Updated about 2 months

Polypaste 3 P

Documents

Trademark Information

Application ID 3924622
Status Registered
Date of Application 23 August 2018
Class(es) 1
Type Word
Registration State Maharashtra
Country India
Published Journal 2004
Details [CLASS : 1] Chemicals used in industry; tempering and soldering preparations; brazing fluxes; brazing preparations; soldering fluxes; separating and unsticking preparations; Chemicals for soldering; brazing fluxes; welding chemicals; protective gases for welding; ceramic compositions for sintering [granules and powders]

Proprietor

Ewac Alloys Limited Body

Attorney

Krishna & Saurastri Associates Llp

Documents

Examination Report 2018-09-25

Uploaded Documents

1 TM-A(TRADE MARKS APPLICATION) 2018-08-23
2 Reply to Exam Report (MIS-R) 2018-10-25
3 Documents in support of Show cause Hearing (SCH) 2020-02-28
4 Journal Copy 2021-07-07
5 Certificate 2021-10-30

Correspondence and Notices

1 Hearing Notice (Show Cause) 8659874 4318169 09/08/2019
2 Hearing Notice (Adjourned) 9116194 4552284 20/11/2019
3 Hearing Notice (Adjourned) 9638420 4755825 30/01/2020
4 Hearing Notice (Show Cause) 11419705    
5 Tribunal Accepted Notice For : 3924622 11583442 5207605 02/06/2021

Frequently Asked Questions

Date on which the trademark application was filed with TMO?

Polypaste 3 p was applied on 23 August 2018.

Who is the trademark proprietor?

Trademark application was filed by Ewac Alloys Limited Body.

Trademark application is filed under which trademark class?

Trademark application has been filed under following classes.
1

Trademark application is at what stage of trademark process?

As per IP India, trademark application is on the following stage:
Registered.

What is the Listed Application ID of the Trademark?

Listed application Id of Polypaste 3 p is 3924622.

Who filed the trademark on behalf of the proprietor?

Trademark attorney of the Polypaste 3 p is Krishna & Saurastri Associates Llp.

Is the Trademark word, color or device mark?

Polypaste 3 p is a WORD as per IP India data.