Description:TECHNICAL FIELD
[0001] The present disclosure relates generally to the technical field of heating and cooling systems. In particular, it pertains to a system to control temperature of a product, and its method thereof.

BACKGROUND
[0002] Background description includes information that may be useful in understanding the present invention. It is not an admission that any of the information provided herein is prior art or relevant to the presently claimed invention, or that any publication specifically or implicitly referenced is prior art.
[0003] The need for efficient and effective temperature control systems has become increasingly critical across various industries, including electronics, automotive, and Heating, Ventilation, and Air-Conditioning (HVAC) systems. Traditional heating and cooling methods, such as resistive heating and vapor-compression refrigeration, typically suffer from slow response times, significant energy consumption, and inefficiencies in temperature regulation. These limitations can lead to overheating or undercooling, impacting performance, reliability, and energy costs. Further, existing HVAC systems may have refrigerant components used for cooling purpose such as refrigerants, which are harmful for the environment.
[0004] In particular, the cooling of electronic components has emerged as a pressing challenge, as devices continue to miniaturize while increasing in power density. Existing cooling solutions often rely on bulky mechanisms that cannot adapt quickly to changing thermal loads, leading to potential device failure or reduced performance. Likewise, liquid cooling systems and climate control units in confined spaces struggle to achieve the rapid temperature changes needed for optimal operation.
[0005] Various innovations have been emerged in temperature control systems such as use of thermoelectric conductive devices to provide solid-state cooling and heating capabilities that are inherently fast and energy-efficient. However, their performance can be limited by inadequate thermal management solutions, such as insufficient heat sinking and airflow. These factors are crucial for maintaining optimal functionality during rapid temperature fluctuations.
[0006] Therefore, there is a need in the art to provide a system and a method for rapid temperature control of a product which can overcome the above stated issues.

OBJECTS OF THE PRESENT DISCLOSURE
[0007] An object of the present disclosure relates, in general, to the field of heating and cooling systems, and more specifically, relates to a system and a method for rapid temperature control of a product.
[0008] Another object of the present disclosure is to provide a system and a method that enables precise and adaptive temperature control for a wide range of applications, including liquid cooling and HVAC systems.
[0009] Another object of the present disclosure is to provide to improve the reliability and lifespan of the product by preventing overheating and maintaining optimal operating temperatures.
[0010] Another object of the present disclosure is to provide a system that enhances efficiency and speed of temperature regulation in the product such as electronic components, and confined environments.
[0011] Another object of the present disclosure is to provide a system which controls the temperature of the product with reduced noise levels while maintaining high performance.
[0012] Yet another object of the present disclosure is to provide a universal base unit to control temperature of a product that can be easily adapted for multiple applications, thereby reduces product development cost.

SUMMARY
[0013] The present disclosure relates, in general, to the field of heating and cooling systems, and more specifically, relates to a system and a method to control temperature of a product.
[0014] According to an aspect, the present disclosure relates to a system to control temperature of a product. The system comprises a base unit detachably attached to the product. The base unit includes a at least one thermoelectric semiconductor device in direct or indirect thermal contact with the product. The at thermos electric semiconductor device is configured to enable rapid cooling or heating of the product by facilitating heat transfer with the product, based on application of an electric current provided by a power source. Further. The base unit includes a heat sink attached to the at least one peltier element. The heat sink is configured to improve heat dissipation during the heat transfer. Furthermore, the base unit includes a fan unit integrally coupled to the heat sink. The fan unit is configured to direct airflow towards the heat sink to enhance efficiency of the system. The system further includes a sensing unit operably coupled to the base unit. The sensing unit is configured to sense and monitor temperature data of the product. Moreover, the system includes a control unit communicably coupled to the sensing unit. The control unit includes one or more processors, and a memory coupled to the one or more processors. The memory includes processor-executable instructions, which on execution, causes the one or more processors (also referred as processors hereinafter) to receive the sensed temperature data from the sensing unit. Further, the processors are configured to process the received temperature data. Moreover, the processors are configured to adjust the electric current supplied to the at least one peltier element and a speed of the fan unit, in response to a desired temperature set by a user.
[0015] In addition, when the user sets the desired temperature, a side of the at least one peltier element in direct or indirect contact with the product either absorbs heat or loses heat to rapidly cool or heat up the product, based on the adjustment of the electric current supplied to the at least one peltier element by the control unit.
[0016] In an aspect, when the desired temperature set by the user is below the monitored temperature, the control unit may adjust the electric current in a first direction, which may cause the side of the at least one peltier element in direct or indirect contact with the product to absorb heat to rapidly lower the temperature inside and/or of the product.
[0017] In an aspect, when the desired temperature set by the user is above the monitored temperature, the control unit may adjust the electric current in a second direction, reverse of the first direction, which may cause the side of the at least one peltier element in direct or indirect contact with the product to lose heat to rapidly increase the temperature inside and/or of the product.
[0018] In an aspect, the base unit may be attached below the product via an attachment mechanism. The attachment mechanism may be selected from any one of: magnetic attachments or mechanical locks.
[0019] In an aspect, the sensing unit may include one or more sensors to sense the temperature data of the product. The one or more sensors may be selected from a group comprising: temperature sensors, thermocouples, thermo resistors, Resistance Temperature Detectors (RTDs), Digital Temperature sensors, and Infrared temperature sensors.
[0020] In an aspect, the heat sink may include fins to increase a surface area of the heat sink to improve the heat dissipation.
[0021] In an aspect, the system may include a user interface configured to allow the user to set the desired temperature for the product either through physical interface configured on the base unit or remotely via an Internet of Things (IOT) device.
[0022] In an aspect, the product may be selected from a group consisting of: a water bottle, a kettle, portable mixers, mini freezers, food warmers, portable cooling devices, and other electronic appliances.
[0023] In another aspect, the present disclosure pertains to a base unit for the system to control temperature of the product. The base unit detachably attached to the product. The base unit includes a thermoelectric semiconductor device having at least one peltier element in direct or indirect thermal contact with the product. The at least one peltier element is configured to enable rapid cooling or heating of the product by facilitating heat transfer with the product, based on application of an electric current provided by a power source. Further, the base unit includes a heat sink attached to the at least one peltier element. The heat sink is configured to improve heat dissipation during the heat transfer. Furthermore, the base unit includes a fan unit integrally coupled to the heat sink. The fan unit is configured to direct airflow towards the heat sink to enhance efficiency of the system.
[0024] In yet another aspect, the present disclosure pertains to a method for controlling temperature of a product. The method includes the step of sensing and monitoring, by a sensing unit, temperature data of the product, where the product is detachably attached to the base unit. Further, the method includes the step of receiving, by a control unit, the sensed temperature data from the sensing unit. Furthermore, the method includes the step of processing, by the control unit, the received temperature data. Moreover, the method includes the step of adjusting, by the control unit, an electric current supplied to at least one peltier element associated with the base unit, and a speed of a fan unit associated with the base unit, in response to a desired temperature set by a user.
[0025] In addition, when the user sets the desired temperature, a side of the at least one peltier element in direct or indirect contact with the product either absorb heat or loses heat to rapidly cool or heat up the product, based on the adjustment of the electric current supplied to the at least one peltier element by the control unit.
[0026] Various objects, features, aspects, and advantages of the inventive subject matter will become more apparent from the following detailed description of preferred embodiments, along with the accompanying drawing figures in which like numerals represent like components.

BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The following drawings form part of the present specification and are included to further illustrate aspects of the present disclosure. The disclosure may be better understood by reference to the drawings in combination with the detailed description of the specific embodiments presented herein.
[0028] FIG.1A illustrates an exemplary block diagram of a proposed system to control a temperature of a product, in accordance with en embodiment of the present disclosure.
[0029] FIG. 1B illustrates an exemplary diagram of a proposed system to control a temperature of a product, in accordance with an embodiment of the present disclosure.
[0030] FIG. 1C illustrates an exemplary diagram of a base unit of the system of FIG. 1A, in accordance with an embodiment of the present disclosure.
[0031] FIG. 2 illustrates a block diagram of a proposed method for controlling a temperature of a product, in accordance with an embodiment of the present disclosure.

DETAILED DESCRIPTION
[0032] The following is a detailed description of embodiments of the disclosure depicted in the accompanying drawings. The embodiments are in such detail as to clearly communicate the disclosure. If the specification states a component or feature “may”, “can”, “could”, or “might” be included or have a characteristic, that particular component or feature is not required to be included or have the characteristic.
[0033] As used in the description herein and throughout the claims that follow, the meaning of “a,” “an,” and “the” includes plural reference unless the context clearly dictates otherwise. Also, as used in the description herein, the meaning of “in” includes “in” and “on” unless the context clearly dictates otherwise.
[0034] The present disclosure relates, in general, to the field of heating and cooling systems, and more specifically, relates to a system to control temperature of a product, and its method thereof.
[0035] Existing heating and cooling systems, such as resistive heating and vapor-compression refrigeration, face significant drawbacks including slow response times, high energy consumption, and inefficiencies in temperature regulation. These limitations can result in overheating or undercooling, adversely affecting the performance and reliability of sensitive electronic components. As devices become increasingly compact and power-dense, traditional bulky cooling mechanisms fail to adapt quickly to fluctuating thermal loads, raising the risk of device failure or degraded performance. Additionally, liquid cooling systems and climate control units in confined spaces struggle to deliver the rapid temperature changes necessary for optimal operation, further compounding these issues. Moreover, existing HVAC systems may have refrigerant components used for cooling purpose such as refrigerants, which are harmful for the environment.
[0036] To proposed system addresses the shortcomings of the existing heating and cooling systems by integrating at least peltier element, an optimized heat sink, and an efficient fan configuration into a single, adaptable unit. This innovative design enables rapid heating and cooling, significantly improving response times compared to traditional systems. Its compatibility with a wide range of products simplifies the design and manufacturing process, allowing for easier integration into new applications without the need for bulky or complex cooling mechanisms. By enhancing thermal management capabilities, the system minimizes the risk of overheating or undercooling, ensuring consistent performance and reliability across various environments. Additionally, the energy-efficient operation of the peltier element reduces overall energy consumption, making the system a more sustainable choice for modern applications.
[0037] The present disclosure relates to a system to control temperature of a product. The system comprises a base unit detachably attached to the product. The base unit includes at least one peltier element in direct or indirect thermal contact with the product. The at least one peltier element is configured to enable rapid cooling or heating of the product by facilitating heat transfer with the product, based on application of an electric current provided by a power source. Further. The base unit includes a heat sink attached to the at least one peltier element. The heat sink is configured to improve heat dissipation during the heat transfer. Furthermore, the base unit includes a fan unit integrally coupled to the heat sink. The fan unit is configured to direct airflow towards the heat sink to enhance efficiency of the system.
[0038] In an embodiment, the system includes a sensing unit operably coupled to the base unit. The sensing unit is configured to sense and monitor temperature data of the product.
[0039] In an embodiment, the system includes a control unit communicably coupled to the sensing unit. The control unit includes one or more processors, and a memory coupled to the one or more processors. The memory includes processor-executable instructions, which on execution, causes the one or more processors (also referred as processors hereinafter) to receive the sensed temperature data from the sensing unit. Further, the processors are configured to process the received temperature data. Moreover, the processors are configured to adjust the electric current supplied to the at least one peltier element and a speed of the fan unit, in response to a desired temperature set by a user.
[0040] In addition, when the user sets the desired temperature, a side of the at least one peltier element in direct or indirect contact with the product either absorbs heat or loses heat to rapidly cool or heat up the product, based on the adjustment of the electric current supplied to the at least one peltier element by the control unit.
[0041] Referring to FIGs. 1A to 1C, the proposed system 100 to control temperature of a product 101. The system 100 includes a base unit 102 detachably attached to the product 101 (Refer FIG.1B). The product 101 is selected from a group consisting of: a water bottle, a kettle, portable mixers, mini freezers, food warmers, portable cooling devices, and other electronic appliances. The base unit 102 can be of shape selected from cuboid, cube, circular, and the like. In a preferred embodiment, the base unit 102 is of cuboid shape. The base unit 102 includes at least one peltier element 106 (also simply referred as “peltier element 106” hereinafter) in thermal direct or indirect contact with the product 101. The peltier element 106 is configured to enable rapid cooling or heating of the product 101 by facilitating heat transfer with the product 101, based on application of an electric current provided by a power source. In an embodiment, the peltier element 106 can be made of thermoelectric materials such as but not limited to Bismuth Telluride (Bi2Te3), Lead Telluride (PbTe), Silicon-Germanium (SiGe), Tin Selenide (SnSe), and the like. The selection of the thermoelectric materials for making the peltier element 106 can depend upon the application of the system 100. For instance, Bismuth Telluride (Bi2Te3) can be used for near-room temperature applications. Lead Telluride (PbTe) can be suitable effective for high-temperature applications, often used in power generation and cooling devices.
[0042] In an embodiment, the base unit 102 can be attached below the product 101 via an attachment mechanism 116. The attachment mechanism 116 can selected from but not limited to any one of: magnetic attachments or mechanical locks. For instance, in case of mechanical locks, the base unit 102 can include one or more slots that can fit into one or more snaps provided at a bottom surface of the product 101. In some embodiments, the mechanical locks can include, without limitation, clips latches, screws, and the like, depending upon design of the product 101.
[0043] For another instance, in case of magnetic attachments, one or more first magnets can be integrated into the base unit 102 and one or more second magnets can be incorporated in the product 101 to create a secure connection. The magnetic attachments can facilitate quick and effortless attachment and detachment. Users can easily reposition or remove the base unit 102 as needed.
[0044] Further, the base unit 102 includes a heat sink 108 attached to the at least one peltier element 106. The heat sink 108 is configured to improve heat dissipation during the heat transfer. The heat sink 108 can be selected from passive heat sink or inactive heat sink, fin-type heat sinks, without any limitations. In a preferred embodiment, fin-type heat sinks can be used. The heat sink 108 can include fins 120 to increase a surface area of the heat sink 108 to improve heat dissipation. Furthermore, the base unit 102 includes a fan unit 110 integrally coupled to the heat sink 108. The fan unit 110 is configured to direct airflow towards the heat sink 108 to enhance efficiency of the system 100. In an embodiment, the fan unit 110 can include one or more fans 124 (collectively referred as “fans 124” hereinafter), where each of the fans 124 can be configured at each corner of the heat sink 108. In another embodiment, the fans 124 can be configured at any other position apart from the corner of the heat sink 108. The positioning of the fans 124 help in increasing the amount of air passing over the fins 120 of the heat sink 108, thereby improving the heat transfer from the heat sink 108 to the airflow. By positioning the fans 124 at each corner, the airflow is maximized, allowing for better cooling performance. This configuration can help prevent hot spots on the heat sink 108, ensuring even temperature distribution. In an embodiment, the fan unit 110 may include various types of the fans 124, such as axial fans or centrifugal fans, depending on the design requirements. The fans 124 can be oriented to either blow air towards the heat sink 108 (for cooling) or draw air away from it (for heating), depending on the specific requirements of the system 100.
[0045] In an embodiment, the system 100 includes a sensing unit 112 operably coupled to the base unit 102. The sensing unit 112 is configured to sense and monitor temperature data of the product 101. The sensing unit 112 can include one or more sensors (collectively referred as “sensors” hereinafter) configured to sense the temperature data of the product 101. The sensors can be selected from but not limited to a group comprising: temperature sensors, thermocouples, thermo resistors, Resistance Temperature Detectors (RTDs), Digital Temperature sensors, and Infrared temperature sensors. In a preferred embodiment, the temperature sensors can be used.
[0046] Moreover, the system 100 includes a control unit 114 communicably coupled to the sensing unit 112. The control unit 114 may comprise one or more processor(s) (interchangeably referred to as processor 202, hereinafter), a memory and one or more interface(s). The one or more processors may be implemented as one or more microprocessors, microcomputers, microcontrollers, edge or fog microcontrollers, digital signal processors, central processing units, logic circuitries, and/or any devices that process data, based on operational instructions. Among other capabilities, the processor) may be configured to fetch and execute computer-readable instructions stored in a memory of the system 100. The memory may be configured to store one or more computer-readable instructions or routines in a non-transitory computer readable storage medium, which may be fetched and executed to collect temperature data from the sensing unit 112 to control temperature of the product 101. The memory may comprise any non-transitory storage device including, for example, volatile memory such as Random Access Memory (RAM), or non-volatile memory such as Erasable Programmable Read-Only Memory (EPROM), flash memory, and the like.
[0047] In an embodiment, the system 100 may also include the one or more interface(s). The interface(s) may include a variety of interfaces, for example, interfaces for data input and output devices referred to as I/O devices, storage devices, and the like. The interface(s) may facilitate communication of the system 100 with various components coupled to the system 100. In an embodiment, the interface(s) may include a user interface 118 configured to allow the user to set the desired temperature for the product 101 either through physical interface configured on the base unit (102) or remotely via an Internet of Things (IOT) device. The physical interface can be selected from but not limited to a display screen, a temperature set button, a toggle switch, and the like. In an embodiment, the IOT device can be any user devices with smartphone application (app) which can be in communication with the system, or a web interface that allows the user to access the system 100 from any internet connected devices.
[0048] In an embodiment, the control unit 114 can be equipped with a communication module equipped Wi-Fi and/or Bluetooth capabilities, enabling it to connect to local networks or directly to the user devices. The communication module can synchronize data with cloud services, thereby allowing the user to control the system 100 remotely and store the historical temperature data. In some embodiments, the system 114 can also be integrated with smart home assistant systems such as Amazon Alexa, Google assistant, and the like. The user can control the temperature using voice commands provided to the smart home assistant systems.
[0049] In an embodiment, the processors are configured to process the received temperature data. Moreover, the processors are configured to adjust the electric current supplied to the at least one peltier element 106 and a speed of the fan unit 110, in response to a desired temperature set by a user.
[0050] In an implementation, when the user sets the desired temperature, a side of the at least one peltier element 106 in direct or indirect contact with the product 101 either absorb heat or loses heat to rapidly cool or heat up the product 101, based on the adjustment of the electric current supplied to the at least one peltier element 106 by the control unit 114. For example, for cooling operation, when the desired temperature set by the user is below the monitored temperature, the control unit 114 can adjust the electric current in a first direction, causes a side of the peltier element 106 in direct or indirect contact with the product 101 to absorb heat to rapidly lower the temperature inside and/or of the product 101. Here, the first direction refers to direction towards increasing electric current flow. The side of the peltier element 106 in direct or indirect contact with the product 101 can become cold and other side can become hot to dissipate heat to an environment. The cold side then absorb heat from the product 101, causing its temperature to drop rapidly. As the temperature of the product 101 approaches the desired temperature, the control unit 114 can continuously adjust the electric current. This dynamic adjustment can help maintain the desired temperature, preventing overcooling or temperature fluctuations.
[0051] Similarly, for heating operation, when the desired temperature set by the user is above the monitored temperature, the control unit 114 can adjust the electric current in a second direction, reverse of the first direction. This change in direction causes the operation of the Peltier element to reverse .i.e. causes the side of the peltier element 106 in direct or indirect contact with the product 101 to lose heat to rapidly increase the temperature inside and/or of the product 101. Here, the second direction refers to a direction opposite to the first direction. When the current flows in the opposite direction, the side of the peltier element 106 that is in direct or indirect contact with the product 101 becomes hot, while the other side cools down. The hot side can transfer the heat to the product 101, causing it to absorb this heat and rapidly increase its temperature. This effect leverages the Peltier effect, where heat flow direction is determined by the current direction. The system 100 can effectively transfer the heat to the product 101, quickly raising its temperature to reach the desired temperature set by the user. This capability is particularly useful for applications where quick heating is required, such as in water bottles, kettle, food warmers or temperature-sensitive equipment, without limitations.
[0052] As the temperature of the product 101 approaches the desired level, the control unit 114 can continually adjust the electric current. This dynamic control ensures that the product 101 can reach and maintain the desired temperature without overshooting.
[0053] In some embodiments, the system 100 can include a Light Emitting Device (LED) which can emit light when the desired temperature set by the user is achieved by the product 101.
[0054] In an embodiment, the system 100 can include the power source to provide electric energy or electric current to the peltier element 106 and the fan unit 110. The power source can be selected from but not limited to Alternate Current (AC) power adapter, Direct Current (DC) power supply, rechargeable battery, solar panel, power bank, and the like. In a preferred embodiment, the power source can be selected as the rechargeable battery capable of supporting multiple heating and cooling cycles per charge.
[0055] In another aspect, the present disclosure pertains to a base unit 102 for the system 100 to control temperature of the product 101. The base unit 102 is detachably attached to the product 101. The base unit 102 includes at least one peltier element 106 in thermal direct or indirect contact with the product 101. The peltier element 106 is configured to enable rapid cooling or heating of the product 101 by facilitating heat transfer with the product 101, based on application of an electric current provided by a power source. Further, the base unit 102 includes a heat sink 108 attached to the peltier element 106. The heat sink 108 is configured to improve heat dissipation during the heat transfer. Furthermore, the base unit 102 includes a fan unit 110 integrally coupled to the heat sink 108. The fan unit 110 is configured to direct airflow towards the heat sink 108 to enhance efficiency of the system 100.
Experimental Results:
[0056] In an exemplary embodiment, in a first experimental set-up, the product as the water bottle containing water is used for experimental purpose. 500 ml of water was taken to test performance of the system. The specifications of the components of the system were chosen as below:
Insulation: Foam Insulation
Medium Material: Aluminium baseplate fused with SS wall.
Heating and Cooling Element Specifications: 12V and 2A
Heat Sink Specifications: 60*60*20 and material is Aluminium
Cooling Fan Specifications: 60*60*25 and the voltage is 12V DC and the current would be 0.18A
[0057] The results achieved by the second experimental set-up are shown in below table 1.
Ambient Temperature Time Taken Water volume Final Temperature Temperature Difference
25 40 500 18 7
25 42 500 19 7
26 50 500 17.8 7.2
26 50 500 20.4 6.6
26 55 500 17.5 7.5

Table 1: Experimental results achieved using a first experimental set-up

[0058] It has been observed that the average temperature difference is 7.06 degrees and the average time take to achieve this difference is 47.4 minutes thus giving temperature drop at the rate of 0.15 degrees per minute or it takes approximately 7 minutes to bring down the temperature by 1 degree.
[0059] In a second experimental set-up, the specifications of the components of the system were chosen as below:
Insulation: Double wall Insulation
Medium Material: SS container with Aluminium central protrusion
Heating and Cooling Element Specifications: 12V and 2A
Heat Sink Specifications: 60*60*20 and material is Aluminium
Cooling Fan Specifications: 60*60*25 and the voltage is 12V DC and the current would be 0.18A.
[0060] The results achieved by the second experimental set-up are shown in below table 2.
Ambient Temperature Time Taken Water volume Final Temperature Temperature Difference
25 27 500 18 7
25 28 500 19 7
24 30 500 17.8 7.2
26 33 500 20.4 6.6
26 32 500 17.5 7.5

Table 2: Experimental results achieved using a second experimental set-up

[0061] It has been observed that the average temperature difference is 7.06 degrees and the average time take to achieve this difference is 30 minutes thus giving temperature drop at the rate of 0.235 degrees per minute or it takes 4.3 minutes to bring down the temperature by 1 degree.
[0062] In a third experiment, the specifications of the components of the system were chosen as below:
Insulation: Double wall Insulation
Medium Material: Aluminium Container
Heating and Cooling Element Specifications: 12V and 2A
Heat Sink Specifications: 60*60*20 and material is Aluminium
Cooling Fan Specifications: 60*60*25 and the voltage is 12V DC and the current would be 0.18A
[0063] The results achieved by the second experimental set-up are shown in below table 3.

Ambient Temperature Time Taken Water volume Final Temperature Temperature Difference
25 15 500 18 7
26 15 500 19 7
25 14 500 17.8 7.2
27 13 500 20.4 6.6
24 15 500 17.5 7.5

Table 3: Experimental results achieved using a third experimental set-up
[0064] It has been observed that the average temperature difference is 7.06 degrees and the average time take to achieve this difference is 14.4 minutes thus giving temperature drop at the rate of 0.5 degrees per minute or it takes 2 minutes to bring down the temperature by 1 degree.
[0065] Thus, above mentioned experimental results show that the system 100 is capable of controlling temperature with efficiency approximately 76.5% in reasonable response time.
[0066] FIG. 2 illustrates a block diagram of a proposed method for controlling a temperature of a product, in accordance with an embodiment of the present disclosure.
[0067] At block 202, the method 200 includes sensing and monitoring, by a sensing unit 112, temperature data of the product 101, wherein the product 101 is detachably attached to a base unit 102.
[0068] At block 204, the method 200 can include receiving, by a control unit 114, the sensed temperature data from the sensing unit 112.
[0069] At block 206, the method 200 can include processing, by the control unit 114, the received temperature data.
[0070] At block 208, the method 200 can include adjusting, by the control unit 114, an electric current supplied to at least one peltier element 106 associated with the base unit 102, and a speed of a fan unit 110 associated with the base unit 102, in response to a desired temperature set by a user, wherein when the user sets the desired temperature, a side of the at least one peltier element 106 in indirect contact with the product 101 either absorb heat or loses heat to rapidly cool or heat up the product 101, based on the adjustment of the electric current supplied to the at least one peltier element 106 by the control unit 114.
[0071] As can be appreciated, the proposed system 100 effectively overcomes the limitations of traditional heating and cooling solutions by integrating advanced thermoelectric technology, an optimized heat sink 108, and a fan unit 110 configuration into a compact and adaptable base unit. This innovative design not only facilitates rapid heating and cooling, enhancing response times significantly, but also ensures compatibility with a wide range of products, simplifying the manufacturing process. By minimizing the risks of overheating and undercooling, the system 100 guarantees consistent performance and reliability across various environments. Furthermore, its energy-efficient operation aligns with sustainability goals, reducing overall energy consumption. Ultimately, this comprehensive approach addresses existing shortcomings, making the proposed system 100 a superior choice for modern thermal management needs.
[0072] It will be apparent to those skilled in the art that the system 100 and a method 200 of the disclosure may be provided using some or all of the mentioned features and components without departing from the scope of the present disclosure. While various embodiments of the present disclosure have been illustrated and described herein, it will be clear that the disclosure is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions, and equivalents will be apparent to those skilled in the art, without departing from the scope of the disclosure, as described in the claims.

ADVANTAGES OF THE PRESENT DISCLOSURE
[0073] The present invention provides a system and a method for rapid temperature control of a product.
[0074] The present invention provides a system and a method that enables precise and adaptive temperature control for a wide range of applications, including liquid cooling and HVAC systems.
[0075] The present invention improve the reliability and lifespan of the product by preventing overheating and maintaining optimal operating temperatures.
[0076] The present invention provides a system that enhances efficiency and speed of temperature regulation in the product such as electronic components, and confined environments.
[0077] The present invention provides a system which controls the temperature of the product with reduced noise levels while maintaining high performance.
[0078] The present invention provides a universal base unit to control temperature of a product that can be easily adapted for multiple applications, thereby reduces product development cost.
 
, Claims:1. A system (100) to control temperature of a product (101), the system (100) comprising:
a base unit (102) detachably attached the product (101), wherein the base unit (102) comprises:
at least one peltier element (106) in direct or indirect thermal contact with the product (101), the at least one peltier element (106) is configured to enable rapid cooling or heating of the product (101) by facilitating heat transfer with the product (101), based on application of an electric current provided by a power source;
a heat sink (108) attached to the at least one peltier element (106), wherein the heat sink (108) is configured to improve heat dissipation during the heat transfer; and
a fan unit (110) integrally coupled to the heat sink (108), wherein the fan unit (110) is configured to direct airflow towards the heat sink (108) to enhance efficiency of the system (100);
a sensing unit (112) operably coupled to the base unit (102), wherein the sensing unit (112) is configured to sense and monitor temperature data of the product (101); and
a control unit (114) communicably coupled to the sensing unit (112), wherein the control unit (114) comprises one or more processors, and a memory coupled to the one or more processors, wherein the memory comprises processor-executable instructions, which on execution, causes the one or more processors to:
receive the sensed temperature data from the sensing unit (112);
process the received temperature data; and
adjust the electric current supplied to the at least one peltier element (106) and a speed of the fan unit (110), in response to a desired temperature set by a user,
wherein, when the user sets the desired temperature, a side of the at least one peltier element (106) in direct or indirect contact with the product (101) either absorbs heat or loses heat to rapidly cool or heat up the product (101), based on the adjustment of the electric current supplied to the at least one peltier element (106) by the control unit (114).

2. The system (100) as claimed in claim 1, wherein when the desired temperature set by the user is below the monitored temperature, the control unit (114) adjusts the electric current in a first direction, which causes the side of the at least one peltier element (106) in direct or indirect contact with the product (101) to absorb heat to rapidly lower the temperature inside and/or of the product (101).

3. The system (100) as claimed in claim 1, wherein when the desired temperature set by the user is above the monitored temperature, the control unit (114) adjusts the electric current in a second direction, reverse of the first direction, which causes the side of the at least one peltier element (106) in direct or indirect contact with the product (101) to lose heat to rapidly increase the temperature inside and/or of the product (101).

4. The system (100) as claimed in claim 1, wherein the base unit (102) is attached below the product (101) via an attachment mechanism (116), wherein the attachment mechanism (116) is selected from any one of: magnetic attachments or mechanical locks.

5. The system (100) as claimed in claim 1, wherein the sensing unit (112) comprises one or more sensors to sense the temperature data of the product (101), wherein the one or more sensors are selected from a group comprising: temperature sensors, thermocouples, thermo resistors, Resistance Temperature Detectors (RTDs), Digital Temperature sensors, and Infrared temperature sensors.

6. The system (100) as claimed in claim 1, wherein the heat sink (108) comprises fins (120) to increase a surface area of the heat sink (108) to improve heat dissipation.
7. The system (100) as claimed in claim 1, wherein the system comprises a user interface (118) configured to allow the user to set the desired temperature for the product (101) either through physical interface configured on the base unit (102) or remotely via an Internet of Things (IOT) device.

8. The system (100) as claimed in claim 1, wherein the product (101) is selected from a group consisting of: a water bottle, a kettle, portable mixers, mini freezers, food warmers, portable cooling devices, and other electronic appliances.

9. A base unit (102) for the system (100) to control temperature of the product (101), the base unit (102) detachably attached to the product (101), wherein the base unit (102) comprising:
at least one peltier element (106) in thermal direct or indirect contact with the product (101), the at least one peltier element (106) is configured to enable rapid cooling or heating of the product (101) by facilitating heat transfer with the product (101), based on application of an electric current provided by a power source;
a heat sink (108) attached to the at least one peltier element (106), wherein the heat sink (108) is configured to improve heat dissipation during the heat transfer; and
a fan unit (110) integrally coupled to the heat sink (108), wherein the fan unit (110) is configured to direct airflow towards the heat sink (108) to enhance efficiency of the system (100).

10. A method (200) for controlling temperature of a product (101), the method (200) comprising:
sensing and monitoring (202), by a sensing unit (112), temperature data of the product, wherein the product (101) is detachably attached to a base unit (102);
receiving (204), by a control unit (114), the sensed temperature data from the sensing unit (112);
processing (206), by the control unit (114), the received temperature data;
adjusting (208), by the control unit (114), an electric current supplied to at least one peltier element (106) associated with the base unit (102), and a speed of a fan unit (110) associated with the base unit (102), in response to a desired temperature set by a user,
wherein, when the user sets the desired temperature, a side of the at least one peltier element (106) in direct or indirect contact with the product (101) either absorb heat or loses heat to rapidly cool or heat up the product (101), based on the adjustment of the electric current supplied to the at least one peltier element (106) by the control unit (114).