Method For Mounting A Power Semiconductor Device To A Printed Circuit Board Using An Alignment Device

Abstract: Method for mounting a power semiconductor device to a printed circuit board using an alignment device Method for mounting a power semiconductor device (10) to a printed circuit board (20) comprising the steps of providing the power semiconductor device (10) and an alignment device (30), inserting at least one terminal (11) with a first portion (111) oriented in a fourth direction (400) and a second portion oriented in a third direction (300), of the power semiconductor device (10) into at least one first alignment structure (34) of the alignment device (30) by moving the power semiconductor device (10) in the third direction (300), concurrent with amounting the alignment device (30) to the power semiconductor device (10. The method further comprises the steps of providing the printed circuit board (20), aligning the alignment device (30) to the printed circuit board (20), concurrent with inserting at least partially the first portion (111) of the at least one terminal (11) into at least one contact hole (21) of the printed circuit board (20), and fixing the first portion (111) of the at least one terminal (11) of the power semiconductor device (10) to the printed circuit board (20).

Patent Information

Applicants

Inventors

Specification

Documents

Application Documents