Power Submodule, Power Module And Method For Producing A Power Module

Abstract: The power submodule (200) comprises a power semiconductor device (1) with a top side (10) and a bottom side (12) as well as an electrically isolating body (2) surrounding the power semiconductor device. The power submodule further comprises a top contact element (3) with a terminal region (30) on the top side of the power semiconductor device and an electrically conductive cooling element (6) with a terminal region (60) on the bottom side of the power semiconductor device. The top contact element and the cooling element are in electrical contact with the power semiconductor device. The terminal regions of the top contact element and of the cooling element face away from the power semiconductor device and in opposite directions in order to enable at least two such power submodules to be stacked on top of each other for a serial electrical connection. The cooling element comprises a cooling structure (7) for cooling the power semiconductor device.

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