Semiconductor Power Module, Semiconductor Power Package And Method For Manufacturing A Semiconductor Power Module

Abstract: A semiconductor power module (1) comprises a semiconductor power device (2), a first metallic component (11) coupled to a first side (5) of the semiconductor power device (2), and a second metallic component (12) coupled to a second side (6) of the semiconductor power device (2) opposite the first side (5). A control terminal (10) is electrically coupled to an electrical contact (7) of the semiconductor power device (2). The first and the second metallic component (11, 12 ) each comprises a respective given surface structure (13, 14) for guiding a cooling fluid along the semiconductor power device (2), and a hollow housing (4) limits a predetermine dinner flow of the cooling fluid. The housing (4) comprises an inlet (43) and an outlet (44) for the entering and exiting of the cooling fluid into and out of the housing (4). The housing (4) is coupled to both the first and the second metallic component (11, 12) and encloses the semiconductor power device (2) such that the housing (4) and the first and the second metallic component (11, 12) form an inner flow chamber around the semiconductor power device (2) which is filled with the cooling fluid during operation of the semiconductor power module (1).

Patent Information

Applicants

Inventors

Specification

Documents

Application Documents