201, 202, 203 using a throttle valve 111, 112, 113 positioned at a predefined location along a length of each distribution means 103, 104, 105 respectively. The position of the throttle valves 111, 112, 113 may be in the mid length of the distribution means 103, 104, 105. In an embodiment, the throttle valves 111, 112, 113 are mechanical switches that turn the flow of the air in the air passage to ON or OFF. In another embodiment, the position of the throttle valves 111, 112, 113 may be regulated by a controller, based on the temperatures of the electronic components 201, 202, 203. Consider, the temperature of the battery 201 is higher, while the temperature of the charger 202 may be less. In such a case, the throttle valve 112 on the distribution means 104 is closed, while the throttle valve 111 on the distribution means 103 is open to a regulated percentage to cool the battery 201. Since the throttle valve 112 on the distribution means 104 is closed, the flow of air is balanced between rest of the distribution means 103 and 105 that allow flow of air. In this manner, with less opening of the valves 111 air flow with higher pressure can be obtained to cool the battery 201. In an embodiment, the valves 111, 112, 113 are normally closed and opened based on the signal from the controller.
[00028] The receptacle 106, 107, 108 is removably engaged with the second end, such as, 103b of each of the distribution means 103, 104, 105. As exemplarily illustrated, the receptacles 106, 107, 108 are trapezoidal in shape. The receptacles 106, 107, 108 removably engage with external surface of the electronic components 201, 202, and 203. In an embodiment, the receptacles 106, 107, 108 may latch to mounting provisions on the external surface of the electronic components 201, 202, and 203. Based on the external surface of the electronic components 201, 202, 203 and the mounting provisions, the shapes of the receptacles 106, 107, 108 may vary. The receptacles 106, 107, 108 may be circular, squarical, cylindrical, etc. The end on a top surface of the receptacle 106, 107, 108 may have threads or any known attachment means to engage with the second end, such as, 103b of the distribution means 103, 104, 105. The inner surface (not shown) of the receptacles 106, 107, 108 has an opening through which the air from the distribution means 103, 104, 105 reaches the receptacles 106, 107, 108. The receptacles 106, 107, 108 have multiple air splitters (not shown) on the inner surface to direct the flow of air towards defined region of the external surface of the electronic components 201, 202, 203. The air splitters are formed in a plate like member (not shown) that is screwably attached to the inner bottom surface of the receptacle 106, 107, 108. The plate like member has parallel slits, referred to as, the air splitters that can be oriented at different angles to blow air in desired directions. In an embodiment, the air splitters may be formed integral to the bottom inner surface of the receptacles106, 107, and 108.
[00029] For the battery 201, the charger 202, and the controller 203 to function, the rated temperature to be maintained is within typically maximum 50 degree Celsius. Consider a scenario where after a trip, the vehicle is halted for charging the battery 201. However, after the trip the temperature of the battery 201 and the controller 203, for example, the motor controller is elevated and the charging of the battery 201 cannot be initiated until the temperature reduces. The motor controller or any other controller in the vehicle may detect the elevated temperatures based on the inputs of the temperature sensors in the motor controller 203 and the battery 201. The temperatures of the motor controller 203 and the battery 201 are to be reduced below 50 degree Celsius to start charging of the battery 201. Based on the elevated temperature, the controller may turn on the power supply of cooling fan of the fan assembly 102. Also, the throttle valves 111 and 113 in the distribution means 103 and 105 to the battery 201 and the controller 203 are regulated, while the throttle valve 104 to the charger 202 is closed by the controller. Once the temperature reduces to 50 degree Celsius, the throttle valves 111 and 113 are closed and the cooling fan is turned OFF. The throttle valve position is continuously altered based on real time temperature of the electronic components 201, 202, 203. If the temperature of the controller 203 and the battery 201 is reduced and is in safe limits, the on-board charger 202 charges the battery 201. In an embodiment, heat produced by the charger 202 and the battery 201 while charging is also taken away by the forced convectional cooling of the fan assembly 102, by switching ON the cooling fan and actuating the throttle valves 111 and 112. In an embodiment, the thermal management device 100 is operational during both runtime of the vehicle and stationary condition of the vehicle. For the thermal management device 100 to be operational even during runtime, the receptacles 106, 107, 108 are engaged with the electronic components 201, 202, 203 during runtime also.
[00030] Fig. 3 exemplarily illustrates an exploded view of the housing 101 of the thermal management device 100. The housing 101 comprises a bottom cover 311 and a top cover 302. The bottom cover 311 comprises a receiving region 312 defined by peripheral walls 306 forming the periphery of the bottom cover 311. The bottom cover 311 accommodates the fan assembly 102. The top cover 302 is removably attached to the peripheral walls 306 of the bottom cover 311 to encapsulate the fan assembly 102 in a space between the top cover 302 and the bottom cover 311. The top cover 302 has a central opening 303 for the motor drive 304 of the fan assembly 102 to protrude outside and the cooling fan 305 is in the space between the top cover 302 and the bottom cover 311. On the peripheral walls 306 and in the receiving region 312, mounting provisions 307 are provided for screwably attaching the top cover 302 to the bottom cover 311. In an embodiment, the housing 101 further comprises a clamping member 301 that is removably attached to the top cover 302 to arrest the movement of the fan assembly 102 between the top cover 302 and the bottom cover 311. The clamping member 301 is a tripod structure where a central portion is screwably attached to the motor drive 304 and the legs of the tripod are screwably attached to the top cover 302. The clamping member 301 ensures the stability of the cooling fan 304 under working state and also protects the cooling fan 304 from environmental conditions, such as, dust and water intrusion.
[00031] The inlet duct 114 as shown in Fig. 2 for the entry of cool air into the housing 101 is defined by the gap between the motor drive 304 and the top cover 302. In an embodiment, the inlet duct 114 defined by an opening on the peripheral walls 306 of the bottom cover 311 may be provided for inflow of air. The outlet ducts 308, 309, 310 are defined by the openings on the peripheral walls 306 of the bottom cover 311. As exemplarily illustrated, the outlet ducts 308, 309, 310 are formed on the same peripheral wall 306 of the bottom cover 311. In an embodiment, the outlet ducts 308, 309, 310 may be formed on different walls 306 of the bottom cover 311. Based on the position of the outlet duct 308, 309, 310, the distribution means 103, 104, 105 can extend in the same direction as shown in Fig. 2 or extend in different directions. In an embodiment, the outlet ducts 308, 309, 310 may have threads on an inner surface for removably engaging with the first end 103a of the distribution means 103, 104, and 105. In this embodiment, the first ends 103a of the distribution means 103, 104, 105 have counter threads to engage with the threads in the outlet ducts 308, 309, 310. In an embodiment, the first end 103a of the distribution means 103, 104, 105 has facility to snap-fit into the outlet ducts 308, 309, 310. In another embodiment, attachment clips 109 and 110 as shown in Fig.1 are provided at the first end 103a and the second end 103b of the distribution means 103, 104, and 105 to lock the distribution means 103, 104, 105 in position as shown in Fig. 5. In an embodiment, the outlet ducts 308, 309, 310 that are not connected to the distribution means 103, 104, 105 may be sealed using a plastic cap.
[00032] Fig. 4 exemplarily illustrates a bottom perspective view of the distribution means 103 with the receptacle 106 at the second end 103b. As exemplarily illustrated, the inner surface 106a of the trapezoidal receptacle 106 comprises a plate like member 401 with slits 402 in it. The direction of the slits 402 can be adjusted in the desired direction to deflect the blow of air to the external surface of the electronic components 201, 202, 203. In an embodiment, the plate-like member 401 may be replaced by a hose splitter with manifolds to control the blow of air only on specific regions of the external surface of the electronic components 201, 202, 203. As per an embodiment, the pressure of air impinging on the electronic components is maximum 2 bars and the temperature of the air blow is in range of 25 degree Celsius to 30 degree Celsius. In an embodiment, the receptacle 106 is made of Stainless steel or Mild steel, displaying strength and non-corrosive properties.
[00033] Fig. 5 exemplarily illustrates a perspective view of an attachment clip, such as, 109. As exemplarily illustrated in Fig. 1, the attachment clips 109, 110 are used at both ends 103a and 103b of the distribution means 103, 104, 105 to removably attach it to the outlet ducts 308, 309, 310 and the receptacles 106, 107, 108. For this embodiment of using the attachment clips 109, 110, the openings in the peripheral walls 306 have cylindrical protrusions with which the first end 103a of the distribution means 103, 104, 105 engages. Similarly, the receptacles 106, 107, 108 on their top surface have a tubular protrusion with which the second end 103b of the distribution means 103, 104, 105 engage. The diameters of the protrusions in the housing 101 and the receptacles 106, 107, 108 are lesser than the diameter of the first end 103a and the second end 103b of the cylindrical distribution means 103, 104, 105. The attachment clips 109, 110 are tightened around the first end 103a and the second end 103b of the distribution means 103, 104, 105 using the wings 501, 502 and the circumferential member 503. The attachment clip 109 may have provisions, such as press-fit or slots 504 to interlock the wings 501, 502. The attachment clip 109 may be made of steel, aluminum, or any known metal that can withstand medium to high pressures. The distribution means 103, 104, 105 are made of PVC or Nylon making them extremely flexible, abrasion resistant, light weight, with good mechanical strength and toughness.
[00034] The thermal management device disclosed in the present invention provides the following technical advancement in the field of thermal management of processor based applications: Processor based applications are numerous, such as, vehicles and electronic components such as, batteries, controllers, chargers, etc., need efficient thermal management for long safe use. During normal operation of the battery, temperature of cells rises. During charging, overcharging, extended operation, the temperatures may drastically rise. In both these conditions, the thermal management device and its associated components blow cooling medium and facilitate dissipation of heat away from the cells. The electronic components may have inbuilt heat sink or any other natural cooling means. The blow of air onto these components accelerates the process of cooling. Also, the components are cooled simultaneously, without having individual cooling mechanisms. One active cooling system serves the purpose for the multiple electronic components, saving space of installation of multiple cooling means and cost associated with it. In case of space constrained applications, such as, two-wheeled vehicles, one thermal management device can be installed in close proximity to the battery, the controller, and the on-board charger. Since the drive power for cooling is only to the thermal management device, any other active cooling means in the electronic components that require power are avoided and thus, the power consumption of the battery is also reduced. In case of electric vehicles, where charging is not feasible after a trip until the temperature is reduced to a certain value, the on-board thermal management device may continuously operate during the run time of the vehicle and cool the components to their optimal temperatures. Since the thermal management device employs forced convection, the rate of cooling the electronic components is rapid and thus, the use of the thermal management device saves time.
[00035] The distribution means and the air splitters channelize the flow of air towards the electronic components. The distribution means being flexible in nature can easily twist and turn to engage with the electronic components, irrespective of their position in the application, such as, the vehicle with space-crunch. The thermal management device is highly modular and may be assembled onsite in the application or may be assembled remotely, with less associated costs. Also, the thermal management device being modular may be installed in existing applications, such as IC engine vehicles in the available space. The thermal management device may also be downsized with the required number of outlet ducts and distribution means. In an embodiment, from one duct in the housing, multiple distribution means may also be extracted using splitters, saving cost and space of the attachment clips, etc. The thermal management device may also function with the existing cooling mechanism of each of the electronic components. In an embodiment, the thermal management device may comprise a recirculation line from the electronic components that feeds to the inlet duct of the housing, after cooling the warm air from the electronic components.
[00036] The components of the thermal management device are light weight, strong, have features, such as, snap fit, threads, attachment clips, etc., that guide in mounting while assembly, maintenance, and servicing, making the thermal management device compact and economical with non-cumbersome assembly as well as simple to service and maintain. The thermal management device makes the electronic components also compact without additional cooling means, safe to use preventing thermal runaway and avoids elevated operating temperatures. The thermal management device finds application in space constrained mobile devices, products, vehicle, such, two-wheelers, three-wheelers, or any multi-wheeled vehicle, such passenger trucks that experience lot of shock and vibrations. The components of the thermal management device are tightly interlocked and do not get dislodged due to vibration and shocks.
[00037] Improvements and modifications may be incorporated herein without deviating from the scope of the invention.
LIST OF REFERENCE NUMERALS

100- Thermal management device
101- Housing
102- Fan assembly
103, 104, 105- distribution means
103a- first end of distribution means
103b- second end of distribution means
106, 107, 108- receptacles
106a- inner surface of receptacle
109 and 110- attachment clips
111, 112, 113- throttle valves
114-inlet duct
201- Battery
202- Charger
203- Controller
301-clamping member
302- Top cover
303- Opening in top cover
304- Motor drive
305- Cooling fan
306- Peripheral walls
307- Mounting provisions
308, 309, 310- outlet ducts
311- Bottom cover
312- Receiving region
401- Plate like member
402- slits/ air splitter
501, 502- wings of attachment clip
503- Circumferential member
504- Slots