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Enclosure

Abstract: The present disclosure relates to an enclosure for an electric device in a high voltage electric field, the enclosure comprising at least one top element and at least one corresponding bottom element extending circumferentially from a centre portion, wherein the top and the bottom elements are plate-like elements disposed substantially parallel to each other at a predetermined distance to provide a space therebetween. The top and bottom elements are each electrically connected at one end at the centre portion, and in electrical contact at respective circumferential ends to form at least a portion of the enclosure. The enclosure is at least partially constructed of a conductive material. At least two slots are provided in the enclosure extending from the centre portion to a circumference to separate different portions of the enclosure.

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
04 October 2024
Publication Number
41/2024
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

HITACHI ENERGY LTD
Brown-Boveri-Strasse 5 8050 Zürich

Inventors

1. ERIKSSON, Goran
Frejagatan 8 B 72335 Västerås

Specification

Documents

Application Documents

# Name Date
1 202447075174-STATEMENT OF UNDERTAKING (FORM 3) [04-10-2024(online)].pdf 2024-10-04
2 202447075174-REQUEST FOR EXAMINATION (FORM-18) [04-10-2024(online)].pdf 2024-10-04
3 202447075174-PROOF OF RIGHT [04-10-2024(online)].pdf 2024-10-04
4 202447075174-PRIORITY DOCUMENTS [04-10-2024(online)].pdf 2024-10-04
5 202447075174-FORM 18 [04-10-2024(online)].pdf 2024-10-04
6 202447075174-FORM 1 [04-10-2024(online)].pdf 2024-10-04
7 202447075174-DRAWINGS [04-10-2024(online)].pdf 2024-10-04
8 202447075174-DECLARATION OF INVENTORSHIP (FORM 5) [04-10-2024(online)].pdf 2024-10-04
9 202447075174-COMPLETE SPECIFICATION [04-10-2024(online)].pdf 2024-10-04
10 202447075174-FORM-26 [05-10-2024(online)].pdf 2024-10-05
11 202447075174-FORM 3 [05-03-2025(online)].pdf 2025-03-05