Abstract: A method for attaching a terminal (4) to a metal substrate structure (3) for a semiconductor power module (10) comprises providing at least one terminal (4) and providing the metal substrate structure (3) with a metal top layer (17), a metal bottom layer (19) and an isolating resin layer (18) arranged between the metal top layer (17) and the metal bottom layer (19). The method further comprises coupling the at least one terminal (4) to the metal top layer (17) of the metal substrate structure (3) by means of laser welding with a laser beam (6).
| # | Name | Date |
|---|---|---|
| 1 | 202447039662-STATEMENT OF UNDERTAKING (FORM 3) [21-05-2024(online)].pdf | 2024-05-21 |
| 2 | 202447039662-REQUEST FOR EXAMINATION (FORM-18) [21-05-2024(online)].pdf | 2024-05-21 |
| 3 | 202447039662-PROOF OF RIGHT [21-05-2024(online)].pdf | 2024-05-21 |
| 4 | 202447039662-PRIORITY DOCUMENTS [21-05-2024(online)].pdf | 2024-05-21 |
| 5 | 202447039662-NOTIFICATION OF INT. APPLN. NO. & FILING DATE (PCT-RO-105-PCT Pamphlet) [21-05-2024(online)].pdf | 2024-05-21 |
| 6 | 202447039662-FORM 18 [21-05-2024(online)].pdf | 2024-05-21 |
| 7 | 202447039662-FORM 1 [21-05-2024(online)].pdf | 2024-05-21 |
| 8 | 202447039662-DRAWINGS [21-05-2024(online)].pdf | 2024-05-21 |
| 9 | 202447039662-DECLARATION OF INVENTORSHIP (FORM 5) [21-05-2024(online)].pdf | 2024-05-21 |
| 10 | 202447039662-COMPLETE SPECIFICATION [21-05-2024(online)].pdf | 2024-05-21 |
| 11 | 202447039662-FORM-26 [09-07-2024(online)].pdf | 2024-07-09 |
| 12 | 202447039662-FORM 3 [23-09-2024(online)].pdf | 2024-09-23 |