Semiconductor Power Module And Method For Manufacturing A Semiconductor Power Module

Abstract: A semiconductor power module (10) comprises a substrate (4) and at least one terminal (2) that is electrically coupled to the substrate (4). The semiconductor power module (10) further comprises a reinforcement member (3) that comprises a material different from a material of the at least one terminal (2), and a housing with a molded body (1). The molded body (1) surrounds the substrate ( 4 ), the reinforcement member (3) and the at least one terminal (2) such that the at least one terminal (2) is integrally coupled and embedded in the molded body (1) and partially protrudes from a wall (5) of the molded body (1). The reinforcement member (3) is mechanically coupled to the at least one terminal (2) such that it is at least in part integrally coupled and embedded in the molded body (1) at the position the at least one terminal (2) protrudes from the wall (5) of the molded body (1).

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