Abstract: A method for manufacturing a SiC semiconductor element (10) comprising the steps of providing a SiC substrate (20) with a SiC epitaxial layer (30) on top treating the SiC epitaxial layer (30) with plasma immersion ion implantation (PIII) using dopants of a first material (35). The method further comprises thermal oxidizing a top surface (31) of the SiC epitaxial layer (30) such that a thermal oxide layer (40) is grown and etching the thermal oxide layer (40). The method further comprises implanting dopants of a second material (36) in the SiC epitaxial layer (30) such that a drain (50) and source (60) are created activating the dopants with an activation anneal and depositing a metal gate (70).
| # | Name | Date |
|---|---|---|
| 1 | 202547021506-STATEMENT OF UNDERTAKING (FORM 3) [10-03-2025(online)].pdf | 2025-03-10 |
| 2 | 202547021506-REQUEST FOR EXAMINATION (FORM-18) [10-03-2025(online)].pdf | 2025-03-10 |
| 3 | 202547021506-PROOF OF RIGHT [10-03-2025(online)].pdf | 2025-03-10 |
| 4 | 202547021506-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [10-03-2025(online)].pdf | 2025-03-10 |
| 5 | 202547021506-FORM 18 [10-03-2025(online)].pdf | 2025-03-10 |
| 6 | 202547021506-FORM 1 [10-03-2025(online)].pdf | 2025-03-10 |
| 7 | 202547021506-DRAWINGS [10-03-2025(online)].pdf | 2025-03-10 |
| 8 | 202547021506-DECLARATION OF INVENTORSHIP (FORM 5) [10-03-2025(online)].pdf | 2025-03-10 |
| 9 | 202547021506-COMPLETE SPECIFICATION [10-03-2025(online)].pdf | 2025-03-10 |
| 10 | 202547021506-FORM-26 [11-03-2025(online)].pdf | 2025-03-11 |
| 11 | 202547021506-FORM 3 [19-09-2025(online)].pdf | 2025-09-19 |