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Method For Transferring Electrical Gridlines On A Lacquer Layer
Abstract: [0001] A method of simultaneously forming electrical circuitry and functional light structures on a curable lacquer layer deposited on a base substrate for use in an organic optoelectronic device. The method includes application of the curable lacquer layer on the base substrate. Thereafter a mating surface of a transfer substrate is contacted against the curable lacquer layer. The mating surface includes the electrical circuitry on a first portion and negative impressions of the functional light structures on a second portion. Thereafter, the mating surface is contacted against the curable lacquer layer, thereby enabling embedding at least a portion of the electrical circuitry in the curable lacquer layer and replication of the functional light structures onto the curable lacquer layer.
Notices, Deadlines & Correspondence
Patent Information
Applicants
MOSER BAER INDIA LIMITED
Inventors
1. WILJAN STOUWDAM
2. MATTHIJS BOS
Specification
Documents
Application Documents
| # | Name | Date |
|---|---|---|
| 1 | 1018-del-2011-GPA.pdf | 2011-12-12 |
| 2 | 1018-del-2011-Form-5.pdf | 2011-12-12 |
| 3 | 1018-del-2011-Form-3.pdf | 2011-12-12 |
| 4 | 1018-del-2011-Form-2.pdf | 2011-12-12 |
| 5 | 1018-del-2011-Form-1.pdf | 2011-12-12 |
| 6 | 1018-del-2011-Drawings.pdf | 2011-12-12 |
| 7 | 1018-del-2011-Description (Complete).pdf | 2011-12-12 |
| 8 | 1018-del-2011-Correspodence Others.pdf | 2011-12-12 |
| 9 | 1018-del-2011-Claims.pdf | 2011-12-12 |
| 10 | 1018-del-2011-Abstract.pdf | 2011-12-12 |