Power Module Comprising A Semiconductor Module Component And An Alignment Part, And Method For Forming The Power Module

Abstract: A power module (100) comprising a semiconductor module component (10) and an alignment part (20) is provided, wherein the alignment part (20) is fixed on a lateral top surface (10T) of the semiconductor module component (10) and comprises at least one recessed portion (20R). The semiconductor module component (10) comprises at least one terminal (12, 13) which – at least in places - is orientated vertically with respect to the lateral top surface (10T) of the semiconductor module component (10) and for the purpose of alignment along lateral directions, is located at least partly within the at least one recessed portion (20R). Along a vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recessed portion (20R). The at least one recessed portion (20R) is located on a side surface (20S) of the alignment part (20), wherein the at least one recessed portion (20R) is a vertical slot being an open recess on the side surface (20S) of the alignment part (20), and wherein the slot is not a through-hole being completely surrounded by inner walls (20W) of the at least one recessed portion (20R) in lateral directions. Moreover, a method for forming the power module (100) comprising a semiconductor module component (10) is provided.

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