Abstract: According to an embodiment, the semiconductor device (100) comprises a semiconductor body (1) with a first side (10) and a second side (20) opposite to the first side. The semiconductor device further comprises a first thyristor structure (I) and a second thyristor structure (II). The second thyristor structure is arranged laterally beside the first thyristor structure. Each of the first and the second thyristor structure comprises a first base region (11a, 11b) at the first side and a gate electrode (1a, 1b) on the first side adjoining the assigned first base region. The first base regions of the two thyristor structures are regions of the semiconductor body and are of the same conductivity type. The gate electrodes of the thyristor structures are individually and independently electrically contactable.
| # | Name | Date |
|---|---|---|
| 1 | 202447041980-STATEMENT OF UNDERTAKING (FORM 3) [30-05-2024(online)].pdf | 2024-05-30 |
| 2 | 202447041980-REQUEST FOR EXAMINATION (FORM-18) [30-05-2024(online)].pdf | 2024-05-30 |
| 3 | 202447041980-PROOF OF RIGHT [30-05-2024(online)].pdf | 2024-05-30 |
| 4 | 202447041980-PRIORITY DOCUMENTS [30-05-2024(online)].pdf | 2024-05-30 |
| 5 | 202447041980-FORM 18 [30-05-2024(online)].pdf | 2024-05-30 |
| 6 | 202447041980-FORM 1 [30-05-2024(online)].pdf | 2024-05-30 |
| 7 | 202447041980-DRAWINGS [30-05-2024(online)].pdf | 2024-05-30 |
| 8 | 202447041980-DECLARATION OF INVENTORSHIP (FORM 5) [30-05-2024(online)].pdf | 2024-05-30 |
| 9 | 202447041980-COMPLETE SPECIFICATION [30-05-2024(online)].pdf | 2024-05-30 |
| 10 | 202447041980-FORM-26 [09-07-2024(online)].pdf | 2024-07-09 |
| 11 | 202447041980-FORM 3 [21-10-2024(online)].pdf | 2024-10-21 |