THIN BOND-LINE SJL1CONE ADHESIVE COMPOSITION AND METHOD FOR PREPARING THE SAME BACKGROUND OF THE INVENTION The present disclosure relates to the composition and preparation of thermally conductive composites containing filters with a maximum particle diameter of less than 25 microns to reduce bond line thickness, decrease in-situ thermal resistance and improve in-situ heat transfer of thermal interface materials made from such compositions. Many electrical components generate heat during periods of operation. As electronic devices become denser and more highly integrated, the heat flux increases exponentially. At the same time, because of performance and reliability considerations, the devices need to operate at lower temperatures, thus reducing the temperature difference between the heat generating part of the device and the ambient temperature, which decreases the thermodynamic driving force for heat removal. The increased heat flux and reduced thermodynamic driving force thus require increasingly sophisticated thermal management techniques to facilitate heat removal during periods of operation. Thermal management techniques often involve the use of some form of heat dissipating unit (which includes, but is not limited to, heat spreader, heat sink, lid, heat pipe, or any other designs and constructions known to those skilled in the art) to conduct heat away from high temperature areas in an electrical system. A heat dissipating unit is a structure formed from a high thermal conductivity material (e.g., copper, aluminum, silicon carbide, metal alloys, polymer composites and ceramic composites) that is mechanically coupled to a heat generating unit to aid in heat removal. In a relatively simple form, a dissipating unit can include a piece of metal (e.g., aluminum or copper) that is in contact with the heat generating unit. Heat from the heal generating unit flows into the heat dissipating unit through the mechanical interface between the units. In a typical electronic package, a heat dissipating unit is mechanically coupled to the heat producing component during operation by positioning a flat surface of the heat dissipating unit against a flat surface of the heat generating component and holding the heat dissipating unit in place using some form of adhesive or fastener. As can be appreciated, the surface of the heat dissipating unit and the surface of the heat generating component will rarely be perfectly planar or smooth, so air gaps will generally exist between the surfaces. As is generally well known, the existence of air gaps between two opposing surfaces reduces the ability to transfer heat through the interface between the surfaces. Thus, these air gaps reduce the effectiveness and value of the heat dissipating unit as a thermal management device. To address this problem, polymeric compositions have been developed for placement between the heat transfer surfaces to decrease the thermal resistance therebetween. In general, a heat dissipating unit is attached to the heat generating component via a thin-layer of thermal interface material (TIM). This material is typically a filled polymer system. The effectiveness of heat removal from the device depends on the in-situ thermal resistance of the TIM material which, in turn, depends not only on the bulk thermal conductivities of the TIM material, but also the attainable bond line thickness under industrially relevant pressure and the interfacial resistance. The minimum thickness of the TIM is determined by the degree of surface planarity and roughness of both the heat generating and the heat dissipating units, or the maximum (agglomerated) filler size, whichever is larger. However, this minimum bondline may not be always attainable, especially with highly viscous and thixotropic formulations, under industrially relevant pressure, typically below 250 psi, and more typically at or below 100 psi. In addition, a formulation's viscosity, wettability to the surface, film forming capability and storage stability can greatly affect interfacial resistance and thus the thermal interface material's in-device heat transfer capability. In many TIM applications the TIM must be sufficiently compliant to provide mechanical isolation of the heat generating component and the heat dissipating unit in those cases where the Coefficient of Thermal Expansion (CTE) of the heat generating component is significantly different (higher or lower) than that of the heat dissipating unit. In such applications, TIM materials have to not only provide an efficient heat transfer pathway bui also maintain structural integrity for the whole package or device. They have therefore to maintain satisfactory mechanical as well as thermal properties throughout the lifetime of the device. A need therefore exists for improved compositions to effectively transfer heat between a heat dissipating unit and a heat producing component while maintaining mechanical integrity throughout the device lifetime. BRIEF DESCRIPTION OF THE INVENTION Thermal interface compositions in accordance with this disclosure are polymeric composites containing filler particles that are 25 microns or Jess in diameter. Thermal resistance can be minimized with a low viscosity formulation that demonstrates a low bond line thickness, good wettability to the substrates to be bonded and good film forming ability. The viscosity of the formulation can be affected by the processing conditions, which include, but are not limited to, order of addition, mixing speed and time, temperature, humidity, vacuum level and filler treatment procedures. In addition, the thermal resistance of the heat generating - heat dissipating system is minimized due to the smaller particle sizes that address interfacial contact resistances. Electrical components are also described herein which include a heat producing component and a heat dissipating unit each in contact with a thermal interface composition of the present disclosure. Methods of increasing the efficiency of heat transfer in accordance with this disclosure include the steps of interposing a thermal interface composition between a heat producing component and a heat dissipating unit. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic representation of an electrical component in accordance with this disclosure. Figure 2 is a schematic representation of a testing sample including compositions in accordance with this disclosure placed between two coupons, which may be metalmetal, metal-silicon or silicon-silicon. Figure 3 is a schematic representation of a die shear setup used to measure adhesion strength of compositions in accordance with this disclosure. DETAILED DESCRIPTION OF THE INVENTION The composition of the present disclosure is a matrix containing filler particles below 25 microns in size. These composites can achieve lower attainable bond line thickness, which allows a lower attainable in-situ thermal resistance. The composition of the present disclosure is especially useful as a thermal interface material between two or more substrates to aid in heat removal from a heat source or a heat generating device. The matrix can be any polymeric material. Suitable organic matrices include, but are not limited to, polydimethylsiloxane resins, epoxy resins, acrylate resins, other organo-functionalized polysiloxane resins, polyimide resins, fluorocarbon resins, benzocyclobutene resins, fluorinated polyallyl ethers, polyamide resins, polyimidoamide resins, phenol resol resins, aromatic polyester resins, polyphenylene ether (PPE) resins, bismaleimide triazine resins, fluororesins, mixtures thereof and any other polymeric systems known to those skilled in the art. (For common polymers, see "Polymer Handbook:, Branduf, J.,; Immergut, E.H; Grulke, Eric A; Wiley Interscience Publication, New York, 4lh ed.(1999); "Polymer Data Handbook Mark, James Oxford University Press, New York (1999)). Preferred curable thermoset matrices are acrylate resins, epoxy resins, polydimethyl siloxane resins, other organo-functionalized polysiloxane resins that can form cross-linking networks via free radical polymerization, atom transfer, radical polymerization ring-opening polymerization, ring-opening metathesis polymerization, anionic polymerization, cationic polymerization or any other method known to those skilled in the art, and mixtures thereof. Suitable curable silicone resins include, for example, the addition curable and condensation curable matrices as described in "Chemistry and Technology of Silicone", Noll, W.; Academic Press 1968. Where the polymer matrix is not a curable polymer, the resulting thermal interface composition can be formulated as a gel, grease or phase change materials that can hold components together during fabrication and thermal transfer during operation of the device. In another embodiment, the polymeric matrix can be an organic-inorganic hybrid matrix. Hybrid matrices include any polymers that contain chemically bound main group metal elements (e.g., aluminum, magnesium, gallium, indium), main group semi-metal elements (e.g. boron, germanium, arsenic, antimony), phosphorous, selenium, transition metal elements (e.g., platinum, palladium, gold, silver, copper, zinc, zirconium, titanium, ruthenium, lanthanum, etc.) or inorganic clusters (which include, but are not limited to, polyhedral oligomeric silsesquioxanes, nano metal oxides, nano silicon oxides, nano metal particles coated with metal oxides, and nano metal particles.) For typical examples and methods of forming inorganic-organic hybrids, see reviews such as "Hybrid Organic Inorganic Materials - in Search of Synergic Activity" by Pedro Gomez-Romero, Advanced Materials, 2001, Vol. 13, No. 3, pp: 163-174; "Inorganic Clusters in Organic Polymers and the Use of Polyfunctional Inorganic Compounds as Polymerization Initiators" by Guido Kickelbick and Ulrich Schubert, Monatshefte fur Chemie, 2001, Vol. 132, pp. 13-30; "Synthesis and Application of Inorganic/Organic Composite Materials", by Helmut Schmidt, Macromolecular Symposia, 1996, Vol. 101, pp. 333-342; and "Synthesis of Nanocomposite Organic/Inorganic Hybrid Materials Using Controlled/ 'Living' Radical Polymerization" by Jeffrey Pyun and Krzysztof Matyjaszewski, Chemistry of Materials, 2001, Vol. 13. pp. 3436-3448. As used herein, "chemically bound" refers to bonding through a covalent bond, an ionic interaction, an iono-covalent bond, a dative bond or a hydrogen bond. Organic-inorganic hybrid polymeric matrices may refer to, but are not limited to, copolymerization products between organic monomers, oligomers or polymers that contain polymerizable groups such as alkenyl, ally!, Si-H, acrylate, methacrylate, styrenic, isocyanate, epoxide and other common groups known to those skilled in the art, and inorganic clusters or organometallic compounds containing polymerizable groups. For example, the copolymerization product between an acrylate or a methacrylate and a metal acrylate or methacrylate compound is an organic-inorganic hybrid polymeric matrix. The copolymerization product between an epoxide and an epoxide-functionalized inorganic cluster is also considered an inorganic-organic hybrid polymer. The homorpolymerizatioh products of organofunctionalized inorganic clusters or organometallic compounds, or the copolymerization products among different organo-functionalized inorganic clusters or organometallic compounds, are also considered organic-inorganic hybrid matrices. Organic-inorganic hybrid matrices also include cases where the inorganic cluster or organometallic compound has no polymerizable functional groups, but can become part of the polymer network through its surface OH or other functional groups. In a preferred embodiment, the matrix is an addition curable silicone rubber composition including the following components: (A) 100 parts by weight of an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 0.1-50 parts by weight of an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation catalyst; and optionally (D) catalyst inhibtor(s); and (E) adhesion promoters. Where utilized, the organopolysiloxane (component A) contains an average of at least two alkenyl groups bonded with silicon atoms per molecule. The alkenyl groups that are bonded with silicon atoms include, for example, vinyl groups, ally! groups, butenyl groups, pentenyl groups, hexenyl groups and heptenyl groups. Of these, vinyl groups are particularly preferred. The bonding positions of the alkenyl groups in the organopolysiloxane include, for example, the terminals of the molecular chain and/or side chains of the molecular chain. Organic groups that are bonded with the silicon atoms in addition to the alkenyl groups of (he organopolysiloxane include, for example, alkyl groups such as methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups and heptyl groups, aryl groups such as phenyl groups, tolyl groups, xylyl groups and naphthyl groups, aralkyl groups such as benzyl groups and phenethyl groups and halogenated groups such as chloromethyl groups, 3- chloropropyl groups and 3,3,3-trifluoropropyl groups, with methyl groups and phenyl groups being particularly preferred. The molecular structure of the organopolysiloxane can be, for example, in straight chain form, a straight chain form having some branches, in cyclic form and in branched chain form, with the straight chain form being particularly desirable. Although there is no limitation on the viscosity of the organopolysiloxane, a viscosity in the range of about 10 to about 500,000 centipoise at 25° C. is preferred, with a range of about 50 to about 5,000 centipoise being particularly preferred. The organopolysiloxane (component A) can include, for example, copolymers of dimethyl siloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain and of methyl vinyl siloxane; methyl vinyl polysiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain; copolymers of dimethyl siloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, methyl vinyl siloxane and methyl phenyl siloxane; dimethyl polysiloxane blocked with dimethyl vinyl siloxane groups at both terminals of the molecular chain; methyl vinyl polysiloxane blocked with dimethyl vinyl siloxane groups at both terminals of the molecular chain; copolymers of dimethyl siloxane blocked with dimethyl vinyl siloxane groups at both terminals of the molecular chain and of methyl vinyl siloxane; copolymers of dimethyl siloxane blocked with dimethyl vinyl siloxane groups at both terminals of the molecular chain, methyl vinyl siloxane and methyl phenyl siloxane; organopolysiloxane copolymers comprised of siloxane units as indicated by the formula R'jSiOi/j, siloxane units as indicated by the formula R'2R2SiO|/2, as indicated by the formula R^SiOi/j and a small quantity of siloxane units as indicated by the formula SiCU/2; organopolysiloxane copolymers comprised of siloxane units as indicated by the formula R'3R2SiOi/2, siloxane units as indicated by the formula R'2SiO2/2 and siloxane units as indicated by the formula SiO4/2; organopolysiloxane copolymers comprised of siloxane units as indicated by the formula R'R2Si02/j, siloxane units as indicated by the formula R'SiO.™ and siloxane units as indicated by the formula R2SiO.v2, and mixtures of two or more of these organopolysiloxanes. In the foregoing formulas, R1 is a monovalent hydrocarbon group other than an alkenyl group, for example, an alky) group such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group or a heptyl group, an aryl group such as a phenyl group, a tolyl group, a xylyl group or a naphthyl group, an aralkyl group such as a phenethyl group or a halogenated alkyl group such as a chloromethyl group, a 3-chloropropyl group or a 3,3,3-trifluoropropyl group. In the foregoing formulas, R2 is an alkenyl group, for example, a vinyl group, an ally! group, a butenyl group, a pentenyl group, a hexenyl group or a heptenyl group. Where utilized, the organohydrogenpolysiloxane acts as a crosslinking agent and contains an average of at least two hydrogen atoms that are bonded to silicon atoms per molecule. The positions of bonding of the hydrogen atoms bonded with the silicon atoms in the organohydrogenpolysiloxane can be, for example, the terminals of the molecular chain and/or side chains of the molecular chain. Organic groups bonded with silicon atoms of the organohydrogenpolysiloxane include, for example, alkyl groups such as methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups and heptyl groups, aryl groups such as phenyl groups, tolyl groups, xylyl groups and naphthyl groups, aralkyl groups such as phenethyl groups or halogenated alkyl groups such as chloromethyl groups, 3-chloropropyl groups or 3,3,3-trifluoropropyl groups. Methyl groups and phenyl groups are particular preferred. The molecular structure of the organohydrogenpolysiloxane may be, for example, in straight chain form, a straight chain form having some branches, in cyclic form and in branched chain form, with the straight chain form being particularly preferred. Although there is no limitation on the viscosity of the organohydrogenpolysiloxane, a viscosity in the range of about 1 to about 500,000 centipoise at 25° C. is desirable, with a range of about 5 to about 5,000 centipoise being particularly preferred. The organohydrogenpolysiloxane (component B) can include, for example, methylhydrogen polysiloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, copolymers of dimethyl siloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain and of methylhydrogen siloxane, copolymers of dimethyl siloxane blocked with trimethylsiloxy groups at both terminals of the molecular chain, methylhydrogen siloxane and methylphenyl siloxane, dimethyl polysiloxane blocked with dimethylhydrogen siloxane groups at both terminals of the molecular chain, dimethyl polysiloxane blocked with dimethylhydrogen siloxane groups at both terminals of the molecular chain, copolymers of dimethyl blocked with dimethylhydrogen siloxane groups at both terminals of the molecular chain and methylphenyl siloxane, methylphenyl polysiloxane blocked with dimethylhydrogen siloxane groups at both terminals of the molecular chain, organopolysiloxane copolymers comprised of siloxane units as indicated by the formula R'.iSiO]/2 siloxane units as indicated by the formula R^HSiOi/z and siloxane units as indicated by the formula SiO^/j, organopolysiloxane copolymers comprised of siloxane units as indicated by the formula R'zHSiOi/? and siloxane units as indicated by the formula SiO