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Resin Composition, Diamine Compound, Cured Product, Multilayer Body, Method For Producing Cured Product, Method For Producing Multilayer Body, Method For Producing Semiconductor Device, And Semiconductor Device
Abstract: The present invention provides a resin composition containing: a resin that includes a specific repeating unit, has a group including an ethylenically unsaturated bond, and has a phenolic hydroxyl group content of 0.250 mmol/g or less; and a polymerizable compound that has an ethylenically unsaturated bond. The present invention also provides a cured product obtained by curing the resin composition, a multilayer body containing the cured product, a method for producing the cured product, a method for producing the multilayer body, a method for producing a semiconductor device involving the method for producing the cured product, a semiconductor device containing the cured product, and a diamine compound having a specific structure.
Notices, Deadlines & Correspondence
Patent Information
Applicants
FUJIFILM CORPORATION
Inventors
1. OGAWA Michihiro
2. NOZAKI Atsuyasu
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 202547088424-STATEMENT OF UNDERTAKING (FORM 3) [17-09-2025(online)].pdf | 2025-09-17 |
| 2 | 202547088424-REQUEST FOR EXAMINATION (FORM-18) [17-09-2025(online)].pdf | 2025-09-17 |
| 3 | 202547088424-PROOF OF RIGHT [17-09-2025(online)].pdf | 2025-09-17 |
| 4 | 202547088424-PRIORITY DOCUMENTS [17-09-2025(online)].pdf | 2025-09-17 |
| 5 | 202547088424-FORM 18 [17-09-2025(online)].pdf | 2025-09-17 |
| 6 | 202547088424-FORM 1 [17-09-2025(online)].pdf | 2025-09-17 |
| 7 | 202547088424-DECLARATION OF INVENTORSHIP (FORM 5) [17-09-2025(online)].pdf | 2025-09-17 |
| 8 | 202547088424-COMPLETE SPECIFICATION [17-09-2025(online)].pdf | 2025-09-17 |
| 9 | 202547088424-Proof of Right [18-09-2025(online)].pdf | 2025-09-18 |
| 10 | 202547088424-FORM-26 [18-09-2025(online)].pdf | 2025-09-18 |