A Novel Method Of Non Cyanide Based Silver Plating On Copper Substrate

Abstract: A novel method for silver plating on copper compounds comprises the steps of surface preparation of copper plates (98% purity) for better bonding by two stage process, one is mechanical cleaning and then chemical cleaning; immersion of the plates in a heated alkali solution for a duration of 5 minutes to remove various inorganic compounds followed by rinsing in demineralized water; acid pickling of the sample by dipping it in the picking solution containing 10% sulfuric acid (H2 SO4) for a duration of 30 – 45 seconds; dipping and hooking of the sample into an electrolyte bath solution at the cathode terminal, where the anode terminal is hooked with 99.9% pure silver bar; initial striking of the plate with silver for a short duration followed by normal silver plating for a suitable duration of 1 hour for having a plating thickness of 15 – 20 microns.

Patent Information

Application #

Filing Date

15 November 2019

Publication Number

21/2021

Publication Type

INA

Invention Field

CHEMICAL

Status

Email

kolkatapatent@Lsdavar.in

Parent Application

Patent Number

Legal Status

Grant Date

2021-12-30

Renewal Date

Applicants

BHARAT HEAVY ELECTRICALS LIMITED

REGIONAL OPERATIONS DIVISION (ROD), Plot No. 9/1, DJ Block 3rd Floor, Karunamoyee, Salt Lake, Kolkata 700 091, West Bengal, Registered Office at BHEL HOUSE, SIRI FORT, NEW DELHI-110049, INDIA

Inventors

1. DR. ASIT KUMAR MAITI

BHARAT HEAVY ELECTRICALS LIMITED, Vikasnagar, Hyderabad 500 093, Telangana, India

2. PRAVEEN KUMAR SINGH

BHARAT HEAVY ELECTRICALS LIMITED, Vikasnagar, Hyderabad 500 093, Telangana, India

3. RAGHUVEERA GANAPA

BHARAT HEAVY ELECTRICALS LIMITED, Vikasnagar, Hyderabad 500 093, Telangana, India

4. MITTAPALLY SRINIVAS

BHARAT HEAVY ELECTRICALS LIMITED, Vikasnagar, Hyderabad 500 093, Telangana, India

Specification

A novel method for silver plating on copper compounds comprises the steps of surface preparation of copper plates (98% purity) for better bonding by two stage process, one is mechanical cleaning and then chemical cleaning; immersion of the plates in a heated alkali solution for a duration of 5 minutes to remove various inorganic compounds followed by rinsing in demineralized water; acid pickling of the sample by dipping it in the picking solution containing 10% sulfuric acid (H2 SO4) for a duration of 30 – 45 seconds; dipping and hooking of the sample into an electrolyte bath solution at the cathode terminal, where the anode terminal is hooked with 99.9% pure silver bar; initial striking of the plate with silver for a short duration followed by normal silver plating for a suitable duration of 1 hour for having a plating thickness of 15 – 20 microns.

Documents

Application Documents

#	Name	Date
1	201931046564-STATEMENT OF UNDERTAKING (FORM 3) [15-11-2019(online)].pdf	2019-11-15
2	201931046564-PROOF OF RIGHT [15-11-2019(online)].pdf	2019-11-15
3	201931046564-POWER OF AUTHORITY [15-11-2019(online)].pdf	2019-11-15
4	201931046564-FORM 1 [15-11-2019(online)].pdf	2019-11-15
5	201931046564-FIGURE OF ABSTRACT [15-11-2019(online)].pdf	2019-11-15
6	201931046564-DRAWINGS [15-11-2019(online)].pdf	2019-11-15
7	201931046564-DECLARATION OF INVENTORSHIP (FORM 5) [15-11-2019(online)].pdf	2019-11-15
8	201931046564-COMPLETE SPECIFICATION [15-11-2019(online)].pdf	2019-11-15
9	201931046564-FORM 18 [06-12-2019(online)].pdf	2019-12-06
10	201931046564-FER.pdf	2021-10-18
11	201931046564-OTHERS [29-12-2021(online)].pdf	2021-12-29
12	201931046564-FER_SER_REPLY [29-12-2021(online)].pdf	2021-12-29
13	201931046564-COMPLETE SPECIFICATION [29-12-2021(online)].pdf	2021-12-29
14	201931046564-PatentCertificate30-12-2021.pdf	2021-12-30
15	201931046564-IntimationOfGrant30-12-2021.pdf	2021-12-30
16	201931046564-FORM 4 [26-07-2022(online)].pdf	2022-07-26
17	201931046564-RELEVANT DOCUMENTS [28-09-2023(online)].pdf	2023-09-28

Search Strategy

1	searchreportE_30-06-2021.pdf