We Claim:

1. A flow inverter (1) for a coolant substance (18) for a power semiconductor component (16) with at least two power semiconductor modules (17) and a cooling chamber, comprising

- a first plate (2) extending along a main extension plane of the flow inverter (1),

- a second plate (3) extending along the main extension plane,

- a first wall (4) provided on the first plate (2) and the second plate (3) from a first main side of the flow inverter (1), and

- a second wall (5) provided on the first plate (2) and the second plate (3) from a second main side of the flow inverter (1) opposite the first main side, wherein

- the first plate (2) is provided next to the second plate (3) ,

- at least one first recess (6) is provided between the first plate (2) and the second plate (3), and

- at least one second recess (7) is provided between the first plate (2) and the second plate (3).

2. The flow inverter (1) according to claim 1, wherein

- the at least one first recess (6) is provided in a central region (12) of the flow inverter (1), and

- the at least one second recess (7) is provided in at least one side region (13) of the flow inverter (1).

3. The flow inverter (1) according to any of claims 1 or 2, wherein the first plate (2) and the second plate (3) extend parallel to one another.
4. The flow inverter (1) according to any of claims 1 to 3, wherein

- the first wall (4) completely extends along a width of the first plate (2), and

- the second wall (5) completely extends along a width of the second plate (3).

5. The flow inverter (1) according to any of claims 1 to 3, wherein at least one of

- the first wall (4) has a first curved shape in plan view and an outer surface of the first curved shape points in direction of the second plate (3), and

- the second wall (5) has a second curved shape in plan view, and an outer surface of the second curved shape points in the direction of the first plate (2).

6. The flow inverter (1) according to any of claims 1 to 5, wherein two second recesses (7) are provided between the first plate (2) and the second plate (3) in two opposite side regions (13) of the flow inverter (1).

7. The flow inverter (1) according to claim 6, wherein the first recess (6) is provided between the two second recesses (7) .

8. The flow inverter (1) according to any of claims 1 to 7, wherein the first wall (4) and the second wall (5) at least partly overlap with one another in plan view delimiting the first recess (6) and the at least one second recess (7) at least partly.

9. The flow inverter (1) according to any of claims 1 to 8, wherein
- the first recess (6) is provided on a side of the first wall (4) facing the first plate (2).

- the at least one second recess (7) is provided on a side of the first wall (4) facing the second plate (3).

10. A power semiconductor component (16), comprising

- at least two power semiconductor modules (17), each being connected to a respective cooling structure (21), and

- a cooling chamber having an inlet port (19) and an outlet port (20), wherein

- the cooling chamber is adapted for a flow direction (FD) of a coolant substance (18) within the cooling chamber from the inlet port (19) to the outlet port (20),

- each of the at least two cooling structures (21) are provided within the cooling chamber consecutively in direction of the flow direction (FD),

- the cooling chamber comprises a flow inverter (1) according to any of claims 1 to 9 being provided between two of the at least two cooling structures (21) .