[Class : 9] Semiconductor Packaging Platforms For Integrating Multiple Semiconductor Chips Into A Single Package; Semiconductor Packages, Namely, Semiconductor Dies And Interconnects; Multi Chip Semiconductor Packages; Semiconductor Chips; Semiconductor Wafers; Structured Semiconductor Wafers; Semiconductor Substrates For Semiconductor Packaging; Semiconductor Devices In The Nature Of Substrates For Semiconductor Packaging, Chips And Circuit Boards; Interposers For Semiconductor Packaging; Silicon Bridges For Semiconductor Packaging; Semiconductor Chip Sets. [Class : 40] Etching Of Semiconductor Wafers; Etching Of Integrated Circuits; Semiconductor Wafer Level Processing; Wafer Foundry Services, Namely, Custom Manufacture Of Semiconductor Wafers For Others; Custom Manufacture Of Semiconductor Packaging In The Nature Of Semiconductor Dies And Interconnects, Semiconductor Chip Housings And Semiconductor Integrated Circuit Modules; Integrated Circuit Packaging Processing In The Nature Of Manufacturing Services For Others; Semiconductor Packaging Processing In The Nature Of Manufacturing Services For Others; Custom Manufacture Of Semiconductor Substrates For Others; Substrate Foundry Services, Namely, Manufacturing Of Semiconductor Substrates For Others. [Class : 42] Technology Research And Development For Others In The Field Of Semiconductor Related Products; Integrated Circuit Design Services; Semiconductor Packaging Design Services; Semiconductor Substrate Design Services; Quality Control Inspection Of Semiconductors And Semiconductor Related Products; Testing Of Semiconductors And Semiconductor Related Products; Consulting Services With Respect To Semiconductor Packaging Technology, Namely, Consulting Regarding Semiconductor Packaging Design And Development; Design Services For Others In The Field Of Semiconductor Packaging; Consulting Services In The Field Of Semiconductor Electromechanical Engineering; Consulting Services In The Field Of Semiconductor Packaging And Semiconductor Testing.