Description:FIELD OF THE INVENTION

[0001] The present disclosure relates to wearable devices. More particularly, the present invention relates to a head wearable device capable of dissipating heat from such device.
BACKGROUND

[0002] A head wearable device, for example, a helmet is a safety gear worn by a driver and a pillion rider while driving the vehicle to protect the head of the wearer in case of an accident. With advancements in technology, the head wearable devices are integrated with various electronic devices/components for performing various functions. For instance, a head wearable device may be configured to provide/collect different data, for example, a speed of the vehicle, an inclination of the vehicle, and alerts to prevent an accident. The head wearable device can be connected to a wireless communication device through which the driver can receive a call or listen to music while riding the vehicle.
[0003] Generally, a plurality of electronic components is compactly disposed on a same plane in a casing of the head wearable device. Each electronic component maintains a form factor in the casing to ensure efficient operation. However, during the operation of the plurality of electronic components, the plurality of electronic components creates a hotspot and generates heat in the casing. The heat generated may gradually decrease the efficiency of each electronic component.
[0004] Thus, in light of the foregoing discussions, it is desirable to provide a cooling mechanism in the casing that dissipates heat from the casing.
SUMMARY
[0005] This summary is provided to introduce a selection of concepts, in a simplified format, that are further described in the detailed description of the invention. This summary is neither intended to identify key or essential inventive concepts of the invention and nor is it intended for determining the scope of the invention.
[0006] In an embodiment, a head wearable device is disclosed. The head wearable device includes a casing and a cooling module. The casing is adapted to accommodate at least one electronic component. The cooling module is disposed in the casing. The cooling module is adapted to conduct heat from the at least one electronic component. The cooling module includes at least one heat-conducting member and at least one heat-exchanging member. The at least one heat-conducting member is disposed within the casing. The at least one heat-conducting member is adapted to form a thermal contact with the at least one electronic component. The at least one heat-conducting member conducts heat from the at least one electronic component. The at least one heat-exchanging member is disposed on the casing and at least partially exposed to ambient air. A portion of the at least one heat-exchanging member is adapted to be in a thermal contact with the at least one heat-conducting member such that the conducted heat from the at least one heat-conducting member is dissipated into the ambient air.
[0007] The present disclosure provides the head wearable device with the cooling module to dissipate heat from the casing of the head wearable device. The at least one heat-conducting member and the at least one heat-exchanging member of the cooling module ensure efficient heat dissipation from the casing, thus maintaining the efficient operation of the at least one electronic device.
[0008] To further clarify advantages and features of the present invention, a more particular description of the invention will be rendered by reference to specific embodiments thereof, which is illustrated in the appended drawings. It is appreciated that these drawings depict only typical embodiments of the invention and are therefore not to be considered limiting of its scope. The invention will be described and explained with additional specificity and detail with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS

[0009] These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
Figure 1A illustrates a side view of a head wearable device, according to an embodiment of the present disclosure;
Figure 1B illustrates an isometric view of a casing of the head wearable device, according to an embodiment of the present disclosure;
Figure 1C illustrates a front view of the casing having a cooling module, according to an embodiment of the present disclosure;
Figures 2A and 2B illustrate different isometric views of the cooling module, according to an embodiment of the present disclosure;
Figure 2C illustrates a planar schematic view of the cooling module, according to another embodiment of the present disclosure;
Figure 3A illustrates an isometric view of the cooling module, according to yet another embodiment of the present disclosure;
Figure 3B illustrates a sectional view of the cooling module as shown in Figure 3A, according to yet another embodiment of the present disclosure; and
Figures 4A-4C illustrate different views of the head wearable device depicting the dissipation of heat by the cooling module, according to an embodiment of the present disclosure.

[0010] Further, skilled artisans will appreciate that elements in the drawings are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, a plurality of components of the device may have been represented in the drawings by conventional symbols, and the drawings may show only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the drawings with details that will be readily apparent to those of ordinary skill in the art having benefit of the description herein.
DETAILED DESCRIPTION OF FIGURES

[0011] For the purpose of promoting an understanding of the principles of the For the purpose of promoting an understanding of the principles of the present disclosure, reference will now be made to the various embodiments and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the present disclosure is thereby intended, such alterations and further modifications in the illustrated system, and such further applications of the principles of the present disclosure as illustrated therein being contemplated as would normally occur to one skilled in the art to which the present disclosure relates.
[0012] It will be understood by those skilled in the art that the foregoing general description and the following detailed description are explanatory of the present disclosure and are not intended to be restrictive thereof.
[0013] Whether or not a certain feature or element was limited to being used only once, it may still be referred to as “one or more features” or “one or more elements” or “at least one feature” or “at least one element.” Furthermore, the use of the terms “one or more” or “at least one” feature or element do not preclude there being none of that feature or element, unless otherwise specified by limiting language including, but not limited to, “there needs to be one or more…” or “one or more elements is required.”
[0014] Reference is made herein to some “embodiments.” It should be understood that an embodiment is an example of a possible implementation of any features and/or elements of the present disclosure. Some embodiments have been described for the purpose of explaining one or more of the potential ways in which the specific features and/or elements of the proposed disclosure fulfil the requirements of uniqueness, utility, and non-obviousness.
[0015] Use of the phrases and/or terms including, but not limited to, “a first embodiment,” “a further embodiment,” “an alternate embodiment,” “one embodiment,” “an embodiment,” “multiple embodiments,” “some embodiments,” “other embodiments,” “further embodiment”, “furthermore embodiment”, “additional embodiment” or other variants thereof do not necessarily refer to the same embodiments. Unless otherwise specified, one or more particular features and/or elements described in connection with one or more embodiments may be found in one embodiment, or may be found in more than one embodiment, or may be found in all embodiments, or may be found in no embodiments. Although one or more features and/or elements may be described herein in the context of only a single embodiment, or in the context of more than one embodiment, or in the context of all embodiments, the features and/or elements may instead be provided separately or in any appropriate combination or not at all. Conversely, any features and/or elements described in the context of separate embodiments may alternatively be realized as existing together in the context of a single embodiment.
[0016] Any particular and all details set forth herein are used in the context of some embodiments and therefore should not necessarily be taken as limiting factors to the proposed disclosure.
[0017] The terms “comprises”, “comprising”, or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such process or method. Similarly, one or more devices or sub-systems or elements or structures or components proceeded by “comprises... a” does not, without more constraints, preclude the existence of other devices or other sub-systems or other elements or other structures or other components or additional devices or additional sub-systems or additional elements or additional structures or additional components.
[0018] Embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings.
[0019] Figure 1A illustrates a side view of a head wearable device 100, according to an embodiment of the present disclosure. Figure 1B illustrates an isometric view of a casing 102 of the head wearable device 100, according to an embodiment of the present disclosure. Figure 1C illustrates a front view of the casing 102 having a cooling module 104, according to an embodiment of the present disclosure.
[0020] The head wearable device 100 may be worn either by a primary rider or a pillion rider. The head wearable device 100 protects the rider and the pillion rider from various injuries that they would otherwise suffer in case of an accident. The head wearable device 100 may include various electronic components for performing various functions, such as providing access to an infotainment system, for example, receiving a call, and accessing songs to the driver.
[0021] In the illustrated embodiment, the head wearable device 100 may include a helmet structure, without departing from the scope of the present disclosure. The helmet structure may include a front portion 108a, a rear portion 108b, and an intermediate curved portion 108c. The intermediate curved portion 108c may extend between the front portion 108a and the rear portion 108b. The intermediate curved portion 108c may be adapted to guide ambient air to the rear portion 108b of the helmet structure. In particular, when the primary rider or the pillion rider with the head wearable device 100 rides the vehicle, then the ambient air is guided along the intermediate curved portion 108c to the rear portion 108b.
[0022] The head wearable device 100 may include, but is not limited to, the casing 102 and the cooling module 104 details of which are explained in subsequent paragraphs.
[0023] In an embodiment, the casing 102 may be disposed in the head wearable device 100. In the illustrated embodiment, the rear portion 108b of the helmet structure may include a groove 110. The groove 110 may be adapted to receive the casing 102 in the helmet structure.
[0024] In an embodiment, the casing 102 may be detachably attached to the rear portion 108b, without departing from the scope of the present disclosure. In another embodiment, the casing 102 may be integrally formed with the rear portion 108b, without departing from the scope of the present disclosure. Further, the casing 102 may have a curved profile, without departing from the scope of the present disclosure.
[0025] In an embodiment, the casing 102 may be adapted to accommodate at least one electronic component 106. The at least one electronic component 106 may be embodied as a heat-dissipating component. In such an embodiment, the at least one electronic component 106 may include, but is not limited to, a first electronic component 106A and a second electronic component 106B (as shown in Figure 2A). The first electronic component 106A may be an inductor coil with a circuit board. Further, the second electronic component 106B may be a control unit, without departing from the scope of the present disclosure.
[0026] In an embodiment, the cooling module 104 may be disposed in the casing 102. In an embodiment, the cooling module 104 may be disposed in the casing 102 by a potting process, without departing from the scope of the present disclosure. In another embodiment, the cooling module 104 may be disposed in the casing 102 by various attachments means, for example, fasteners, without departing from the scope of the present disclosure. The cooling module 104 may be compressed and form a thermal contact with the at least one electronic component 106 such that a form factor of the at least one electronic component 106 is maintained, thus ensuring the efficient operation of the at least one electronic component 106. The cooling module 104 may be adapted to conduct heat from the at least one electronic component 106. Further, the constructional and operational aspects of the cooling module 104 are explained in detail in conjunction with Figures 2A to 4B.
[0027] Figures 2A and 2B illustrate different isometric views of the cooling module 104, according to an embodiment of the present disclosure. Figure 2C illustrates a planar schematic view of the cooling module 104, according to another embodiment of the present disclosure. Figure 3A illustrates an isometric view of the cooling module 104, according to yet another embodiment of the present disclosure. Figure 3B illustrates a sectional view of the cooling module 104 as shown in in Figure 3A, according to yet another embodiment of the present disclosure.
[0028] In an embodiment, the cooling module 104 may include at least one heat-conducting member 214 and at least heat-exchanging member 216 details of which are explained in the subsequent paragraphs.
[0029] The at least one heat-conducting member 214 may be disposed within the casing 102. The at least one heat-conducting member 214 may form a thermal contact with the at least one electronic component 106. In an embodiment, at least one heat-conducting member 214 may be attached with at least one of the first electronic component 106A and the second electronic component 106B by different attachments means, for example, adhesives, without departing from the scope of the present disclosure. The at least one heat-conducting member 214 may conduct heat from the at least one electronic component 106.
[0030] In the illustrated embodiment, referring to Figures 2A-2C, the at least one heat-conducting member 214 may include a secondary heat sink 204. In one embodiment, referring to Figures 2A-2B, the secondary heat sink 204 may be disposed between the first electronic component 106A and the second electronic component 106B. In another embodiment, referring to Figure 2C, the secondary heat sink 204 may be disposed between multiple electronic components 106 (106A ….106N) and the at least one heat-exchanging member 216, where the at least one electronic component 106 disposed adjacent to each other within the casing 102, without departing from the scope of the present disclosure.
[0031] In an embodiment, the secondary heat sink 204 may be formed by a metallic material, such as aluminum and steel, or an alloy, without departing from the scope of the present disclosure. In another embodiment, the secondary heat sink 204 may be a vapour chamber, without departing from the scope of the present disclosure.
[0032] In an embodiment, the secondary heat sink 204 may include at least one lateral surface 204A and at least one peripheral surface 204B. The at least one lateral surface 204A may be adapted to be in thermal contact with the at least one electronic component 106. In an embodiment, the at least one lateral surface 204A may include a top lateral surface and a bottom lateral surface. Further, referring to Figures 2A and 2B, the top lateral surface may be adapted to be in thermal contact with the first electronic component 106A, and the bottom lateral surface may be adapted to be in thermal contact with the second electronic component 106B. The at least one lateral surface 204A may be adapted to conduct the heat from the at least one electronic component 106 through at least one heat-spreading member 208.
[0033] In an embodiment, the at least one heat-spreading element 208 may be disposed between the at least one electronic component 106 and at least one lateral surface 204A of the secondary heat sink 204. The at least one heat-spreading element 208 may be adapted to conduct the heat from the at least one electronic component 106 and spread the conducted heat evenly/uniformly. The heat may be spread such that the conducted heat may be transferred across the at least one lateral surface 204A of the secondary heat sink 204. In an embodiment, the at least one heat-spreading element 208 may have a predetermined thickness in a range of 0.1mm to 0.3mm, without departing from the scope of the present disclosure. In an embodiment, the at least one heat-spreading element 208 may have a predetermined thermal conductivity in a range of 1495 W/mK to 1500 W/mK, without departing from the scope of the present disclosure.
[0034] In the illustrated embodiment, referring to Figure 2B, the at least one heat-spreading element 208 may include a first heat-spreading element 208A and a second heat-spreading element 208B. The first heat-spreading element 208A may be disposed below the first electronic component 106A. The first heat-spreading element 208A may be adapted to form thermal contact with the top lateral surface and the first electronic component 106A. The first heat-spreading element 208A may be adapted to conduct the heat from the first electronic component 106A and spread the conducted heat. Further, the first heat-spreading element 208A may be adapted to transfer the conducted heat across the top lateral surface.
[0035] Further, the second heat-spreading element 208B may be disposed above the second electronic component 106B. The second heat-spreading element 208B may be adapted to form the thermal contact with the bottom lateral surface and the second electronic component 106B. The second heat-spreading element 208B may be adapted to conduct the heat from the second electronic component 106B and spread the conducted heat. Further, the second heat-spreading element 208B may be adapted to transfer the conducted heat across the bottom lateral surface.
[0036] In an embodiment, each of the first heat-spreading element 208A and the second heat-spreading element 208B may be embodied as a graphite sheet, without departing from the scope of the present disclosure. In such embodiment, the heat dissipated from the at least one electronic component 106 may be concentrated locally and create a hotspot based on a position of the at least one electronic component 106. Further, the graphite sheet conducts the heat and spreads the conducted heat uniformly and evenly on a larger surface of the graphite sheet. This configuration ensures the spreading of the conducted heat on the larger surface area. Further, this configuration also ensures efficient transferring of the conducted heat to the at least one heat-conducting member 214.
[0037] Further, in an embodiment, an insulation sheet 210 may be disposed between the at least one heat-spreading element 208 and the at least one electronic component 106, without departing from the scope of the present disclosure. The insulation sheet 210 may separate the at least one electronic component 106 with the at least one heat-spreading element 208. This configuration eliminates the possibility of short-circuiting in the casing 102, when each of the at least one heat-spreading element 208 and the at least one electronic component 106 have an electrically conductive property.
[0038] In an embodiment, the at least one peripheral surface 204B of the secondary heat sink 204 may be adapted to be in thermal contact with the at least one heat-exchanging member 216. As explained earlier, the secondary heat sink 204 may be adapted to conduct heat from the at least one electronic component 106, i.e., the first electronic component 106A and the second electronic component 106B, through the at least one heat-spreading element 208. Further, the secondary heat sink 204 transfers the conducted heat to the at least one heat-exchanging member 216.
[0039] In an embodiment, the at least heat-conducting material 214, i.e., the secondary heat sink 204, may transfer the conducted heat to the at least one heat-exchanging member 216 through a thermal interfacing member 206. Additionally, the at least one heat-conducting member 214 may also be adapted to dissipate the conducted heat by a plurality of processes well known in the present state of the art, for example, conduction, convection, and radiation, without departing from the scope of the present disclosure.
[0040] In an embodiment, the thermal interfacing member 206 may be disposed between the at least one heat-conducting member 214 and the at least one heat-exchanging member 216. The thermal interfacing member 206 may be adapted to transfer the conducted heat from the at least one heat-conducting member 214 to the at least one heat-exchanging member 216. The thermal interfacing material 206 may ensure a reduction of thermal resistance between the at least one heat-conducting member 214 and the at least one heat-exchanging member 216. Further, the thermal interfacing material 214 may provide a larger surface area to transfer the conducted heat from the at least one heat-conducting member 214 to the at least one heat-exchanging member 216. In an embodiment, the thermal interfacing member 206 may be a plurality of thermal pads, silicon material, thermal grease, etc., without departing from the scope of the present disclosure. In another embodiment, one or more materials, for example, Phase Change Material (PCM) material, and/or potting material, etc. may act as the thermal interfacing member 206. Further, the one or more materials may be disposed between the at least one heat-conducting member 214 and the at least one heat-exchanging member 216. The one or more materials may be adapted to conduct the heat from the at least one heat-conducting member 214 to the at least one heat-exchanging member 216, without departing from the scope of the present disclosure.
[0041] In an embodiment, the at least one heat-exchanging member 216 may be disposed on the casing 102 and at least partially exposed to ambient air. In such an embodiment, the at least one heat-exchanging member 216 may be integrated with the casing 102 via an insert molding mechanism, without departing from the scope of the present disclosure. The at least one heat-exchanging member 216 may be insert-molded in an enclosure formed on the casing 102. The enclosure may be made up of a plastic material, without departing from the scope of the present disclosure. In another embodiment, the at least one heat-exchanging member 216 may be detachably attached to the casing 102, without departing from the scope of the present disclosure. In such an embodiment, the at least one heat-exchanging member 216 may be disposed in the enclosure and is detachably attached to the casing 102 with adhesives, without departing from the scope of the present disclosure.
[0042] Further, a portion of the at least one heat-exchanging member 216 may be adapted to be in a thermal contact with the at least one heat-conducting member 214. The at least one heat-exchanging member 216 may be adapted to receive the conducted heat from the at least one heat-conducting member 216 and dissipate the conducted heat in the ambient air. In an embodiment, the at least one heat-exchanging member 216 may include a primary heat sink 202, without departing from the scope of the present disclosure. In an embodiment, the primary heat sink 202 may be made up of a metallic material, such as aluminum and steel, or an alloy, without departing from the scope of the present disclosure. In another embodiment, the primary heat sink 202 may be made up of any material having higher heat conductivity, without departing from the scope of the present disclosure.
[0043] The primary heat sink 202 may include a conducting surface 202A and a plurality of fins 202B. In an embodiment, the conducting surface 202A may be in thermal contact with the secondary heat sink 204. In such an embodiment, the conducting surface 202A may be in thermal contact with the at least one peripheral surface 204B of the secondary heat sink 204. Further, the plurality of fins 202B may be formed opposite to the conducting surface 202A. The plurality of fins 202B may be adapted to be exposed in the ambient air. In an embodiment, the plurality of fins 202B may be continuous rectangular fins disposed parallel with each other, without departing from the scope of the present disclosure. In another embodiment, the plurality of fins 202B may have any profile that may be compatible to dissipate heat in the ambient air, without departing from the scope of the present disclosure.
[0044] In yet another embodiment, referring to Figures 3A-3B, the at least one heat-conducting member 214 may be at least one of a potting material, a Phase Change Material (PCM), an epoxy, an insulation sheet, a graphite sheet, and a thermal pad, without departing from the scope of the present disclosure. In such embodiment, the at least one heat-conducting member 214 may be disposed between the first electronic component 106A and the second electronic component 106B. For instance, the PCM may be poured in a case (not shown) disposed between the first electronic component 106A and the second electronic component 106B. In another instance, the thermal pad may be attached to one of the first electronic component 106A and the second electronic component 106B by adhesives. Further, the at least one heat-conducting member 214 may be adapted to conduct heat from the first electronic component 106A and the second electronic component 106B. The at least one heat-conducting member 214 may be adapted to transfer the conducted heat to the at least one heat-exchanging member 216 through the thermal interfacing member 206. The at least one heat-exchanging member 216 may be the primary heat sink 202, without departing from the scope of the present disclosure.
[0045] Figures 4A-4C illustrate different views of the head wearable device 100 depicting the dissipation of the heat by the cooling module 104, according to an embodiment of the present disclosure.
[0046] As explained earlier, the at least one electronic component 106 dissipates the heat. The heat as dissipated may be conducted by the at least one heat-spreading element 208. Further, the at least one heat-spreading element 208 may spread the conducted heat and transfer the conducted heat to the at least one heat-conducting member 214. Further, the at least one heat-conducting member 214 may be adapted to transfer the conducted heat to the at least one heat-exchanging member 216 through the thermal interfacing member 206.
[0047] The at least one heat-exchanging member 216 may receive the conducted heat and dissipate the conducted in the ambient air. Particularly, when the intermediate curved portion 108c guides the ambient air to the rear portion 108b, by a Coanda effect, the guided ambient air comes in contact with the at least one heat-exchanging member 216. Further, the at least one heat-exchanging member 216, particularly, the plurality of fins 202B, dissipates the conducted heat in the ambient air. Additionally, when a rider rides a vehicle while wearing the head wearable device 100, the flow of ambient air increases. This increases the dissipation of conducted heat from the head wearable device 100 by a forced convection process. Particularly, when the mass flow rate of the ambient air towards the at least one exchanging member 216 increases, this increases the coefficient of convection and thus, increases the dissipation of the conducted heat from the one heat-exchanging member 216.
[0048] As would be gathered, the present disclosure discloses the cooling module 104 to dissipate heat from the casing 102 of the head wearable device 100. The at least one heat-conducting member 214 and the at least one heat-exchanging member 216 ensure efficient heat dissipation from the casing 102 while maintaining the form factor of the at least one electronic component 106, thus maintaining the efficient operation of the at least one electronic component 106. The at least one heat-exchanging member 216 in the enclosure also increases the strength of the casing 102, thus ensuring a rigid structure of the casing 102. Particularly, the enclosure is made up of the plastic material and the at least one heat-exchanging member 2l6 is made of the metallic material. Further, the at least one heat-exchanging member 2l6 is molded in the enclosure. Further, the enclosure with the at least one heat-exchanging member 2l6 is attached to the casing 102, thus, improves the strength of the casing 102. Additionally, the enclosure ensures insulation in the casing 102. Further, the layout of the casing 102 in the head wearable device 100 ensures maximum flow of the ambient air towards the casing 102 resulting in the increased dissipation of the conducted heat, and thus cooling the casing 102. This configuration also ensures the safety of the rider and maintains the aesthetics of the head wearable device 100.
[0049] In this application, unless specifically stated otherwise, the use of the singular includes the plural and the use of “or” means “and/or.” Furthermore, use of the terms “including” or “having” is not limiting. Any range described herein will be understood to include the endpoints and all values between the endpoints. Features of the disclosed embodiments may be combined, rearranged, omitted, etc., within the scope of the invention to produce additional embodiments. Furthermore, certain features may sometimes be used to advantage without a corresponding use of other features.
, Claims:1. A head wearable device (100), comprising:
a casing (102) adapted to accommodate at least one electronic component (106);
a cooling module (104) disposed in the casing (102) and adapted to conduct heat from the at least one electronic component (106), the cooling module (104) comprising:
at least one heat-conducting member (214) disposed within the casing (102), and adapted to form a thermal contact with the at least one electronic component (106), wherein the at least one heat-conducting member (214) conducts heat from the at least one electronic component (106); and
at least one heat-exchanging member (216) disposed on the casing (102) and at least partially exposed to ambient air, wherein a portion of the at least one heat-exchanging member (216) is adapted to be in a thermal contact with the at least one heat-conducting member (214) such that the conducted heat from the at least one heat-conducting member (214) is dissipated into the ambient air.

2. The head wearable device (100) as claimed in claim 1, wherein:
the at least one heat-exchanging member (216) comprises a primary heat sink (202); and
the at least one heat-conducting member (214) comprises a secondary heat sink (204) adapted to conduct heat from the at least one electronic component (106) and transfer the conducted heat to the primary heat sink (202).

3. The head wearable device (100) as claimed in claim 2, wherein:
the primary heat sink (202) comprises:
a conducting surface (202A) adapted to be in the thermal contact with the secondary heat sink (204); and
a plurality of fins (202B) formed opposite to the conducting surface (202A) and adapted to be exposed to the ambient air; and
the secondary heat sink (204) comprises:
at least one lateral surface (204A) adapted to be in the thermal contact with the at least one electronic component (106); and
at least one peripheral surface (204B) adapted to be in the thermal contact with the conducting surface (202A) of the primary heat sink (216).

4. The head wearable device (100) as claimed in claim 3, comprising:
at least one heat-spreading element (208) disposed between the at least one electronic component (106) and the at least one lateral surface (204A) of the secondary heat sink (204),
wherein the at least one heat-spreading element (208) is adapted to conduct the heat from the at least one electronic component (106) and spread the conducted heat, such that the conducted heat is transferred across the at least one lateral surface (204A) of the secondary heat sink (204).

5. The head wearable device (100) as claimed in claim 1, comprising:
a thermal interfacing member (206) disposed between the at least one heat-conducting member (214) and the at least one heat-exchanging member (216) and adapted to transfer the conducted heat from the at least one heat-conducting member (214) to the at least one heat-exchanging member (216).

6. The head wearable device (100) as claimed in claim 1, wherein the at least one electronic component (106) is a heat dissipating component.

7. The head wearable device (100) as claimed in claim 1, wherein the at least one heat-exchanging member (216) is integrated with the casing (102).

8. The head wearable device (100) as claimed in claim 1, wherein the at least one heat-exchanging member (216) is detachably attached to the casing (102).

9. The head wearable device (100) as claimed in claim 1, comprising:
a helmet structure having a front portion (108a), a rear portion (108b), and an intermediate curved portion (108c) extending between the front portion (108a) and the rear portion (108b).

10. The head wearable device (100) as claimed in claim 9, wherein:
the rear portion (100) comprises a groove (110) adapted to receive the casing (102), such that the at least one heat-exchanging member (216) of the cooling module (104) is at least partially exposed to ambient air.

11. The head wearable device (100) as claimed in claim 10, wherein:
the intermediate curved portion (108c) is adapted to guide the ambient air to the rear portion (108b) of the helmet structure.

12. The head wearable device (100) as claimed in claim 11, wherein the guided ambient air comes in contact with the at least one heat-exchanging member (216), such that the at least one heat-exchanging member (216) dissipates the conducted heat, received from the at least one heat-conducting member (214), in the ambient air.