[Class : 7] Semiconductor Manufacturing Machines And Systems; Uv Irradiation Machines For Use In Semiconductor Manufacturing Process; Machines For Adhering Surface Protection Tapes, Machines For Adhering Backside Protection Tape, Both Being For Use In Semiconductor Manufacturing Process; Machines For Releasing Surface Protection Tape, Machines For Releasing Backside Protection Tape, Both Being For Use In Semiconductor Manufacturing Process; Machines For Issuing And Adhering, For Reading, And For Writing Bar Code Label And Radio Frequency Identification (Rfid) Label, All Being For Use In Semiconductor Manufacturing Process; Semiconductor Wafer Processing Machines And Parts Thereof; Feeding Machines, Transferring Machines, And Storing Machines, All For Semiconductor Wafers; Machines For Exchanging Wafers Among Semiconductor Wafer Containers; Heating Machines, Pressurizing Machines For Processing Semiconductor Wafers; Frames For Use In Semiconductor Wafer Processing Steps; Storing Containers, Transferring Containers, And Transporting Containers, All For Semiconductor Wafers; Cutting Machines, And Punching Machines, Both Being For Use In Semiconductor Wafer Processing Tapes.[Class : 9] Bar Code Printers; Thermal Transfer Printers; Laser Printers; Ink Jet Printers; Thermal Printers; Printers.[Class : 16] Ink Ribbons For Printing; Adhesive Coated Paper; Adhesive Labels (Not Including Those Made Of Woven Fabrics); Heat Sensitive Adhesive Labels; Bar Code Labels, Rfid Labels; Bar Code Labels, Rfid Labels, Both Being For Physical Distribution Management; Bar Code Labels, Rfid Labels, Both Being For Production Management.[Class : 17] Plastic Basic Products; Plastic Films Coated With Adhesives, With Pressure Sensitive Adhesives, And With Adhesives/Pressure Sensitive Adhesives; Adhesive Tapes, Pressure Sensitive Adhesive Tapes, Adhesive Tapes/Pressure Sensitive Adhesive Tapes, All Being For Processing Semiconductors; Adhesive Tapes, Pressure Sensitive Adhesive Tapes, Adhesive Tapes/Pressure Sensitive Adhesive Tapes, All Being For Holding In Position Semiconductors; Processing Tapes For Processing Semiconductor Wafers; Adhesive Tapes For Surface Mounting/Laminating Semiconductor Chips; Heat Sensitive And Pressure Sensitive Adhesive Tapes/Heat Sensitive Adhesive Tapes For Use In Manufacturing Processes Of Electronic Parts Such As Semiconductor Wafers, Ceramic Capacitors, Etc.; Protection Tapes For Protecting Rear Surfaces Of Semiconductor Chips.