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"Wave Dielectric Transmission Device, Manufacturing Method Thereof, And In Millimeter Wave Dielecric Transmission Method"

Abstract: Provided is an in-millimeter wave dielectric transmission device including a first signal processing board for processing a millimeter wave signal, a second signal processing board signal-coupled to the first signal processing board to receive the millimeter wave signal and perform signal processing with respect to the millimeter wave signal, and a viscoelastic member provided between the first signal processing board and the second signal processing board and having a predetermined relative dielectric constant and a predetermined dielectric dissipation factor. The viscoelastic member constitutes a dielectric transmission path. With such a configuration, the viscoelastic member absorbs vibration when external force is pplied to the signal processing boards, so that! vibration of the first signal processing board and the second signal processing board can be reduced, and a millimeter wave signal between the signal processing boards can be transmitted through the viscoelastic member at a high speed without using connectors and cables.

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Patent Information

Application #
Filing Date
11 March 2011
Publication Number
49/2011
Publication Type
INA
Invention Field
PHYSICS
Status
Email
remfry-sagar@remfry.com
Parent Application

Applicants

SONY CORPORATION
1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN

Inventors

1. HIROFUMI KAWAMURA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN
2. YASUHIRO OKADA
C/O SONY CORPORATION, 1-7-1 KONAN, MINATO-KU, TOKYO, 108-0075, JAPAN

Specification

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