DESCRIPTION TRANSPONDER AND BOOKLET [0001] The present invention relates to a transponder and a booklet. Priority is claimed on Japanese Patent Application No. 2008-041134, filed February 22,2008, and Japanese Patent Application No. 2008-187007, filed July 18,2008, the contents of which are incorporated herein by reference. BACKGROUND ART [0002] There are conventionally known technologies for arranging a wire-wound antenna coil on a substrate and connecting it to an IC module to form a non-contact type communication unit which performs data communications with an external reading/writing device (e.g. see Patent Document 1). [0003] In recent years, systems using non-contact IC card and non-contact IC tags are being used with the aim of enhancing security. To apply the excellent characteristics of such non-contact IC cards, IC tags, and the like in a booklet, such as a passport and a savings passbook, it is proposed to form a non-contact type information medium by pinching an IC inlet, with an antenna that is connected to a non-contact IC module, between outer-cover base materials, and mounting the medium on the booklet by bonding it to a front cover or the like thereof. Since such a booklet enables electronic data to be entered to the IC inlet and printed, enhanced security characteristics and the like can be achieved. [0004] Patent Document 2 discloses one example of a booklet such as that described above. In this booklet, a non-contact type information medium is bonded to an inner face of a back cover of the booklet. The non-contact type information medium is configured such that, on a top-face side of a first base-material sheet, a second base-material sheet having an opening of a predetermined width is affixed to form a recess, an IC chip and an antenna coil attached thereto are provided in this recess, and an adhesive layer is provided on a bottom-face side of the first base-material sheet. Patent Document 1: Japanese Patent No. 3721520 Patent Document 2: Japanese Patent Application, First Publication No. 2002-42068 DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention [0005] However, in the conventional technology described above, when bonding an insulating base material and the like to an inlet wherein an IC module is mounted on an antenna sheet including an antenna coil, the bonded base material swells due to the thickness of a sealing resin section where an IC chip is sealed. Accordingly, as shown in FIG 20, in a conventional inlay 400, a base material 42 including an opening 42h corresponding to a sealing resin section 23 is bonded to an inlet 30 including an IC module 20 mounted on an antenna sheet 1, and the sealing resin section 23 is stored and exposed in the opening 42h of the base material 42. [0006] When a gap D forms between the sealing resin section 23 and the inside face of the opening 42h, there is a problem that a part of the wiring or the like of the inlet 30 is exposed in the opening 42h, and static electricity intrudes. When static electricity intrudes into a part of the wiring of the inlet 30, there is a danger of adversely affecting the IC module 20. To prevent formation of such a gap D, it is considered to use a material that is flexible and pliable as the base material 42, make the outer shape of the opening 42h smaller than the outer shape of the sealing resin section 23, and press the sealing resin section 23 into the opening 42h. [0007] However, while this can prevent generation of the gap D, there is a danger that, in pressing the sealing resin section 23 into the opening 42h, the external force will break the IC module 20. Also, when the sealing resin section 23 is pressed into the opening 42h, a part of the base material 42 rises onto the sealing resin section 23, and there is a danger that external force during a stamp test and the like will break the IC module 20. Therefore, to store and expose the sealing resin section 23 of the IC module 20 in the opening 42h, the outer shape of the opening 42h must be made larger than the outer shape of the sealing resin section 23. This makes it difficult to prevent generation of the gap D. [0008] Furthermore, since the inlay 400 is required to have a flat outer surface, it is subjected to a flatness test such as a ball-pen test. If a catch is generated at the gap D, or if a step g forms between an outer surface 42a of the base material 42 and an outer face 20a of the IC module 20, there are cases where the inlay 400 cannot satisfy the standard for passing the test. [0009] Furthermore, many conventional booklets such as that described above are made using paper and the like. Since chloride ions, water, and the like can easily permeate through paper, permeation of such substances sometimes leads to deterioration of the antenna and the like of the bonded non-contact type information medium. As a result, there is an adverse affect on the durability of the non-contact type information medium, leading to problems such as a possibility of a decline in the performance of the non-contact type information medium while the booklet is being used. [0010] Accordingly, this invention provides an inlay, an inlay with cover, and a data carrier with non-contact type IC, that can prevent infiltration of static electricity and satisfy the demand for flat outer surfaces. Means for Solving the Problem [0011] To solve the problems mentioned above, a transponder of the present invention includes an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet The transponder includes a sealing material having electrical insulation being provided between the IC module and an inside face of the opening. [0012] With this configuration, even when the outer shape of the opening is larger than the outer shape of the section of the IC module that is exposed in the opening, generating a gap between the inside face of the opening and the IC module, the insulating sealing material can fill in this gap. Therefore, it is possible to prevent externally generated static electricity from infiltrating through this gap, thereby preventing externally generated static electricity from adversely affecting the IC module. Moreover, even when exposed to a high-temperature environment or medical solutions, the sealing material can prevent infiltration of external substances such as air and water, thereby preventing external substances such as water from adversely affecting the IC module. Since the gap between the inside face of the opening and the IC module exposed in the opening is filled in using the sealing material, a catch at the gap during a flatness test such as a ball pen test can be prevented, making it possible to enhance the flatness and smoothness of the outer surface of the transponder. [0013] The sealing material of the transponder according to the present invention is arranged such as to cover the outer surface of the IC module exposed in the opening, and is formed such that an outer surface of the second base material and an outer surface of the sealing material are continuous and roughly flat. [0014] With this configuration, even if a step is generated between the outer surface of the second base material and the outer surface of the IC module exposed in the opening, since the outer surface of the second base material and the outer surface of the sealing material is formed roughly flat, the outer surface of the transponder can be made flat. Therefore, the flatness and smoothness of the outer surface of the transponder can be increased. [0015] In the transponder according to the present invention, a step between the outer surface of the second base material and the outer surface of the sealing material is no larger than 20 µm. [0016] With this configuration, the outer surface of the transponder can be formed roughly flat and roughly in the same plane, and can adequately satisfy the standard for passing a flatness test, such as a ball pen test [0017] In the transponder according to the present invention, the sealing material is formed such as to cover a connection section between the antenna coil and the IC module, and a jumper line that connects the antenna coil to the IC module. [0018] With this configuration, a connection section between the antenna coil and the IC module can be reinforced, thereby increasing the mechanical strength and the reliability of the connection section. [0019] In the transponder according to the present invention, the IC module includes a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip, and the longitudinal elastic modulus of the sealing material is less than the longitudinal elastic modulus of the sealing resin section. [0020] With this configuration, a shock applied against the transponder is dispersed into the sealing material as elastic energy. Consequently, the shock against the IC module can be reduced. Furthermore, the sealing material elastically deforms more easily than the sealing resin section of the IC module. Therefore, in a ball pen test, even if an external force received from the pen tip by the outer surface of the second base material makes a deformed indentation on the inlet side of the outer surface of the sealing material, when the pen tip moves from being on the outer surface of the second base material to being on the outer surface of the sealing material, the sealing material elastically deforms in a direction that reduces the step between the outer surface of the second base material and the outer surface of the sealing material (the inlet direction). This can reduce stress in the direction which the pen tip is proceeding in due to the step between the outer surface of the second base material and the outer surface of the sealing material. [0021] The sealing material of the transponder according to the present invention is a resin tape including a sticky material and a support. [0022] With this configuration, the arrangement of the sealing material can be facilitated, the manufacturing step of the transponder can be simplified, and the manufacturing cost can be reduced. [0023] The IC module of the transponder according to the present invention includes a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip; and the longitudinal elastic modulus of at least one of the sticky material and the support is less than the longitudinal elastic modulus of the sealing resin section. [0024] With this configuration, a shock applied against the transponder is dispersed into the sealing material as elastic energy. Consequently, the shock against the IC module can be reduced. Furthermore, the sealing material elastically deforms more easily than the sealing resin section of the IC module. Therefore, in a ball pen test, even if an external force received from the pen tip by the outer surface of the second base material makes a deformed indentation on the inlet side of the outer surface of the sealing material, when the pen tip moves from being on the outer surface of the second base material to being on the outer surface of the sealing material, the sealing material elastically deforms in a direction that reduces the step between the outer surface of the second base material and the outer surface of the sealing material (the inlet direction). Consequently, it is possible to reduce stress in the direction which the pen tip is proceeding in due to the step between the outer surface of the second base material and the outer surface of the sealing material. [0025] In the transponder according to the present invention, the first base material is a cover material. [0026] With this configuration, it becomes possible to provide a transponder with cover wherein infiltration of static electricity is prevented, and which has a flatter and smoother outer surface. Furthermore, by using a cover material as the first base material, the transponder with cover can be made thinner than one in which a cover is joined to the outer surface of the first base material. [0027] In the transponder according to the present invention, a cover is joined to at least one of the outer surface of the first base material and the outer surface of the second base material. [0028] With this configuration, it is possible to provide a transponder with cover wherein infiltration of static electricity is prevented, and which has a flatter outer surface. [0029] In the transponder according to the present invention, the antenna sheet and the sealing material are molded in a single piece. [0030] With this configuration, static electricity generated outside the transponder can be prevented from infiltrating through a gap between the antenna sheet and the sealing agent, whereby externally generated static electricity can be prevented from adversely affecting the IC module. [0031] The transponder according to the present invention includes a chloride ion-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module. [0032] With this configuration, deterioration of any of the antenna coil, the IC module, and the jumper line due to chloride ions from outside the transponder can be prevented. [0033] The transponder according the present invention includes a water-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module. [0034] With this configuration, deterioration of any of the antenna coil, the IC module, and the jumper line due to water from outside the transponder can be prevented. [0035] A booklet according to the present invention includes a transponder including an inlet including an antenna sheet, which includes an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet. A sealing material having electrical insulation is provided between the IC module and an inside face of the opening. Effect of the Invention [0036] According to the present invention, it is possible to provide a transponder and a booklet that can prevent infiltration of static electricity, and can satisfy a demand for a flat outer surface. BRIEF DESCRIPTION OF THE DRAWINGS [0037] FIG 1A is a plan view of an antenna sheet according to a first embodiment of the present invention. FIG IB is a bottom view of an antenna sheet according to the first embodiment of the present invention. FIG 2 A is a cross-sectional view of a connection section between a jumper line and an antenna circuit of an antenna sheet according to the first embodiment of the present invention. FIG 2B is a cross-sectional view of a connection section between a jumper line and an antenna circuit of an antenna sheet according to the first embodiment of the present invention. FIG. 3 A is a plan view of an IC module according to the first embodiment of the present invention. FIG 3B is a cross-sectional view along a line A-A' of an IC module according to the first embodiment of the present invention. FIG 4A is an enlarged plan view of an inlet according to the first embodiment of the present invention. FIG 4B is a cross-sectional view along a line B-B' of an inlet according to the first embodiment of the present invention. FIG 5 A is a plan view of an inlay according to the first embodiment of the present invention. FIG 5B is a partial cross-sectional view along a line C-C' of an inlay according to the first embodiment of the present invention. FIG 6 is a partial cross-sectional view corresponding to FIG 5B of an inlet according to a second embodiment of the present invention. FIG 7 is a partial cross-sectional view corresponding to FIG 5B of an inlet according to a third embodiment of the present invention. FIG 8 is a perspective view of the schematic configuration of an electronic passport according to an embodiment of the present invention. FIG 9 is a diagram of a booklet with a non-contact type information medium attached thereto according to a fourth embodiment of the present invention. FIG 10 is a diagram of a mold of an IC inlet of the same non-contact type information medium. FIG 11 is a cross-sectional view of the same non-contact type information medium attached to the same booklet 101. FIG. 12 is a diagram of a cut state of the same IC inlet when manufacturing the same non-contact type information medium. FIG 13 is a diagram showing dimensions of each part of the same non-contact type information medium in an example. FIG 14 A is a diagram showing an IC inlet in a modification of a non-contact type information medium of the present invention. FIG 14B is a diagram showing an IC inlet in a modification of a non-contact type information medium of the present invention. FIG 15 is a partial cross-sectional view along the line C-C' (FIG 5 A) of an inlay 40D according to a modification of the first embodiment of the present invention. FIG. 16 is a plan view of an inlay 40E according to a sixth embodiment of the present invention. FIG 17 is a partial cross-sectional view along the line D-D' (FIG 16) of an inlay 40E according to the sixth embodiment of the present invention. FIG 18 is a partial cross-sectional view along the line E-E' (FIG 16) of an inlay 40E according to the sixth embodiment of the present invention. FIG 19 is a partial cross-sectional view along the line F-F' (FIG 16) of an inlay 40E according to the sixth embodiment of the present invention. FIG 20 is a partial cross-sectional view corresponding to FIG 5B of a conventional inlay. Reference Symbols [0038] 1 Antenna sheet 2 Substrate (First base material) 4 Antenna coil 20 IC module 20a Outer surface 21 Lead frame 22 IC chip 23 Sealing resin section 30 Inlet 40,40B, 40C, 40D, 40E Inlay 42 Base material (Second base material) 42a Outer surface 42h, 42H Opening 43 Sealing material 43a Outer surface 44 Cover material 50 Sealing material 51 Adhesive 100 Electronic passport (inlay with cover, data carrier with non-contact type IC) 101,101A Booklet 110,110A Non-contact type information medium 112 Sheet 112 A Through hole 113 Antenna coil 114 ICchip 115 Porous base materials 116 Adhesive (chloride ion-resistant layer) BEST MODE FOR CARRYING OUT THE INVENTION [0039] Subsequently, a third embodiment of the present invention will be explained with reference to FIGS. 1A to 5A, and using FIG 7. The inlay 40C of this embodiment differs from that of described in the first embodiment in that the antenna coil 4 and the connection part of the IC module 20 are covered by the sealing material 43. Since the configuration is otherwise similar to the first embodiment, like parts are denoted with like reference numerals, and are not repetitiousiy explained. [0100] As shown in FIG 7, in the inlay 40C of this embodiment, the connection section between the antenna connecting lands 8 and 9 of the antenna coil 4 (see FIG 4A) and the antenna land 25 of the IC module 20 is covered with the sealing material 43, which is formed on the opposite side with the substrate 2 in between. The opening 42H formed in the base material 42 is formed such thin the opening on the inlet 30 side is larger than the opening on the outer surface 42a side, and a recess 42b is formed on the inlet 30 side of the base material 42. [0101] The inlay 40C can be manufactured by forming the opening 42H beforehand in the base material 42, and, in the second manufacturing method described in the first embodiment, using the sealing material 43 to cover the opposite side by pinching the antenna connecting lands 8 and 9 of the antenna coil 4 and the substrate of the connection section of the antenna land 25 of the IC module 20. [0102] In this embodiment, since the sealing material 43 covers the connection section between the antenna coil 4 and the IC module 20, it can reinforce the connection section between the antenna connecting lands 8 and 9 and the antenna land 25, thereby increasing the mechanical strength and the reliability of the connection section. As shown in FIG. 6, this embodiment can also be applied in a case where the outer surface 20a of the IC module 20 and the outer surface 42a of the base material 42 are roughly in the same plane. [0103] (Electronic Passport) Subsequently, an electronic passport 100 will be explained as one example of a data carrier with non-contact type IC and an inlay with cover. As shown in FIG 8, an electronic passport 100 includes the inlay 40 described above as its front cover. A cover material 44 is joined to one face of the inlay 40 and becomes the front cover of the electronic passport 100. [0104] When the cover material 44 is joined to the inlay 40 in this manner, the external appearance and texture of the electronic passport 100 including the inlay 40 can be made similar to a conventional passport. Also, since the inlay 40C prevents infiltration of static electricity, and has a outer surface with increased flatness, it becomes possible to provide the electronic passport 100 which has high reliability of data communication, enhanced ability to input characters and print a stamp, and a better external appearance. [0105] The present invention is not limited to the embodiment described above. For example, the antenna coil can be a needle-shaped wire-wound coil such as that disclosed in Japanese Patent No. 3721520. In this case, a material similar to the one that pinches the inlet in the embodiment described above can be used as a substrate (first base material) for the antenna sheet 1, making it possible to omit one of the base materials bonded to the outside of the inlet. Therefore, in comparison with a case where a cover material is joined to the outer surface of the substrate of the antenna sheet, the inlay with cover can be made thinner. [0106] When a cover material is used as the substrate (first base material) of the antenna sheet, and a similar base material having the opening described in the above embodiment is used as the second base material, the inlay with cover can be made even thinner and more flexible. [0107] While in the embodiment described above, a pressing step is introduced when manufacturing the inlay, the pressing step need not be performed. Even when the pressing step is not performed, the gap between the IC module and the inside face of the opening of the base material can be filled in using the sealing material. Instead of performing a pressing step, the outer surface of the base material and the outer surface of the sealing material can be flattened using, for example, a roller, a scraper, etc. [0108] The shape of the antenna coil need not be rectangular. Furthermore, the number of winds of the antenna coil 4 is also not limited to the embodiment described above. With regard to the material quality of the antenna circuit, it can be made from a material other than aluminum, such as, for example, gold, silver, or copper. [0109] While the above embodiment describes an electronic passport as an example of a data carrier with non-contact type IC including an inlay, the inlay of the present invention can also be used in, for example, electronic identification documents and various types of electronically confirmable activity history documents. [0110] A polyolefin synthetic sheet with a thickness of 178 µm was used as the base material 41, a polyolefin synthetic sheet with a thickness of 178 µm, and including an opening in a portion where the IC module will be arranged, was used as the base material 42, and an antenna sheet including an IC module and an antenna circuit was used. As the sealing material, a resin tape with a thickness of 50 µm and including a sticky material and a tape support of polyester resin was used. In the sealing material used here, the longitudinal elastic modulus of the polyester resin of the tape support is less than the longitudinal elastic modulus of the sealing resin section of the IC module. The base materials 41 and 42 were coated with an aqueous emulsion adhesive (EAA), and the sealing material including the resin tape was arranged on the IC module of the antenna sheet The base material 41, the antenna sheet, and the base material 42 were bonded in that order and pressurized, such that the IC module was aligned with the opening of the base material 42, thereby obtaining a sample for Example 1. Six of these were made, obtaining samples 1-1,1-2,1-3,1-4,1-5, and 1-6. [0111] When the sections of the obtained inlays were measured with an electron microscope, in each sample there was no gap between the inside face of the opening of the substrate and the sealing resin section of the IC module. The step between the outer surface of the sealing material covering the IC module and the outer surface of the base material including the opening was as follows: Sample 1-1 :4 urn Sample 1-2:11 µm Sample 1-3 :10 µm Sample 1-4 :15 urn Sample 1-5:9 µm Sample 1-6:9 µm [0112] (Static Electricity Test) A static electricity test was carried out in accordance with ISO10373-7 and JIS X6305-7. Firstly, an inlay such as that shown in FIG. 5 A was overturned and disposed on the base material including the opening. With the long side direction of the rectangular inlay as the left-right direction and the short side direction as the up-down direction, the inlay was arranged such thin the opening was at the top-right corner of the rectangle when viewed from above. Voltages of +6kV, -6kV, +8kV, and -8kV were applied in that order from the outer surface of the substrate where the opening was formed. Every time a different voltage value was applied, the basic operation of the IC chip was checked and the communication response of the inlay was measured. Each voltage was applied at a total of twenty-five positions, which were sequentially measured: dividing the vertical direction of the horizontal rectangular region having the antenna coil as its outer periphery into quarters, and dividing the horizontal direction into fifths, vertical × horizontal is 4 × 5 = 20 (20 positions), the center of the sealing resin section of the IC module (position center), on the substrate on the left side of the opening (position left), on the substrate on the right side of the opening (position right), on the substrate on the upper side of the opening (position up), and on the substrate on the lower side of the opening (position under). Table 1 shows measurements obtained in the static electricity test. In Table 1, symbol 'P' indicates that the communication response was excellent for two seconds or longer, and 'F' indicates that the communication response was poor. Also, '20' represents position 20, 'M' represents position center, 'L' represents position left, 'R' represents position right, 'Up' represents position up, and 'Un' represents position under. The apparatus used for communication response was a PR-450 UDM non-contact reader/writer manufactured by DENSO WAVE, the communication response being checked at a distance of 10 mm. [0113] Table 1 (Table Removed ) [0114] As shown in Table 1, in this embodiment, excellent communication responses were obtained at all applied voltages and at all positions in each of the samples 1-1 to 1-6. [0115] (Ball Pen Test) On the outer surface of the base material 42, a ball pen was made to travel along the long side direction of the antenna coil such as to pass over the IC module. The ball pen used was a commercially available ball pen with a ball diameter of 1 mm and a weight of 600 g, and it was made to travel at a speed of 25 mm/sec. After the ball pen had traveled back and forth 25 times, the basic operation of the IC chip was checked and the communication response of the inlay was measured. Table 2 shows measurement results of the ball pen test. In Table 2, 'OK' indicates an excellent communication response, and 'NG' indicates a poor communication response. The apparatus used for communication response was a PR-450 UDM non-contact reader/writer manufactured by DENSO WAVE, the communication response being checked at a distance of 10 mm. [0116] Table 2 (Table Removed ) [0117] As shown in Table 2, in this embodiment, all the samples 1-1 to 1-6 obtained excellent communication responses. [0118] (Stamp Test) A stamp was used to apply a weight to the outer surface of the substrate which the opening is formed in. The stamp used had a punch tip diameter of 10 mm. After the stamp had made 50 hits with a weight of 250 g at a fall height of 320 mm, the basic operation of the IC chip was checked and the communication response of the inlay was measured. Table 3 shows measurement results of the stamp test. In Table 3, 'OK' indicates an excellent communication response, and 'NG' indicates a poor communication response. The apparatus used for communication response was a PR-450 UDM non-contact reader/writer manufactured by DENSO WAVE, the communication response being checked at a distance of 10 mm. [0119] Table 3 (Table Removed ) [0120] As shown in Table 3, in this embodiment, all the samples 1-1 to 1-6 obtained excellent communication responses. [0121] Samples were made by the same method as in Example 1, except that the sealing material was not used. Six samples A-l, A-2, A-3, A-4, A-5, and A-6 were obtained. [0122] When the sections of the obtained inlays were measured with an electron microscope, in each sample, a gap of approximately 50 µm was generated between the inside face of the opening of the substrate and the sealing resin section of the IC module. The step between the outer surface of the sealing material covering the IC module and the outer surface of the base material including the opening was as follows: Sample A-l : 26 µm Sample A-2 : 21 µm Sample A-3 : 22 µm Sample A-4 : 27 µm Sample A-5 : 26 µm Sample A-6 : 25 µm [0123] When the static electricity test described above was carried out, as shown in Table 1, in sample A-l, there was a poor communication response when +6 kV was applied at position under (Un). In sample A-2, there was a poor communication response when -6 kV was applied at position left (L). In sample A-3, there was a poor communication response when +8 kV was applied at position right (R). In sample A-4, there was a poor communication response when +8 kV was applied at position under (Un). In sample A-5, there was a poor communication response when +8 kV was applied at position right (R). In sample A-6, there was a poor communication response when +8 kV was applied at position under (Un). [0124] When the ball pen test was carried out, as shown in Table 2, while there were poor communication responses in sample A-l, sample A-2, sample A-5, and sample A-6, excellent communication responses were obtained in sample A-3 and sample A-4. When the stamp test was carried out, as shown in Table 3, all the samples from A-l to A6 obtained poor communication responses. [0125] As indicated by these results, according to the embodiment using the sealing material, static electricity can be prevented from infiltrating through the gap, and a defect rate of roughly 0% can be achieved in the static electricity test. Whereas, in Comparative Example 1, which does not use a sealing material, the test results indicate that the probability of a poor communication response is extremely high. [0126] Subsequently, a sixth embodiment of the present invention will be explained. FIG. 16 is a plan view of an inlay 40E according to a sixth embodiment of the present invention. The plan view shown in FIG. 16 is the same as the plan view of the inlay 40 according to the first embodiment (FIG. 5A). Parts of the configuration which are the same are therefore designated by like reference numerals, and are not repetitiously explained. [0159] FIG 17 is a partial cross-sectional view along the line D-D' (FIG 16) of an inlay 40E according to a sixth embodiment of the present invention. In FIG 17, parts of the configuration which are the same as the cross-sectional view of the inlay according to the first embodiment (FIG. 5B) are designated by like reference numerals, and are not repetitiously explained. In the inlay 40E of FIG 17, the inlet 30 is pinched between the base material 41 and the base material 42 as in FIG 5B. However, in FIG 17, faces of the base materials 41 and 42 which contact the antenna sheet 1 are coated with an adhesive 51. A chloride ion-resistant substance that suppresses the permeation of chloride ions is mixed into the adhesive 51. [0160] FIG. 18 is a cross-sectional view along the line E-E' (FIG. 16) of the inlay 40E according to the sixth embodiment of the present invention. As shown in FIG. 18, an antenna coil 4 is provided on one face of the antenna sheet 1. A jumper line 14 is provided on another face of the antenna sheet 1. The base material 41 is arranged on the face of the antenna sheet 1 where the antenna coil 4 is provided. The base material 42 is arranged on the face of the antenna sheet 1 where the jumper line 14 is provided. A coating of adhesive 51 is applied to the face of the base material 41 that opposes the base material 42, and to the face of the base material 42 that opposes the base material 41. [0161] FIG. 19 is a cross-sectional view along the line F-F' (FIG. 16) of the inlay 40E according to the sixth embodiment of the present invention. The jumper line 14 is provided on one face of the antenna sheet 1. A wire 10 for connection to the antenna connecting land 9 is provided on the other face of the antenna sheet 1. The jumper line 14 and the wire 10 are electrically connected by a conductive connection section 52, which is provided in the opening of the antenna sheet 1. An opening is formed in the antenna sheet 1, the jumper line 14 and the wire 10 being connected via this opening. The base material 41 is arranged on the face of the antenna sheet 1 where the jumper line 14 is provided. The base material 42 is arranged on the face of the antenna sheet 1 where the wire 10 is provided. A coating of adhesive 51 is applied to the face of the base material 41 that opposes the base material 42, and to the face of the base material 42 that opposes the base material 41. [0162] According to the sixth embodiment of the present invention described above, since the adhesive 51 with an admixture of a chloride ion-resistant substance that suppresses permeation of chloride ions is applied to the face of the base material 41 that opposes the base material 42, and to the face of the base material 42 that opposes the base material 41, chloride ions from the outside can be prevented from infiltrating the inlay 40E, and deterioration of the metal of the antenna coil 4, the jumper line 14, the wire 10, and the like, can be prevented. [0163] While this embodiment describes examples of forming a layer of the adhesive 51 such as to cover the antenna coil 4 (FIG 18), forming a layer of the adhesive 51 such as to cover the IC module 20 (FIG 17), and forming a layer of the adhesive 51 such as to cover the jumper line 14 that connects the antenna coil 4 and the IC module 20 (FIGS. 18 and 19), the configuration is not limited to these. For example, the adhesive 51 can be formed such as to cover at least one or more of the antenna coil 4, the IC module 20, and the jumper line 14. Particularly, when the adhesive 51 is formed such as to cover the jumper line 14, which is comparatively weaker than the other wire sections, it becomes possible to prevent the jumper line 14 from chloride ions, and thereby to increase the reliability of the operation of the inlay 40E. [0164] While embodiments of the invention have been described above, the technical field of the invention is not limited to these embodiments, and can be modified in various ways without departing from the spirit or scope of the present invention. [0165] When the antenna sheet 1 shown in FIG 4B is pinched between a pair of base materials (third and fourth base materials) and made into a product, a storing section (an opening or a recess) having roughly the same shape as the antenna land 25 when viewed from above can be provided in the base material to be attached to the antenna land 25 side, and the antenna land 25 can be stored in this storing section. Furthermore, a storing section (an opening or a recess) having roughly the same shape as the sealing resin of the IC chip 22 when viewed from above can be provided in the base material to be attached to the opposite side to the antenna land 25 side, and the sealing resin of the IC chip 22 can be stored in this storing section. With this configuration, when the antenna sheet 1 is pinched between the pair of base materials and made into a product, the thickness of the product can be reduced, and the antenna sheet 1 can be more reliably fixed by the pair of base materials. [0166] For example, while in the description of the fourth embodiment, the adhesive 116 is resistant to chloride ions, the chloride ion-resistant layer can instead be formed using another chloride ion-resistant substance, such as an epoxy-based resin. In this case, the chloride ion-resistant layer can be formed by a method such as applying a coating to the IC inlet 111, or it can be formed on the faces of the porous base materials 115 that will be joined to the IC inlet 111. In the latter case, a chloride ion-resistant layer and an adhesive can be formed on the surfaces of the porous base materials using a printing device and the like that is capable of multi-color printing. This enables the two layers to be formed efficiently without greatly modifying the process. [0167] The through hole formed in the sheet 112 is not limited to the single hole described in the embodiments. For example, a plurality of through holes 112B and 112C can be provided, as in the modifications shown in FIG 14A and FIG 14B. This configuration achieves a plurality of dispersed points where the porous base materials are firmly joined together, obtaining a highly secure information medium which is more difficult to peel off. [0168] While each of the embodiments describes an example of an information medium wherein an IC inlet is pinched between porous base materials, the information medium can be configured without providing porous base materials, and with a chloride ion-resistant layer formed directly on the IC inlet. While such an information medium is slightly less smooth than one that includes porous base materials, it can be applied in a booklet by appropriately selecting an adhesive for joining it to the front cover member and the inner bonding sheet. It then becomes possible to suppress deterioration of the antenna coil and ensure the functions of the information medium, while using the booklet over a long time period. [0169] Furthermore, the fourth and the sixth embodiments described above can be applied in any of the other embodiments. For example, the antenna coil 4 of the first to the third embodiments can be covered with the adhesive 116 which constitutes the chloride ion-resistant layer of the fourth embodiment. It is also acceptable to coat the antenna coil 4 with an adhesive that is not resistant to chloride ions, and then cover that adhesive with a chloride ion-resistant layer. [0170] In the fourth embodiment described above, sheet-like porous base materials 115 that pinch the antenna coil 113 such as to cover it can be provided on the entirety of both faces of the sheet 112, and the adhesive 116 which constitutes a chloride ion-resistant layer can be formed on faces of the porous base materials 115 that oppose the sheet 112. This enables the chloride ion-resistant to be easily formed; in addition, both faces of the non-contact type information medium 110 can be made flat, and, when the information medium 110 is attached to a booklet, projections and recesses are less likely to be generated on the page it is attached to. [0171] As described above in the fourth embodiment, when the porous base materials 115 are affixed by the adhesive 116 to the sheet 112, since the adhesive 116 is resistant to chloride ions, it functions as a chloride ion-resistant layer. This makes it possible to form the chloride ion-resistant layer at the same time as affixing the porous base materials, thereby increasing the manufacturing efficiency. [0172] As described above in the fourth embodiment, the sheet 112 includes a through hole 112A penetrating the thickness direction of the sheet 112, and the porous base materials 115 are joined at the through hole 112A without the sheet 112 in between, whereby the porous base materials 115 are joined together directly at the through hole. Therefore, the porous base materials 115 can be joined more firmly, and security can be increased. [0173] Furthermore, as described in the fourth embodiment, the cross-sectional area in the direction that orthogonally intersects the axis line of the through hole 112A is given a value of not less than 60% of the area of the region inside the loop of the antenna coil 113; also, the area of the sheet 112 at the time of joining it to the porous base materials 115 is not less than 3% and less than 20% of the area of the porous base materials 115, whereby the porous base materials 115 can be more firmly joined. [0174] Furthermore, as described in the fourth embodiment, since the antenna coil 113 includes aluminum, it can be formed inexpensively and reliably. [0175] Furthermore, as described in the fourth embodiment, by applying the non-contact type information medium 110 in the booklet 101, the antenna coil 113 of the non-contact type information medium 110 attached to the booklet 101 is less likely to deteriorate, and can be used stably for a long period of time. [0176] While the fourth embodiment describes a case where the adhesive 116 constituting a chloride ion-resistant layer is formed such as to cover the antenna coil 113, this is not limitative of the invention. For example, in addition to or instead of a chloride ion-resistant layer, a water-resistant layer can be formed such as to cover the antenna coil 113. As the material for a water-resistant layer, it is possible to use rubber latex such as natural rubber latex and styrene butadiene copolymer latex, vinyl chloride-vinyl acetate-based resin, polyester-based resin, polyurethane-based resin, a (meta)acrylic-based resin such as (meta)acrylate-styrene acid/alkyl ester, (meta)acrylic acid/alkyl ester copolymer, or an epoxy-based resin, etc. Industrial applicability [0177] The present invention can be applied in an antenna sheet, a transponder, a booklet, and the like, which can prevent infiltration of static electricity, and can satisfy a demand for smooth outer surfaces. CLAIMS 1. A transponder which comprises an inlet comprising an antenna sheet, which comprises an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet, the transponder comprising: a sealing material having electrical insulation being provided between the IC module and an inside face of the opening. 2. The transponder according to claim 1, wherein the sealing material is arranged such as to cover the outer surface of the IC module exposed in the opening, and is formed such that an outer surface of the second base material and an outer surface of the sealing material are continuous and roughly flat. 3. The transponder according to claim 2, wherein a step between the outer surface of the second base material and the outer surface of the sealing material is no larger than 20 µm. 4. The transponder according to one of claims 1 to 3, wherein the sealing material is formed such as to cover a connection section between the antenna coil and the IC module, and a jumper line that connects the antenna coil to the IC module. 5. The transponder according to one of claims 1 to 4, wherein the IC module comprises a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip; and the longitudinal elastic modulus of the sealing material is less than the longitudinal elastic modulus of the sealing resin section. 6. The transponder according to one of claims 1 to 4, wherein the sealing material is a resin tape comprising a sticky material and a support. 7. The transponder according to claim 6, wherein the IC module comprises a lead frame, an IC chip mounted on the lead frame, and a sealing resin section which seals the IC chip; and the longitudinal elastic modulus of at least one of the sticky material and the support is less than the longitudinal elastic modulus of the sealing resin section. 8. The transponder according to one of claims 1 to 7, wherein the first base material is a cover material. 9. The transponder according to one of claims 1 to 7, wherein a cover is joined to at least one of the outer surface of the first base material and the outer surface of the second base material. 10. The transponder according to claim 1, wherein the antenna sheet and the sealing material are molded in a single piece. 11. The transponder according to claim 1, comprising a chloride ion-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module. 12. The transponder according to claim 1, comprising a water-resistant layer formed such as to cover at least one or more of the antenna coil, the IC module, and a jumper line that connects the antenna coil to the IC module. 13. A booklet which comprises a transponder comprising: an inlet comprising an antenna sheet, which comprises an antenna coil on a flexible first base material, and an IC module connected to the antenna coil, and a second base material, which has an opening for exposing at least a part of the IC module and is bonded to the inlet; a sealing material having electrical insulation being provided between the IC module and an inside face of the opening.