THERMAL-MECHANICAL ADJUSTMENT FOR LASER SYSTEM
I. Technical Field
[0001] The present invention relates generally to a laser system. In particular, the
present invention relates a laser system having a thermal-mechanical adjustment
device.
II. Background
[0002] Semiconductor lasers are used in many different applications. These
applications can include monitoring systems and measurement systems. In a
monitoring system for high-powered machinery such as a power transformer, a laser
e.g., a quantum cascade laser (QCL) is used for detecting trace gases. Selection of the
wavelength of the light emitted is determined by the temperature of the laser medium.
Therefore, the laser assembly needs to be kept at a specific temperature to maintain
accuracy of the wavelength thereof.
[0003] Current laser systems can employ a combination of fans and heat pipes
to remove excess heat generated from the laser beam. However, fans can create
undesired noise and vibrations, which increases the noise within the laser system.
III. Summary of the Embodiments
[0004] Embodiments of the present invention provide a laser system including a
thermal-mechanical adjustment device capable of maintaining alignment of the laser
beam and dissipating heat therefrom to maintain accuracy of the wavelength of the
light output.
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[0005] In one exemplary embodiment, a laser system is provided. The laser
system includes a laser head including a laser holder configured to house a laser beam
and a lens for reflecting the laser beam at a predetermined wavelength. Also included
is a thermal-mechanical adjustment device disposed on the laser head. This device is
configured to adjust a temperature and an alignment of the laser beam, to maintain the
predetermined wavelength of the laser beam.
[0006] The foregoing has broadly outlined some of the aspects and features of
various embodiments, which should be construed to be merely illustrative of various
potential applications of the disclosure. Other beneficial results can be obtained by
applying the disclosed information in a different manner or by combining various
aspects of the disclosed embodiments. Accordingly, other aspects and a more
comprehensive understanding may be obtained by referring to the detailed description
of the exemplary embodiments taken in conjunction with the accompanying drawings,
in addition to the scope defined by the claims.
IV. DESCRIPTION OF THE DRAWINGS
[0007] FIG. 1 is a schematic illustrating an example of a laser system that can be
implemented within one or more embodiments of the present invention.
[0008] FIG. 2 is a detailed schematic of a thermal-mechanical adjustment device
of the laser system of FIG. 1 that can be implemented within one or more
embodiments.
[0009] FIG. 3 is a schematic illustrating a mechanical adjustment operation of the
thermal-mechanical adjustment device of FIG. 2 that can be implemented within one
or more embodiments of the present invention.
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[0010] FIG. 4A and 4B are schematics illustrating a heat dissipation operation of
the thermal-mechanical adjustment device of FIG. 2 that can be implemented within
one or more embodiments of the present invention.
[0011] The drawings are only for purposes of illustrating preferred embodiments
and are not to be construed as limiting the disclosure. Given the following enabling
description of the drawings, the novel aspects of the present disclosure should become
evident to a person of ordinary skill in the art. This detailed description uses
numerical and letter designations to refer to features in the drawings. Like or similar
designations in the drawings and description have been used to refer to like or similar
parts of embodiments of the invention.
V. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0012] As required, detailed embodiments are disclosed herein. It must be
understood that the disclosed embodiments are merely exemplary of various and
alternative forms. As used herein, the word "exemplary" is used expansively to refer
to embodiments that serve as illustrations, specimens, models, or patterns. The
figures are not necessarily to scale and some features may be exaggerated or
minimized to show details of particular components. In other instances, well-known
components, systems, materials, or methods that are known to those having ordinary
skill in the art have not been described in detail in order to avoid obscuring the
present disclosure. Therefore, specific structural and functional details disclosed
herein are not to be interpreted as limiting, but merely as a basis for the claims and as
a representative basis for teaching one skilled in the art.
[0013] Embodiments of the present invention provide a laser system housing a
laser holder for transmitting a laser beam therethrough, and a thermal-mechanical
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adjustment device capable of adjusting the temperature of the laser beam and
maintaining the alignment of the laser beam. The thermal-mechanical adjustment
device effectively maintains accuracy of the wavelength of the light output.
[0014] Details regarding the laser system 100 of the present invention will now
be discussed with reference to FIGS. 1 through 3. FIG. 1 illustrates a laser system
100 used to perform various testing operations on target equipment 50 e.g., such as a
power transformer. For example, the testing operations can include trace gases
detection. The laser system 100 can be a semiconductor laser such as a quantum
cascade laser (QCL). Other types of lasers could also be used with this laser system
100, for example telecommunication lasers, lead salt lasers, vertical cavity surface
emitting laser (VCSEL), Hybrid silicon laser, InGaAsp laser, semiconductor laser
diode, doped insulator lasers, or gas and chemical lasers, etc.
[0015] As further shown in FIG. 1, the laser system 100 includes a laser holder
110 for transmitting a laser beam 120 therethrough emitting from a laser source. One
or more lens 125 are disposed downstream of the laser holder 110 for reflecting the
laser beam 120 in a desired direction. In Fig. 2, the laser system 100 further includes
a laser head (i.e., a mounting stand) 130 adjacent to the laser holder 110 holding the
laser beam 120 and lens 125. The laser head 130 includes a chamfered opening 132,
and a thermal-mechanical adjustment device 140 including a pivot bar 141 for
maintaining the alignment of the laser beam 120; The laser head 130 can be formed
of a metal material such as copper or any other suitable material.
[0016] Further in FIG. 2, the chamfered opening 132 of the laser head 130 is
formed at one end of the laser head 130 opposite the emitting end of the laser beam
120 from the laser source, and is configured to house the pivot bar 141 therein. The
pivot bar 141 is configured to allow pivot in conjunction with the chamfered opening
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and rotation of the laser beam 120 about its circumference at a pivot point (as
depicted by dashed line 'A' in FIG. 3). The chamfered opening 132 is configured to
allow the pivot bar 141 to sway at an angle of approximately 90° to the rotation of the
pivot bar 141 (as depicted by dashed line 'B' in FIG. 3). Thus, the pivot bar 141
allows x and y axis alignment of the laser beam 120. When only 1-axis alignment is
needed, the rotation around the pivot bar. Alternatively, when 2-axis alignment is
needed, then both rotation and pivoting operations are performed.
[0017] The thermal-mechanical adjustment device 140 of the laser system 100
further includes a plurality of first thermally conductive portions 142a and 142b
disposed at opposite sides of the laser head 130 adjacent to respective ends of the
pivot bar 141. According to one or more embodiments, the thermally conductive
portions 142a and 142b can be formed of thermally conductive foam or any other
suitable material for the purposes set forth herein.
[0018] A spring device 143 is also provided and is disposed at along the laser
head 130 at another end of the laser head 130 opposite the end housing the pivot bar
141. Additionally, according to one or more embodiments, second thermally
conductive portions 144a and 144b are disposed adjacent to the spring device 143.
The second thermally conductive portions 144a and 144b can be formed of the same
or different materials than that of the first thermally conductive portions 142a and
142b. The thermally conductive foam of the thermally conductive portions 142a,
142b, 144a and 144b provides a resistive force and has elastic restorative properties as
well as being thermally conductive. Thus, the material could be used in conjunction
with screws to allow precise alignment.
[0019] As shown in FIG. 2, the first thermally conductive portions 142a and
142b are L-shaped and the second thermally conductive portions 144a and 144b are
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rectangular-shaped. The present invention is not limited to the thermally conductive
portions 142a, 142b, 144a and 144b being any particular shape or size, and may vary
accordingly. Details regarding the operations of the first and second thermally
conductive portions 142a, 142b, 144a and 144b and the spring device 143 will be
discussed now with reference to FIGS. 3 through 4B.
[0020] FIG. 3 is a schematic illustrating a mechanical adjustment operation to be
performed by the thermal-mechanical adjustment device 140 according to one or
more embodiments of the present invention.
[0021] As shown in FIG. 3, as indicated by the arrows, the first and second
thermally conductive portions 142a, 142b, 144a and 144b are configured to apply a
resistive (i.e., pushing) force to the laser head 130, while the spring device 143 is
configured to apply a pulling force to the laser head 130, to assist with adjustment of
the laser beam 120 being transmitted therethrough.
[0022] When the laser beam 120 is transmitted through the laser head 130, the
first and second thermally conductive portions 142a, 142b, 144a and 144b along with
the spring device 143 maintain the alignment of the laser beam, thereby maintaining
the accuracy of the wavelength. The first and second thermally conductive portions
142a, 142b, 144a and 144b also dissipate heat from the laser system 100.
[0023] FIG. 4A and 4B are schematics illustrating a heat dissipation operation of
the thermal-mechanical adjustment device 140 that can be implemented within one or
more embodiments of the present invention.
[0024] As shown in FIG. 4A, as indicated by the arrows, the first and second
thermally conductive portions 142a, 142b, 144a and 144b are further configured to
transfer heat generated by the laser beam 120 away from the laser head 130. Thus,
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the first and second thermally conductive portions 142a, 142b, 144a and 144b assist
with maintaining the temperature of the laser beam 120 to a specific temperature
range of approximately 20 to 40 degrees Celsius.
[0025] In some embodiments, the laser system 100 can be mounted to a
mounting base 160 as shown in FIG. 4B. In this embodiment, the laser head 130 is
secured to mounting base 160 via one or more set screws 161a, 161b and 161c. The
first and second thermally conductive portions 144a and 144b are further configured
to apply a pushing force against the force of the set screws 161a, 161b and 161c to
maintain accuracy of the alignment of the laser beam 120.
[0026] Further, the heat transferred away from the laser head 130 via the first and
second thermally conductive portions 142a, 142b, 144a and 144b is further transferred
to the mounting base 160 to be dissipated therefrom (as indicated by the arrows). The
heat can be disposed of via a heat pipe, heat sink or other heat dissipating mechanism
attached to the mounting base 160. The laser system 100 of the present invention
therefore effectively maintains the temperature of the laser beam 120.
[0027] Embodiments of the present invention provides the advantages of
dissipating heat and mechanically aligning the laser beam of the laser system using
the same components (i.e., the thermally conductive portions) employed therein.
Further, the present invention provides a laser system without use of a fan to thereby
avoid unwanted noise and vibrations in the laser system.
[0028] This written description uses examples to disclose the invention including
the best mode, and also to enable any person skilled in the art to practice the
invention, including making and using any devices or systems and performing any
incorporated methods. The patentable scope of the invention is defined by the claims,
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and may include other examples that occur to those skilled in the art. Such other
examples are intended to be within the scope of the claims if they have structural
elements that do not differ from the literal language of the claims, or if they include
equivalent structural elements with insubstantial differences from the literal languages
of the claims.

What is claimed is:
1. A laser system comprising:
a laser head including a laser holder configured to house a laser beam and a
lens for reflecting the laser beam at a predetermined wavelength; and
a thermal-mechanical adjustment device (i) disposed on the laser head and
configured to adjust a temperature and an alignment of the laser beam and (ii) to
maintain the predetermined wavelength nf the. bser beam.
2. The laser system of claim 1, further comprising:
a chamfered opening formed at one end of the laser head opposite the emitting
end of the laser beam;
a pivot bar disposed within the chamfered opening and configured to pivot the
laser beam about its circumference at a pivot point and to sway at an angle to the
rotation thereof within the chamfered opening.
3. The laser system of claim 2, wherein the angle is approximately 90°.
4. The laser system of claim 2, wherein the thermal-mechanical adjustment
device comprises:
a plurality of first thermally conductive portions disposed at opposite sides of
the laser head adjacent to respective ends of the pivot bar and configured to apply a
resistive force to the laser head.
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5. The laser system of claim 4, wherein the first thermally conductive portions
comprise a thermally conductive foam material.
6. The laser system of claim 4, wherein the thermal-mechanical adjustment
device further comprises:
a spring device disposed at another end of the laser head opposite the end
housing the pivot bar and configured to apply a pulling force to the laser head; and
a plurality of second thermally conductive portions disposed adjacent to the
spring device and configured to apply a resistive force to the laser head near the
pulling force of the spring device to align the laser beam therein.
7. The laser system of claim 4, wherein the first thermally conductive portions
are further configured to dissipate heat generated by the laser beam away from the
laser head.
8. The laser system of claim 6, wherein the first and second thermally conductive
portions are further configured to dissipate heat generated by the laser beam away
from the laser head.
9. The laser system of claim 8, wherein the first and second thermally conductive
portions are configured to maintain a specific temperature of the laser beam ranging
between approximately 20 to 40 degrees Celsius.
10. The laser system of claim 8 further comprising:
a mounting base configured to mount the laser head thereon; and
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a plurality of set screws to secure the laser head to the mounting base, wherein
the second thermally conductive portions apply a resistive force to the plurality of set
screws to maintain alignment of the laser beam within the laser head.
11. A thermal-mechanical adjustment device for a laser head, comprising:
a plurality of first thermally conductive foam portions disposed at one end of
the laser head and configured to dissipate heat from a laser beam therethrough and
adjust an alignment of the laser beam by applying a resistive force to the laser head.
12. The thermal-mechanical adjustment device of claim 11, further comprising:
a spring device disposed at an opposite end of the laser head and configured to
apply a pulling force to the laser head; and
a plurality of second thermally conductive foam portions disposed at the
opposite end of the laser head adjacent to the spring device and configured to apply a
resistive force to counteract the pulling force of the spring device, to align the laser
beam within the laser head.