Claims:1. An apparatus (400)comprising:
a printed circuit board (PCB) (300) having control components (305) mounted thereon;
a heat-dissipating device (200) having power components (105) mounted thereon, wherein the power components (105) are in thermal contact with the heat-dissipating device (200); and
electrical conductive strips (130) electrically connecting the control components (305) and the power components (105), wherein the power components (105) are external to the PCB (300).

2. The apparatus (400) as claimed in claim 1, wherein the control components (305) are interconnected through one or more conducting tracks embedded within the PCB (300) to form a control circuit.

3. The apparatus (400) as claimed in claim 2, wherein the control components (305), on operation, carry less current than the power components (105).

4. The apparatus (400) as claimed in claim 1, wherein the power components (105) comprise one or more power semiconductor devices.

5. The apparatus (400) as claimed in claim 1, wherein the electrical conductive strips (130) are plastic molded electrical conductive strips (130), and wherein the electrical conductive strips (130) are made from one of copper, aluminium, and brass.

6. The apparatus (400) as claimed in claim 1, wherein the power components (105) having one or more electrical terminals (120) soldered to the electrical conductive strips (130).

7. The apparatus (400) as claimed in claim 1, wherein the electrical conductive strips (130) electrically connect the one or more electrical terminals (120) of the power components (105) to the control components (305).

8. The apparatus (400) as claimed in claim 1, wherein the power components (105) are mounted onto the heat-dissipating device
(200) by using fasteners (215).

9. The apparatus (400) as claimed in claim 1, wherein the heat-dissipating device (200) is made from at least one thermally conducting material.

10. The apparatus (400) as claimed in claim 1, wherein the electrical conductive strips (130) are external to the PCB (300).

11. A method for thermally isolating and electrically connecting a printed circuit board (PCB) (300) and power components (105), the method comprising:
assembling the PCB (300) with the control components (305);
joining electrical terminals (120) of the power components (105) to electrical conductive strips (130);
mounting the power components (105) onto a heat-dissipating device (200), wherein the power components (105) are in thermal contact with the heat-dissipating device (200); and
electrically connecting the power components (105) and the control components (305) by the electrical conductive strips (130), wherein the power components (105) are external to the PCB (300).

12. The method as claimed in claim 11, wherein the electrical conductive strips (130) are plastic molded electrical conductive strips, and wherein the electrical conductive strips are made from one of copper, aluminium ,and brass .

13. The method as claimed in claim 11, wherein the control components (305) are interconnected by one or more conducting tracks embedded within the PCB (300).

14. The method as claimed in claim 11, wherein the power components (105), on operation, carry high current than the control components (305).

15. The method as claimed in claim 11, wherein the joining comprises soldering the electrical terminals (120) of the power components (105) to the electrical conductive strips (130).
, Description:As Attached