Semiconductor Module, Operating Method And Manufacturing Method

Abstract: In one embodiment, the semiconductor module (10) includes a plurality of semiconductor devices (1) and at least one bus line (5), wherein - each of the semiconductor devices (1) comprises a power semiconductor chip (2), a logic unit (3) and a gate pad (4), each of the power semiconductor chips (2) has a gate electrode contact area (24), - in each one of the semiconductor devices (1), the logic unit (3) is electrically placed between the gate electrode contact area (24) and the gate pad (4), and - the semiconductor devices (1) are interconnected by means of the at least one bus line (5).

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