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Semiconductor Device Having A Reduced Concentration Of Carbon Vacancies And Its Manufacturing Method

Abstract: The present disclosure relates to a semiconductor device (1) comprising at least one epitaxial layer (2) made from a first semiconductor material comprising carbon and having a [0001] crystallographic axis. At least one implantation area (4) is formed at a sidewall (3a) of the epitaxial layer (2), wherein a normal direction of the sidewall (3a) is perpendicular to the [0001] crystallographic axis. At least one part of the epitaxial layer (2) has a reduced concentration of carbon vacancy (VC) with respect to the first semiconductor material of the at least one epitaxial layer (2) as-grown. The present disclosure further relates to a method for manufacturing a semiconductor device (1), wherein ions are implanted through at least one sidewall (3a) of at least one epitaxial layer (2).

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Notices, Deadlines & Correspondence

Patent Information

Application #
Filing Date
23 November 2023
Publication Number
51/2023
Publication Type
INA
Invention Field
ELECTRONICS
Status
Email
Parent Application

Applicants

HITACHI ENERGY LTD
Brown-Boveri-Strasse 5 8050 Zürich

Inventors

1. ALFIERI, Giovanni
Gugelweg 29 5103 Möriken
2. KNOLL, Lars
Höhenweg 1 5607 Hägglingen

Specification

Documents

Application Documents

# Name Date
1 202347079527-STATEMENT OF UNDERTAKING (FORM 3) [23-11-2023(online)].pdf 2023-11-23
2 202347079527-PROOF OF RIGHT [23-11-2023(online)].pdf 2023-11-23
3 202347079527-PRIORITY DOCUMENTS [23-11-2023(online)].pdf 2023-11-23
4 202347079527-FORM 18 [23-11-2023(online)].pdf 2023-11-23
5 202347079527-FORM 1 [23-11-2023(online)].pdf 2023-11-23
6 202347079527-DRAWINGS [23-11-2023(online)].pdf 2023-11-23
7 202347079527-DECLARATION OF INVENTORSHIP (FORM 5) [23-11-2023(online)].pdf 2023-11-23
8 202347079527-COMPLETE SPECIFICATION [23-11-2023(online)].pdf 2023-11-23
9 202347079527-FORM-26 [18-12-2023(online)].pdf 2023-12-18
10 202347079527-FORM 3 [29-04-2024(online)].pdf 2024-04-29