Power Module And Method For Producing A Power Module

Abstract: According to an embodiment, the power module (100) comprises a power semiconductor device (1) and a connection element (2) for electrically connecting the power semiconductor device. Furthermore, the arrangement comprises a sensing element (3) for measuring a measurand. A bond section (21) of the connection element is bonded to and electrically connected with the power semiconductor device. The sensing element is mounted on the connection element and spaced from the bond section.

Patent Information

Application #

Filing Date

13 November 2024

Publication Number

47/2024

Publication Type

INA

Invention Field

PHYSICS

Status

Email

Parent Application

Applicants

HITACHI ENERGY LTD

Brown-Boveri-Strasse 5 8050 Zürich

Inventors

1. SANTOLARIA, Lluis

Rosengasse 5 4600 Olten

2. MALEKI, Milad

Weinbergstr. 45 5417 Untersiggenthal

Specification

Documents

Application Documents

#	Name	Date
1	202447087657-STATEMENT OF UNDERTAKING (FORM 3) [13-11-2024(online)].pdf	2024-11-13
2	202447087657-REQUEST FOR EXAMINATION (FORM-18) [13-11-2024(online)].pdf	2024-11-13
3	202447087657-PROOF OF RIGHT [13-11-2024(online)].pdf	2024-11-13
4	202447087657-FORM 18 [13-11-2024(online)].pdf	2024-11-13
5	202447087657-FORM 1 [13-11-2024(online)].pdf	2024-11-13
6	202447087657-DRAWINGS [13-11-2024(online)].pdf	2024-11-13
7	202447087657-DECLARATION OF INVENTORSHIP (FORM 5) [13-11-2024(online)].pdf	2024-11-13
8	202447087657-COMPLETE SPECIFICATION [13-11-2024(online)].pdf	2024-11-13
9	202447087657-FORM-26 [14-11-2024(online)].pdf	2024-11-14
10	202447087657-FORM 3 [29-04-2025(online)].pdf	2025-04-29