Abstract: In at least one embodiment, the method is for producing a semiconductor device (1) and comprises: A) providing a semiconductor body (2) which is based on a group IV-semiconductor material, B) doping a first region (21) in the semiconductor body (2), the first region (21) is of a first conductivity type and starts from a surface (20) of the semiconductor body (2), and C) forming a recess (3) in the semiconductor body (2) by selectively and wet-chemically etching the first region (21).
| # | Name | Date |
|---|---|---|
| 1 | 202547091297-STATEMENT OF UNDERTAKING (FORM 3) [24-09-2025(online)].pdf | 2025-09-24 |
| 2 | 202547091297-REQUEST FOR EXAMINATION (FORM-18) [24-09-2025(online)].pdf | 2025-09-24 |
| 3 | 202547091297-PROOF OF RIGHT [24-09-2025(online)].pdf | 2025-09-24 |
| 4 | 202547091297-PRIORITY DOCUMENTS [24-09-2025(online)].pdf | 2025-09-24 |
| 5 | 202547091297-FORM 18 [24-09-2025(online)].pdf | 2025-09-24 |
| 6 | 202547091297-FORM 1 [24-09-2025(online)].pdf | 2025-09-24 |
| 7 | 202547091297-DRAWINGS [24-09-2025(online)].pdf | 2025-09-24 |
| 8 | 202547091297-DECLARATION OF INVENTORSHIP (FORM 5) [24-09-2025(online)].pdf | 2025-09-24 |
| 9 | 202547091297-COMPLETE SPECIFICATION [24-09-2025(online)].pdf | 2025-09-24 |
| 10 | 202547091297-FORM-26 [25-09-2025(online)].pdf | 2025-09-25 |
| 11 | 202547091297-Proof of Right [27-09-2025(online)].pdf | 2025-09-27 |