Cooler Unit, Semiconductor Device And Method For Manufacturing A Cooler Unit

Abstract: A cooler unit (1) for liquid cooling of a power module (30) comprises at least one insert (10) that includes an upper part (15) and a lower part (16) and that is configured to be coupled to the power module (30) with the upper part (15). The cooler unit (1) further comprises a housing (20) that limits an internal flow channel (27) for a coolant and that comprises at least one recess (21) which penetrates a wall (25) of the housing (20) up to the flow channel (27) and which is configured in coordination with the at least one insert (10) geometrically, wherein the at least one insert (10) comprises copper and is arranged inside the recess (21) and laser welded to the housing (20) such that during operation the coolant flows through the flow channel (27) and around the lower part (16) of the at least one insert (10).

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