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Power Semiconductor Device And Production Method

Abstract: In at least one embodiment, the power semiconductor device (1) comprises: - a semiconductor body (2) having a source region (21) of a first conductivity type and a well region (22) of a second conductivity type different from the first conductivity type, and the well region (22) comprises a channel region (220) starting directly at the source region (21), and - a gate insulator (4) directly between the semiconductor body (2) and a gate electrode (31), wherein the gate insulator (4) has a non-uniform gate dielectric constant profile along the channel region (220), such that a relative dielectric constant (eox) of the gate insulator (4) is lowest in a first section (61) of the channel region (220) remote from the source region (21).

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
11 January 2024
Publication Number
06/2024
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

HITACHI ENERGY LTD
Brown-Boveri-Strasse 5 8050 Zürich

Inventors

1. GUPTA, Gaurav
Martha-Ringierstrasse 7 5600 Lenzburg
2. DE-MICHIELIS, Luca
Buchserstrasse 10 5000 Aarau
3. VITALE, Wolfgang Amadeus
Aeschbachweg 12 5000 Aarau

Specification

Documents

Application Documents

# Name Date
1 202447002100-STATEMENT OF UNDERTAKING (FORM 3) [11-01-2024(online)].pdf 2024-01-11
2 202447002100-PROOF OF RIGHT [11-01-2024(online)].pdf 2024-01-11
3 202447002100-PRIORITY DOCUMENTS [11-01-2024(online)].pdf 2024-01-11
4 202447002100-FORM 18 [11-01-2024(online)].pdf 2024-01-11
5 202447002100-FORM 1 [11-01-2024(online)].pdf 2024-01-11
6 202447002100-DRAWINGS [11-01-2024(online)].pdf 2024-01-11
7 202447002100-DECLARATION OF INVENTORSHIP (FORM 5) [11-01-2024(online)].pdf 2024-01-11
8 202447002100-COMPLETE SPECIFICATION [11-01-2024(online)].pdf 2024-01-11
9 202447002100-FORM-26 [13-02-2024(online)].pdf 2024-02-13
10 202447002100-FORM 3 [21-06-2024(online)].pdf 2024-06-21