[Class : 7] Semiconductor Manufacturing Machines; Blade Dicing Machines, Laser Dicing Machines, Other Dicing Machines For Cutting Semi Conductor Wafer In The Form Of Tips; Grinding Machines For Use In Manufacture Of Semi Conductor; Ultraviolet Irradiation Apparatus, Electric Irradiation Apparatus Other Energy Line Irradiation Apparatus For Use In Manufacture Of Semi Conductors; Adhesive Equipment Of Protective Tapes For Semiconductor Chip Backs And Protective Tapes For Semiconductor Chip Surfaces For Use In The Manufacture Of Semi Conductors; Peeling Equipment Of Protective Tapes For Semi Conductor Chip Backs And Protective Tapes For Semi Conductor Chip Surfaces For Use In Manufacture Of Semi Conductor; Issuing Bar Code Labels, Rfid Labels For Use In Manufacture Of Semi Conductors And Labelers, Readers And Writing Device; Semi Conductor Wafer Processing Equipment And Parts Therefor; Semi Conductor Wafer Cleaning Equipment; Semi Conductor Wafer Supply Equipment, Transporters And Housing Equipment; Containers Of Semi Conductors Exchange Equipment; Heating Apparatus And Pressurized Apparatus For Semi Conductor Wafer Processing; Cutting, Blanking Equipments Of Tapes For Use In The Processing Of Semi Conductor Wafer; Self Labelers; Other Labelers.