Infrared Sensor

The infrared sensor in accordance with the present invention includes a pyroelectric element, an IC device, and a surface-mounted package. The IC device is configured to process an output signal of the pyroelectric element. The package is configured to house the pyroelectric element and the IC device. The package includes a package body and a package lid. The package lid is configured to transmit infrared rays to be detected by the pyroelectric element, and has electrical conductivity. The package body is provided in its surface with plural recessed parts arranged in tiers. The IC device is mounted on a bottom of the lower recessed part. The pyroelectric element is mounted on a bottom of the upper recessed part closer to the surface of the package body than the lower recessed part is, so as to extend across the lower recessed part and to be away from the IC device in a thickness direction thereof. The package body includes an output wiring configured to electrically connect an output terminal of the IC device to an external connection terminal. The package body includes a shielding member interposed between the pyroelectric element and the output wiring. The IC device has a specific part adapted in use to receive a ground potential or a constant potential. The shielding member is electrically connected to the specific part of the IC device.