Sensor Device And Manufacturing Method Therefore

Abstract: The present invention relates to a sensor device, in particular the invention relates to an electronic sensor device formed within a groove of a substrate adapted such that in response to engagement with an analyte a signal response is provided. The invention also relates to a method of forming such a sensor device. The electronic sensor device comprises a substrate comprising at least one groove, said groove including a first face and a second face, said groove having a cross-sectional profile including at least a groove depth within the substrate and a groove width at a surface of said substrate. Said first face includes a first electrically non-insulating portion and said second face including a second electrically non-insulating portion wherein, within said profile, said first electrically non-insulating portion is electrically separated from said second electrically non-insulating portion. A detection medium is provided within said groove, arranged to contactingly engage said first and second electrically non- insulating portions, and adapted to be contactingly engaged by an analyte. Furthermore, said profile or said detection medium is adapted such that, in use, a signal response is provided comprising a first response phase and a subsequent second response phase in response to an engagement of the analyte with the detection medium.

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