Description:TECHNICAL FIELD
[0001] The present disclosure relates to an assembly for a manual soldering tool that enables a direct assembly of signal pins and power pins onto a Printed Circuit Board Assembly (PCBA), thereby eliminating the need for a pin header and reducing operational costs.

BACKGROUND
[0002] In the field of electronics manufacturing, assembling signal pins onto circuit boards is a critical step. Currently, two methodologies are followed for this assembly process. The first method involves machines that press the pins into the circuit board. These machines make sure the pins go in at the right depth and are spaced out evenly. However, this type of equipment is very expensive and not suitable for low-volume manufacturing due to the high initial investment costs. The second method involves pin headers and a soldering process known as Through-Hole Technology (THT). Initially, a manufacturer moulds the pins onto a header. Then, the pin headers are positioned on the circuit board. The actual attachment of the pin headers to the circuit board can be accomplished in various ways, such as using a wave of solder to connect many pins at once, soldering by hand for individual pins, or using selective soldering for delicate parts. However, this method results in higher costs because of the use of expensive equipment and is not optimal for low-volume manufacturing. Consequently, using the pin headers with a non-standard pitch necessitates changes in Printed Circuit Board Assembly (PCBA) design and end connector alterations, leading to a time-consuming and an expensive process.
[0003] Therefore, there is a need to address the above-mentioned drawbacks pertaining to ease and cost of manufacturing.

OBJECTS OF THE PRESENT DISCLOSURE
[0004] A general object of the present disclosure relates to an efficient and a reliable assembly that obviates the above-mentioned limitations of existing equipments.
[0005] An object of the present disclosure relates to an assembly for a manual soldering tool that facilitates a direct assembly of signal pins onto a Printed Circuit Board Assembly (PCBA) through manual soldering, thereby eliminating the requirement for a pin header and the cost associated with the assembly process is significantly reduced. Additionally, the present invention facilitates the soldering process to be undertaken for lower volumes which makes the present invention viable for small to medium scale industries.

SUMMARY
[0006] Aspects of the disclosure relate to automotive technology. In particular, the present disclosure relates to an assembly for a manual soldering tool that enables a direct assembly of pins onto a Printed Circuit Board Assembly (PCBA), thereby eliminating the need for a pin header and reducing operational costs.
[0007] In an aspect, the present disclosure relates to an assembly for a manual soldering tool. The assembly includes a base plate, a first block, and a second block. The first block is affixed on the base plate. The second block is mounted and affixed on the first block, wherein the second block is configured with a predefined cavity, and where the second block includes one or more predefined through-holes configured at a predefined distance between each of the one or more predefined through-holes for accommodating one or more signal pins and power pins.
[0008] In an embodiment, a second surface of the first block may be affixed on the base plate.
[0009] In an embodiment, a second surface of the second block may be mounted and affixed on a first surface of the first block.
[0010] In an embodiment, the one or more predefined through-holes may extend from a first surface of the second block toward a second surface of the second block.
[0011] In an embodiment, a distal end of each of the one or more pins may be passed through each of the one or more corresponding predefined through-holes and orthogonally extends toward a first surface of the first block
[0012] In an embodiment, the first block may be configured to control a protrusion height of each of the one or more pins, due to the orthogonal extension of a distal end of each of the one or more pins toward a first surface of the first block.
[0013] In an embodiment, each of the one or more predefined through-holes in the second block may be configured corresponding to a shape and a size of each of the one or more pins to control an orientation of each of the one or more pins.
[0014] In an embodiment, the predefined distance between each of the one or more predefined through-holes in the second block may be configured to maintain a pre-defined spacing between each of the one or more adjacent pins along two axes that intersect orthogonally relative to a plane of a Printed Circuit Board Assembly (PCBA).
[0015] In an embodiment, the second block may include one or more alignment terminals.
[0016] In an embodiment, the second block may include one or more dents corresponding to a shape and a size of one or more alignment terminals to accommodate each of the one or more alignment terminals.
[0017] In an embodiment, one or more alignment terminals may be used to engage with one or more slots in a PCBA for aligning a proximal end of each of the one or more pins corresponding to one or more holes in the PCBA for soldering.
[0018] In an embodiment, a mounting frame may be configured to accommodate a PCBA.
[0019] In an embodiment, a centre portion of a mounting frame may be configured with a predefined gap corresponding to a width and a length of a PCBA.
[0020] In an embodiment, the base plate may include one or more first holes, and where each of the one or more first holes may be configured corresponding to one or more second holes of a mounting frame.
[0021] In an embodiment, one or more first holes of the base plate and one or more second holes of a mounting frame may be aligned with each other to accommodate one or more fasteners within each of the one or more first holes and each of the one or more second holes, thereby facilitating an attachment of the base plate and the mounting frame with each other.
[0022] In an embodiment, a mounting frame may include a locking member configured to lock and unlock a PCBA, when the PCBA is accommodated within a predefined gap of the mounting frame.
[0023] In an embodiment, one or more fasteners may be removed to detach a mounting frame and a base plate to eject a PCBA along with the one or more pins from a predefined gap of a mounting frame.
[0024] In an embodiment, manual soldering may provide a distinct advantage for low-volume manufacturing requirements and be more flexible and cost-effective for smaller production runs.
[0025] In an embodiment, manual soldering may provide greater control and precision, particularly in ensuring consistent pin alignment and projection height, which are critical for the functionality and reliability of the PCBA.
[0026] In an embodiment, the assembly may provide an enhancement in the development cycle. This technique may permit the direct assembly of the pins onto PCBA, reducing the need for expensive machinery and reducing the use of custom-made parts from outside suppliers, which results in a faster manufacturing timeline.
[0027] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0028] The accompanying drawings are included to provide a further understanding of the present disclosure, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.
[0029] FIGs. 1A-1B illustrate cross-sectional views of an assembly for a manual soldering tool, in accordance with embodiments of the present disclosure.
[0030] FIG. 1C illustrates an exploded view of the assembly for the manual soldering tool, in accordance with embodiments of the present disclosure.

DETAILED DESCRIPTION
[0031] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. However, the amount of detail offered is not intended to limit the anticipated variations of embodiments; on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosures as defined by the appended claims.
[0032] For the purpose of understanding of the principles of the present disclosure, reference will now be made to the various embodiments and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the present disclosure is thereby intended, such alterations and further modifications in the illustrated system, and such further applications of the principles of the present disclosure as illustrated therein being contemplated as would normally occur to one skilled in the art to which the present disclosure relates.
[0033] It will be understood by those skilled in the art that the foregoing general description and the following detailed description are explanatory of the present disclosure and are not intended to be restrictive thereof.
[0034] Whether or not a certain feature or element was limited to being used only once, it may still be referred to as “one or more features” or “one or more elements” or “at least one feature” or “at least one element.” Furthermore, the use of the terms “one or more” or “at least one” feature or element do not preclude there being none of that feature or element, unless otherwise specified by limiting language including, but not limited to, “there needs to be one or more” or “one or more elements is required.”
[0035] Reference is made herein to some “embodiments.” It should be understood that an embodiment is an example of a possible implementation of any features and/or elements of the present disclosure. Some embodiments have been described for the purpose of explaining one or more of the potential ways in which the specific features and/or elements of the proposed disclosure fulfil the requirements of uniqueness, utility, and non-obviousness.
[0036] Use of the phrases and/or terms including, but not limited to, “a first embodiment,” “a further embodiment,” “an alternate embodiment,” “one embodiment,” “an embodiment,” “multiple embodiments,” “some embodiments,” “other embodiments,” “further embodiment”, “furthermore embodiment,” “additional embodiment” or other variants thereof do not necessarily refer to the same embodiments. Unless otherwise specified, one or more particular features and/or elements described in connection with one or more embodiments may be found in one embodiment, or may be found in more than one embodiment, or may be found in all embodiments, or may be found in no embodiments. Although one or more features and/or elements may be described herein in the context of only a single embodiment, or in the context of more than one embodiment, or in the context of all embodiments, the features and/or elements may instead be provided separately or in any appropriate combination or not at all. Conversely, any features and/or elements described in the context of separate embodiments may alternatively be realized as existing together in the context of a single embodiment.
[0037] Any particular and all details set forth herein are used in the context of some embodiments and therefore should not necessarily be taken as limiting factors to the proposed disclosure.
[0038] The terms “comprise,” “comprising,” or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such process or method. Similarly, one or more devices or sub-systems or elements or structures or components proceeded by “comprises... a” does not, without more constraints, preclude the existence of other devices or other sub-systems or other elements or other structures or other components or additional devices or additional sub-systems or additional elements or additional structures or additional components.
[0039] Embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings.
[0040] For the sake of clarity, the first digit of a reference numeral of each component of the present disclosure is indicative of the Figure number, in which the corresponding component is shown. For example, reference numerals starting with digit “1” are shown at least in Figure 1.
[0041] Embodiments of the present disclosure relate to an assembly for a manual soldering tool that enables a direct assembly of pins onto Printed Circuit Board Assembly (PCBA), thereby eliminating the need for a pin header and reducing operational costs.
[0042] Various embodiments of the present disclosure will be explained in detail with respect to FIGs. 1A, 1B, and 1C.
[0043] FIGs. 1A-1B illustrate cross-sectional views of an assembly (100) for a manual soldering tool, in accordance with embodiments of the present disclosure.
[0044] Referring to FIG. 1A, the assembly (100) may include a base plate (102), a first block (104), a second block (106), and a mounting frame (108). In an embodiment, the first block (104) may include a first surface (104A) and a second surface (104B). Similarly, the second block (106) may include a first surface (106A) and a second surface (106B). The second surface (104B) of the first block (104) may be affixed on the base plate (102). In an embodiment, the second surface (106B) of the second block (106) may be mounted and affixed on the first surface (104A) of the first block (104). In exemplary embodiments, the first block (104) and the second block (106) may include holes) that may be configured to accommodate fasteners (116) for facilitating an attachment between the first block (104) and the second block (106).
[0045] In an embodiment, the second block (106) may include predefined through-holes configured at a predefined distance between each predefined through-hole. In an embodiment, the predefined through-holes may extend from the first surface (106A) of the second block (106) toward the second surface (106B) of the second block (106). In an embodiment, pins (112) may be accommodated within each predefined through-hole of the second block (106). In exemplary embodiments, the pins (112) may be, but not limited to signal pins, power pins, and the like. In an embodiments, each pin may include a proximal end (112A) and a distal end (112B). In an embodiment, the second block (106) may include a predefined cavity (106C) (e.g., an undercut section) which may facilitate easy removal of pins (112) with minimal to no damage. This relief may avoid bending of the pins (112), maintaining the integrity and alignment of the pins (112) throughout the assembly and disassembly processes.
[0046] In an embodiment, to accommodate the pins (112) into the predefined through-holes, an operator (e.g., a manual operator) may pass the distal end (112B) of each pin through each corresponding predefined through-hole and orthogonally extends the distal end (112B) of the pins (112) toward the first surface (104A) of the first block (104). In exemplary embodiments, the first block (104) may be used to control a protrusion height of each pin, due to the orthogonal extension of the distal end (112B) of pin toward the first surface (104A) of the first block (104). In an embodiment, the pin projection height on a soldering side (e.g., the proximal end (112A)) may be controlled by employing a machined surface (e.g., the first surface (104A) of the first block (104)) to serve as a Z-axis reference for the pins (112). In an embodiment, each predefined through-holes in the second block (106) may be configured corresponding to a pre-defined shape and size of each pin to control an orientation of each pin.
[0047] In an embodiment, the second block (106) may include dents to accommodate alignment terminals (110). In exemplary embodiments, the dents may correspond to a shape and a size of the alignment terminals (110). In exemplary embodiments, the base plate (102) may include first holes (102A). The first holes (102A) may be configured corresponding to second holes (108A) of the mounting frame (108). In exemplary embodiments, the first holes (102A) of the base plate (102) and the second holes (108A) of the mounting frame (108) may be aligned with each other to accommodate fasteners (118) within each first hole (102A) and each second hole (108A), thereby facilitating an attachment of the base plate (102) and the mounting frame (108) with each other. In exemplary embodiments, the fasteners (118) may include, but not limited to screws, bolts, springs, and the like.
[0048] In an embodiment, the mounting frame (108) may include a centre portion that may be configured with a predefined gap (122). This predefined gap (122) may be accommodated by a Printed Circuit Board Assembly (PCBA) (114). In exemplary embodiments, the predefined gap (122) may correspond to a width and a length of the PCBA (114). In an embodiment, the PCBA (114) may include slots and holes. The alignment terminals (110) may be used to engage with the slots for aligning the proximal end (112A) of each pin (112) corresponding to the holes in the PCBA (114) for soldering. In an embodiment, the predefined distance between each predefined through-hole in the second block (106) may be configured to maintain a pre-defined spacing between each adjacent pin (112) along two axes that intersect orthogonally relative to a plane of the PCBA (114). In an embodiment, a pin-to-pin pitch may be achieved through the use of Computer Numerical Control (CNC) machining and wire cutting to accurately form pockets (e.g., the holes in the PCBA (114)) on the X and Y axes. For example, the design requirement for the signal pins (e.g., 112) may specify a pitch of 2.50mm on the X-axis and 4.20mm on the Y-axis. In exemplary embodiments, an alignment of the pin pitch with an assembly datum may be ensured by incorporating dowel pins (e.g., the alignment terminals (110)). These dowel pins (e.g., 110) may maintain a precise datum reference from a fixture (e.g., assembly (100)) to the PCBA (114). In exemplary embodiments, without these dowel pins (e.g., 110), the entire assembly (100) reference may not be met, and an end product may not match the reference required for cable harness mounting.
[0049] In exemplary embodiments, the mounting frame (108) may include a locking member (120) that may be configured to lock and unlock the PCBA (114), when the PCBA (114) is accommodated within the predefined gap (122) of the mounting frame (108). In exemplary embodiment, when the holes of the PCBA (114) are aligned with the proximal end (112A) of the pins (112) and the alignment terminals (110) are engaged with the slots in the PCBA (114), the locking member (120) may slide toward the PCBA (114) for locking, thereby securing the PCBA (114) with the assembly (100) to align the pins (112) within the predefined-through holes. This locking member (120) may lock and hold the PCBA (114) from shifting/lifting during the pins (112) alignment process. Once the pins (112) are aligned into the holes of the PCBA (114), the proximal end (112A) of each pin may be soldered.
[0050] In exemplary embodiments, after the completion of the soldering process, the locking member (120) may slide outward from the PCBA (114) for unlocking, thereby removing the PCBA (114) from the assembly (100). In an embodiment, after the completion of the soldering process, the fasteners (118) may be removed to detach the mounting frame (108) and the base plate (102) to eject the PCBA (114) along with the pins (112) from the predefined gap (122) of the mounting frame (108). Furthermore, in exemplary embodiments, the fasteners (118) may be loosened, allowing for the activation of a spring mechanism configured with the fasteners (118). This spring mechanism may cause the mounting frame (108) to move along the Z-axis, thereby releasing the PCBA (114) along with the pins (112) from the assembly (100). This process may ensure that the pins (112) are not subjected to undue stress or bending, preserving their integrity and alignment within the completed assembly (100).
[0051] FIG. 1C illustrates an exploded view of the assembly (100) for the manual soldering tool, in accordance with embodiments of the present disclosure.
[0052] Referring to FIG. 1C, in exemplary embodiments, the base plate (102) may serve as a bottommost part of the fixture (e.g., 100). This base plate (102) may feature a surface that is ground to a fine finish, providing a stable base for the entire construction of the fixture (100). In exemplary embodiments, the first block (104) may feature a surface ground to ensure geometric accuracy. In exemplary embodiments, the second block (106) may be mounted onto a pin height control reference block (e.g., the first block (104)). In exemplary embodiments, the second block (106) may be configured to enhance uniformity in the orientation of the pins (112) which may be attained by calibrating pocket dimensions (e.g., dimensions of the predefined-through holes) to match the tolerances of the PCBA (114). This calibration may ensure that each pin is accurately positioned in accordance with the designated specifications, promoting consistent performance across all assembled PCBAs. Additionally, the assembly (100) may feature an ejection system designed to prevent pin leaning or bending by releasing the PCBA (114) entirely, thus protecting the integrity of the soldered pins (112).
[0053] The present disclosure may focus on the manual soldering of individual pins (112) onto the PCBA (114). In an embodiment, key specifications for manual soldering may include maintaining consistent pin-to-pin pitch, ensuring precise pin projection height on the soldering side, aligning the pin pitch with the assembly datum, standardizing orientation across all the pins (112), and keeping the pins (112) straight and unbent. This manual soldering may provide a distinct advantage for low-volume manufacturing requirements. Unlike automated processes, manual soldering may be more flexible and cost-effective for smaller production runs. Additionally, manual soldering may provide greater control and precision, particularly in ensuring consistent pin alignment and projection height, which are critical for the functionality and reliability of the PCBA (114). Further, the present disclosure may provide an enhancement in the development cycle. This technique may permit the direct assembly of the pins (112) onto PCBA (114), reducing the need for expensive machinery and reducing the use of custom-made parts from outside suppliers, which results in a faster manufacturing timeline. As a result, the progression from the initial concept to a testable prototype becomes quicker. Such speed is crucial in the electronics industry where rapid development is a necessity.
[0054] In this application, unless specifically stated otherwise, the use of the singular includes the plural and the use of “or” means “and/or.” Furthermore, use of the terms “including” or “having” is not limiting. Any range described herein will be understood to include the endpoints and all values between the endpoints. Features of the disclosed embodiments may be combined, rearranged, omitted, etc., within the scope of the disclosure to produce additional embodiments. Furthermore, certain features may sometimes be used to advantage without a corresponding use of other features.
[0055] While the foregoing describes various embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof. The scope of the disclosure is determined by the claims that follow. The disclosure is not limited to the described embodiments, versions, or examples, which are included to enable a person having ordinary skill in the art to make and use the disclosure when combined with information and knowledge available to the person having ordinary skill in the art.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0056] The present disclosure relates to an assembly for manual soldering tool that eliminates the needs for pin headers, thereby reducing the number of steps and components involved during the assembly process.
[0057] The present disclosure relates to an assembly for manual soldering tool that eliminates the overall cost of the assembly process.
[0058] The present disclosure relates to an assembly for manual soldering tool that potentially speeds up production because manual soldering of pins can be more straightforward than soldering entire pin headers.
[0059] The present disclosure relates to an assembly for manual soldering tool that reduces the need for heavy machinery and extensive soldering processes may lead to a decrease in energy consumption during production.
[0060] The present disclosure relates to an assembly for a manual soldering tool which is applicable for low-volume production lines where high capital expenditures cannot be accommodated.
[0061] The present disclosure relates to an assembly for a manual soldering tool that can be adapted for use in wave soldering or selective soldering machines, making the assembly suitable for high-volume product applications.
, Claims:1. An assembly (100) for a manual soldering tool, comprising:
a base plate (102);
a first block (104) which is affixed on the base plate (102);
a second block (106) which is mounted and affixed on the first block (104), wherein the second block (106) is configured with a predefined cavity (106C), and wherein the second block (106) comprises one or more predefined through-holes configured at a predefined distance between each of the one or more predefined through-holes for accommodating one or more pins (112).
2. The assembly (100) as claimed in claim 1, wherein a second surface (104B) of the first block (104) is affixed on the base plate (102).
3. The assembly (100) as claimed in claim 1, wherein a second surface (106B) of the second block (106) is mounted and affixed on a first surface (104A) of the first block (104).
4. The assembly (100) as claimed in claim 1, wherein the one or more predefined through-holes extend from a first surface (106A) of the second block (106) toward a second surface (106B) of the second block (106).
5. The assembly (100) as claimed in claim 1, wherein a distal end (112B) of each of the one or more pins (112) is passed through each of the one or more corresponding predefined through-holes and orthogonally extends toward a first surface (104A) of the first block (104).
6. The assembly (100) as claimed in claim 1, wherein the first block (104) is configured to control a protrusion height of each of the one or more pins (112), due to the orthogonal extension of a distal end (112B) of each of the one or more pins (112) toward a first surface (104A) of the first block (104).
7. The assembly (100) as claimed in claim 1, wherein each of the one or more predefined through-holes in the second block (106) is configured corresponding to a shape and a size of each of the one or more pins (112) to control an orientation of each of the one or more pins (112).
8. The assembly (100) as claimed in claim 1, wherein the predefined distance between each of the one or more predefined through-holes in the second block (106) is configured to maintain a pre-defined spacing between each of the one or more adjacent pins (112) along two axes that intersect orthogonally relative to a plane of a Printed Circuit Board Assembly (PCBA) (114).
9. The assembly (100) as claimed in claim 1, wherein the second block (106) comprises one or more alignment terminals (110).
10. The assembly (100) as claimed in claim 1, wherein the second block (106) comprises one or more dents corresponding to a shape and a size of one or more alignment terminals (110) to accommodate each of the one or more alignment terminals (110).
11. The assembly (100) as claimed in claim 1, wherein one or more alignment terminals (110) are used to engage with one or more slots in a Printed Circuit Board Assembly (PCBA) (114) for aligning a proximal end (112A) of each of the one or more pins (112) corresponding to one or more holes in the PCBA for soldering.
12. The assembly (100) as claimed in claim 1, comprising a mounting frame (108) configured to accommodate a Printed Circuit Board Assembly (PCBA) (114).
13. The assembly (100) as claimed in claim 1, wherein a centre portion of a mounting frame (108) is configured with a predefined gap (122) corresponding to a width and a length of a Printed Circuit Board Assembly (PCBA) (114).
14. The assembly (100) as claimed in claim 1, wherein the base plate (102) comprises one or more first holes (102A), and wherein each of the one or more first holes (102A) is configured corresponding to one or more second holes (108A) of a mounting frame (108).
15. The assembly (100) as claimed in claim 1, wherein one or more first holes (102A) of the base plate (102) and one or more second holes (108A) of a mounting frame (108) are aligned with each other to accommodate one or more fasteners (118) within each of the one or more first holes (102A) and each of the one or more second holes (108A), thereby facilitating an attachment of the base plate (102) and the mounting frame (108) with each other.
16. The assembly (100) as claimed in claim 1, wherein a mounting frame (108) comprises a locking member (120) configured to lock and unlock a Printed Circuit Board Assembly (PCBA) (114), when the PCBA (114) is accommodated within a predefined gap (122) of the mounting frame (108).
17. The assembly (100) as claimed in claim 1, wherein one or more fasteners (118) are removed to detach a mounting frame (108) and a base plate (102) to eject a Printed Circuit Board Assembly (PCBA) (114) along with the one or more pins (112) from a predefined gap (122) of a mounting frame (108).