Abstract: The present disclosure relates to a semiconductor device (1) comprising at least one epitaxial layer (2) made from a first semiconductor material comprising carbon and having a [0001] crystallographic axis. At least one implantation area (4) is formed at a sidewall (3a) of the epitaxial layer (2), wherein a normal direction of the sidewall (3a) is perpendicular to the [0001] crystallographic axis. At least one part of the epitaxial layer (2) has a reduced concentration of carbon vacancy (VC) with respect to the first semiconductor material of the at least one epitaxial layer (2) as-grown. The present disclosure further relates to a method for manufacturing a semiconductor device (1), wherein ions are implanted through at least one sidewall (3a) of at least one epitaxial layer (2).
| # | Name | Date |
|---|---|---|
| 1 | 202347079527-STATEMENT OF UNDERTAKING (FORM 3) [23-11-2023(online)].pdf | 2023-11-23 |
| 2 | 202347079527-PROOF OF RIGHT [23-11-2023(online)].pdf | 2023-11-23 |
| 3 | 202347079527-PRIORITY DOCUMENTS [23-11-2023(online)].pdf | 2023-11-23 |
| 4 | 202347079527-FORM 18 [23-11-2023(online)].pdf | 2023-11-23 |
| 5 | 202347079527-FORM 1 [23-11-2023(online)].pdf | 2023-11-23 |
| 6 | 202347079527-DRAWINGS [23-11-2023(online)].pdf | 2023-11-23 |
| 7 | 202347079527-DECLARATION OF INVENTORSHIP (FORM 5) [23-11-2023(online)].pdf | 2023-11-23 |
| 8 | 202347079527-COMPLETE SPECIFICATION [23-11-2023(online)].pdf | 2023-11-23 |
| 9 | 202347079527-FORM-26 [18-12-2023(online)].pdf | 2023-12-18 |
| 10 | 202347079527-FORM 3 [29-04-2024(online)].pdf | 2024-04-29 |