Abstract: The present disclosure relates to a super junction power semiconductor device (20) comprising a substrate (1), a plurality of core structures (4) and a plurality of annular shell structures (5). Each core structure (4) has a cylindrical shape extending in a direction perpendicular to a main surface of the substrate (1) and comprising a first semiconductor material of a first conductivity type. Each shell structure (5) surrounds one of the core structures (4) on its outside and comprises a second semiconductor material of a second conductivity type. The disclosure further relates to a method (30) for manufacturing a super j unction power semiconductor device (20).
| # | Name | Date |
|---|---|---|
| 1 | 202547042651-STATEMENT OF UNDERTAKING (FORM 3) [02-05-2025(online)].pdf | 2025-05-02 |
| 2 | 202547042651-REQUEST FOR EXAMINATION (FORM-18) [02-05-2025(online)].pdf | 2025-05-02 |
| 3 | 202547042651-PROOF OF RIGHT [02-05-2025(online)].pdf | 2025-05-02 |
| 4 | 202547042651-FORM 18 [02-05-2025(online)].pdf | 2025-05-02 |
| 5 | 202547042651-FORM 1 [02-05-2025(online)].pdf | 2025-05-02 |
| 6 | 202547042651-DRAWINGS [02-05-2025(online)].pdf | 2025-05-02 |
| 7 | 202547042651-DECLARATION OF INVENTORSHIP (FORM 5) [02-05-2025(online)].pdf | 2025-05-02 |
| 8 | 202547042651-COMPLETE SPECIFICATION [02-05-2025(online)].pdf | 2025-05-02 |
| 9 | 202547042651-FORM-26 [05-05-2025(online)].pdf | 2025-05-05 |
| 10 | 202547042651-FORM 3 [13-10-2025(online)].pdf | 2025-10-13 |