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Metal Substrate Structure And Method Of Attaching A Terminal To A Metal Substrate Structure For A Semiconductor Power Module And Semiconductor Power Module

Abstract: A method for attaching a terminal (4) to a metal substrate structure (3) for a semiconductor power module (10) comprises providing at least one terminal (4) and providing the metal substrate structure (3) with a metal top layer (17), a metal bottom layer (19) and an isolating resin layer (18) arranged between the metal top layer (17) and the metal bottom layer (19). The method further comprises coupling the at least one terminal (4) to the metal top layer (17) of the metal substrate structure (3) by means of laser welding with a laser beam (6).

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
21 May 2024
Publication Number
22/2024
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

HITACHI ENERGY LTD
Brown-Boveri-Strasse 5 8050 Zürich

Inventors

1. GUILLON, David
Rempen 13 8857 Vorderthal
2. BAYER, Martin
Hausmattweg 24 5036 Oberentfelden
3. ROESCH, Andreas
Ortsstrasse 27 79730 Murg
4. SALVATORE, Giovanni
Via cascino 5c/2 34170 Gorizia

Specification

Documents

Application Documents

# Name Date
1 202447039662-STATEMENT OF UNDERTAKING (FORM 3) [21-05-2024(online)].pdf 2024-05-21
2 202447039662-REQUEST FOR EXAMINATION (FORM-18) [21-05-2024(online)].pdf 2024-05-21
3 202447039662-PROOF OF RIGHT [21-05-2024(online)].pdf 2024-05-21
4 202447039662-PRIORITY DOCUMENTS [21-05-2024(online)].pdf 2024-05-21
5 202447039662-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [21-05-2024(online)].pdf 2024-05-21
6 202447039662-FORM 18 [21-05-2024(online)].pdf 2024-05-21
7 202447039662-FORM 1 [21-05-2024(online)].pdf 2024-05-21
8 202447039662-DRAWINGS [21-05-2024(online)].pdf 2024-05-21
9 202447039662-DECLARATION OF INVENTORSHIP (FORM 5) [21-05-2024(online)].pdf 2024-05-21
10 202447039662-COMPLETE SPECIFICATION [21-05-2024(online)].pdf 2024-05-21
11 202447039662-FORM-26 [09-07-2024(online)].pdf 2024-07-09
12 202447039662-FORM 3 [23-09-2024(online)].pdf 2024-09-23